JPH0469427B2 - - Google Patents

Info

Publication number
JPH0469427B2
JPH0469427B2 JP58195644A JP19564483A JPH0469427B2 JP H0469427 B2 JPH0469427 B2 JP H0469427B2 JP 58195644 A JP58195644 A JP 58195644A JP 19564483 A JP19564483 A JP 19564483A JP H0469427 B2 JPH0469427 B2 JP H0469427B2
Authority
JP
Japan
Prior art keywords
electrode
gold
substrate
protruding
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58195644A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6086840A (ja
Inventor
Shuji Kondo
Isamu Kitahiro
Hiroshi Takahashi
Minoru Hirai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP58195644A priority Critical patent/JPS6086840A/ja
Publication of JPS6086840A publication Critical patent/JPS6086840A/ja
Publication of JPH0469427B2 publication Critical patent/JPH0469427B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10P72/74—
    • H10W72/012—
    • H10W72/01204—
    • H10W72/07236—
    • H10W72/07251—
    • H10W72/20—
    • H10W72/251—

Landscapes

  • Wire Bonding (AREA)
JP58195644A 1983-10-19 1983-10-19 半導体装置の製造方法 Granted JPS6086840A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58195644A JPS6086840A (ja) 1983-10-19 1983-10-19 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58195644A JPS6086840A (ja) 1983-10-19 1983-10-19 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS6086840A JPS6086840A (ja) 1985-05-16
JPH0469427B2 true JPH0469427B2 (enExample) 1992-11-06

Family

ID=16344597

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58195644A Granted JPS6086840A (ja) 1983-10-19 1983-10-19 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS6086840A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2674786B2 (ja) * 1988-07-06 1997-11-12 ローム株式会社 Ｉｃの実装方法および実装装置
TW223184B (enExample) * 1992-06-18 1994-05-01 Matsushita Electron Co Ltd

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4869471A (enExample) * 1971-12-22 1973-09-20
JPS57152147A (en) * 1981-03-16 1982-09-20 Matsushita Electric Ind Co Ltd Formation of metal projection on metal lead

Also Published As

Publication number Publication date
JPS6086840A (ja) 1985-05-16

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