JPH0471342B2 - - Google Patents

Info

Publication number
JPH0471342B2
JPH0471342B2 JP58208891A JP20889183A JPH0471342B2 JP H0471342 B2 JPH0471342 B2 JP H0471342B2 JP 58208891 A JP58208891 A JP 58208891A JP 20889183 A JP20889183 A JP 20889183A JP H0471342 B2 JPH0471342 B2 JP H0471342B2
Authority
JP
Japan
Prior art keywords
image sensor
layer
resistance value
electrode
amorphous silicon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58208891A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60101940A (ja
Inventor
Tsutomu Ishida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ricoh Co Ltd
Original Assignee
Ricoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ricoh Co Ltd filed Critical Ricoh Co Ltd
Priority to JP58208891A priority Critical patent/JPS60101940A/ja
Publication of JPS60101940A publication Critical patent/JPS60101940A/ja
Publication of JPH0471342B2 publication Critical patent/JPH0471342B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/281—Auxiliary members
    • H10W72/283—Reinforcing structures, e.g. bump collars

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Wire Bonding (AREA)
JP58208891A 1983-11-07 1983-11-07 イメ−ジセンサ Granted JPS60101940A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58208891A JPS60101940A (ja) 1983-11-07 1983-11-07 イメ−ジセンサ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58208891A JPS60101940A (ja) 1983-11-07 1983-11-07 イメ−ジセンサ

Publications (2)

Publication Number Publication Date
JPS60101940A JPS60101940A (ja) 1985-06-06
JPH0471342B2 true JPH0471342B2 (enExample) 1992-11-13

Family

ID=16563833

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58208891A Granted JPS60101940A (ja) 1983-11-07 1983-11-07 イメ−ジセンサ

Country Status (1)

Country Link
JP (1) JPS60101940A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69117785T2 (de) * 1990-03-27 1997-02-06 Canon Kk Dünnschicht-Halbleiterbauelement
ATE143175T1 (de) * 1990-03-27 1996-10-15 Canon Kk Dünnschicht-halbleiterbauelement

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5772370A (en) * 1980-10-23 1982-05-06 Canon Inc Photoelectric converter

Also Published As

Publication number Publication date
JPS60101940A (ja) 1985-06-06

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