JPH0473620B2 - - Google Patents
Info
- Publication number
- JPH0473620B2 JPH0473620B2 JP60011870A JP1187085A JPH0473620B2 JP H0473620 B2 JPH0473620 B2 JP H0473620B2 JP 60011870 A JP60011870 A JP 60011870A JP 1187085 A JP1187085 A JP 1187085A JP H0473620 B2 JPH0473620 B2 JP H0473620B2
- Authority
- JP
- Japan
- Prior art keywords
- stage
- distance
- probe
- semiconductor wafer
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1187085A JPS61171145A (ja) | 1985-01-25 | 1985-01-25 | 半導体装置の検査方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1187085A JPS61171145A (ja) | 1985-01-25 | 1985-01-25 | 半導体装置の検査方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61171145A JPS61171145A (ja) | 1986-08-01 |
JPH0473620B2 true JPH0473620B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1992-11-24 |
Family
ID=11789755
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1187085A Granted JPS61171145A (ja) | 1985-01-25 | 1985-01-25 | 半導体装置の検査方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61171145A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63261727A (ja) * | 1987-04-20 | 1988-10-28 | Tokyo Electron Ltd | 板状体の面歪み補正方法 |
US6337218B1 (en) | 1999-05-28 | 2002-01-08 | International Business Machines Corporation | Method to test devices on high performance ULSI wafers |
-
1985
- 1985-01-25 JP JP1187085A patent/JPS61171145A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS61171145A (ja) | 1986-08-01 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |