JPH046907Y2 - - Google Patents

Info

Publication number
JPH046907Y2
JPH046907Y2 JP1986011143U JP1114386U JPH046907Y2 JP H046907 Y2 JPH046907 Y2 JP H046907Y2 JP 1986011143 U JP1986011143 U JP 1986011143U JP 1114386 U JP1114386 U JP 1114386U JP H046907 Y2 JPH046907 Y2 JP H046907Y2
Authority
JP
Japan
Prior art keywords
resin
motherboard substrate
sintered body
ceramic sintered
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1986011143U
Other languages
English (en)
Japanese (ja)
Other versions
JPS62123924U (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986011143U priority Critical patent/JPH046907Y2/ja
Publication of JPS62123924U publication Critical patent/JPS62123924U/ja
Application granted granted Critical
Publication of JPH046907Y2 publication Critical patent/JPH046907Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
JP1986011143U 1986-01-29 1986-01-29 Expired JPH046907Y2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986011143U JPH046907Y2 (enrdf_load_stackoverflow) 1986-01-29 1986-01-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986011143U JPH046907Y2 (enrdf_load_stackoverflow) 1986-01-29 1986-01-29

Publications (2)

Publication Number Publication Date
JPS62123924U JPS62123924U (enrdf_load_stackoverflow) 1987-08-06
JPH046907Y2 true JPH046907Y2 (enrdf_load_stackoverflow) 1992-02-25

Family

ID=30798089

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986011143U Expired JPH046907Y2 (enrdf_load_stackoverflow) 1986-01-29 1986-01-29

Country Status (1)

Country Link
JP (1) JPH046907Y2 (enrdf_load_stackoverflow)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1287694C (en) * 1988-08-01 1991-08-13 Ronald S. Charsky Composite dielectric structure for optimizing electrical performance in highperformance chip support packages
JP2787953B2 (ja) * 1989-08-03 1998-08-20 イビデン株式会社 電子回路基板
US6778398B2 (en) * 2002-10-24 2004-08-17 Koninklijke Philips Electronics N.V. Thermal-conductive substrate package
JP4661196B2 (ja) * 2004-07-27 2011-03-30 日立化成工業株式会社 低誘電率絶縁性樹脂組成物
JP4691921B2 (ja) * 2004-07-27 2011-06-01 日立化成工業株式会社 樹脂用特性調整剤及びそれを用いた特性調整化樹脂組成物
JP2015088752A (ja) * 2013-10-28 2015-05-07 サムソン エレクトロ−メカニックス カンパニーリミテッド． コア基板及びコア基板の製造方法
JP6189822B2 (ja) * 2014-11-28 2017-08-30 デンカ株式会社 窒化ホウ素樹脂複合体回路基板
JP6170486B2 (ja) * 2014-12-05 2017-07-26 デンカ株式会社 セラミックス樹脂複合体回路基板及びそれを用いたパワー半導体モジュール
EP4147845A4 (en) * 2020-05-15 2023-11-08 Denka Company Limited Composite and production method for composite

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4837405A (enrdf_load_stackoverflow) * 1971-09-14 1973-06-02
US4289719A (en) * 1976-12-10 1981-09-15 International Business Machines Corporation Method of making a multi-layer ceramic substrate

Also Published As

Publication number Publication date
JPS62123924U (enrdf_load_stackoverflow) 1987-08-06

Similar Documents

Publication Publication Date Title
EP0196865A2 (en) Electronic circuit substrates
US3852877A (en) Multilayer circuits
US3423517A (en) Monolithic ceramic electrical interconnecting structure
JPS62251136A (ja) 金属複合積層板
JPH046907Y2 (enrdf_load_stackoverflow)
JPS62126694A (ja) 電子回路用多層基板
JP3537620B2 (ja) 多層配線基板
GB2361811A (en) Insulating thick film composition, ceramic electronic device and apparatus using the same.
JP2955442B2 (ja) セラミックス回路基板の製造方法
CN109644567A (zh) 电路基板的制造方法
JP4077625B2 (ja) 低温焼成磁器組成物および低温焼成磁器の製造方法
JPH0664090A (ja) 銅張積層板及びその製造方法
JP4231316B2 (ja) セラミック配線基板の製造方法
JPH0350429B2 (enrdf_load_stackoverflow)
JP2803754B2 (ja) 多層電子回路基板
JPH0771840B2 (ja) 銅張積層板およびその製造法
KR20050086589A (ko) 다층 ｌｔｃｃ 및 ｌｔｃｃ―ｍ 기판상에 고전력 소자의향상된 온도 제어를 위한 방법 및 구조물
JPH01117086A (ja) 電子部品を実装した基板装置
JPH11251700A (ja) 銅メタライズ組成物及びそれを用いたガラスセラミック配線基板
JPH06305078A (ja) 積層板の製造法
JPH05267849A (ja) セラミックス多層回路基板の製造方法
JPS62106636A (ja) 炭化珪素質複合体からなる電子回路用基板
JPH02166793A (ja) 多層セラミック回路基板の製造方法
JP2780129B2 (ja) 複合焼結体とその製造法及び用途
JP4703208B2 (ja) 多層配線基板及びその製造方法