JPS62123924U - - Google Patents

Info

Publication number
JPS62123924U
JPS62123924U JP1114386U JP1114386U JPS62123924U JP S62123924 U JPS62123924 U JP S62123924U JP 1114386 U JP1114386 U JP 1114386U JP 1114386 U JP1114386 U JP 1114386U JP S62123924 U JPS62123924 U JP S62123924U
Authority
JP
Japan
Prior art keywords
resin
utility
model registration
substrate according
motherboard substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1114386U
Other languages
English (en)
Japanese (ja)
Other versions
JPH046907Y2 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986011143U priority Critical patent/JPH046907Y2/ja
Publication of JPS62123924U publication Critical patent/JPS62123924U/ja
Application granted granted Critical
Publication of JPH046907Y2 publication Critical patent/JPH046907Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
JP1986011143U 1986-01-29 1986-01-29 Expired JPH046907Y2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986011143U JPH046907Y2 (enrdf_load_stackoverflow) 1986-01-29 1986-01-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986011143U JPH046907Y2 (enrdf_load_stackoverflow) 1986-01-29 1986-01-29

Publications (2)

Publication Number Publication Date
JPS62123924U true JPS62123924U (enrdf_load_stackoverflow) 1987-08-06
JPH046907Y2 JPH046907Y2 (enrdf_load_stackoverflow) 1992-02-25

Family

ID=30798089

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986011143U Expired JPH046907Y2 (enrdf_load_stackoverflow) 1986-01-29 1986-01-29

Country Status (1)

Country Link
JP (1) JPH046907Y2 (enrdf_load_stackoverflow)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0269996A (ja) * 1988-08-01 1990-03-08 Internatl Business Mach Corp <Ibm> 電子回路基板
JPH0364984A (ja) * 1989-08-03 1991-03-20 Ibiden Co Ltd 電子回路基板
JP2006036922A (ja) * 2004-07-27 2006-02-09 Hitachi Chem Co Ltd 樹脂用特性調整剤及びそれを用いた特性調整化樹脂組成物
JP2006063297A (ja) * 2004-07-27 2006-03-09 Hitachi Chem Co Ltd 低誘電率絶縁性樹脂組成物
JP2006515712A (ja) * 2002-10-24 2006-06-01 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ 熱伝導性基板パッケージ
JP2015088752A (ja) * 2013-10-28 2015-05-07 サムソン エレクトロ−メカニックス カンパニーリミテッド． コア基板及びコア基板の製造方法
JP2016103611A (ja) * 2014-11-28 2016-06-02 デンカ株式会社 窒化ホウ素樹脂複合体回路基板
JP2016111171A (ja) * 2014-12-05 2016-06-20 デンカ株式会社 セラミックス樹脂複合体回路基板及びそれを用いたパワー半導体モジュール
JPWO2021230323A1 (enrdf_load_stackoverflow) * 2020-05-15 2021-11-18

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4837405A (enrdf_load_stackoverflow) * 1971-09-14 1973-06-02
JPS5373365A (en) * 1976-12-10 1978-06-29 Ibm Method of producing multilayer ceramic board

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4837405A (enrdf_load_stackoverflow) * 1971-09-14 1973-06-02
JPS5373365A (en) * 1976-12-10 1978-06-29 Ibm Method of producing multilayer ceramic board

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0269996A (ja) * 1988-08-01 1990-03-08 Internatl Business Mach Corp <Ibm> 電子回路基板
JPH0364984A (ja) * 1989-08-03 1991-03-20 Ibiden Co Ltd 電子回路基板
JP2006515712A (ja) * 2002-10-24 2006-06-01 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ 熱伝導性基板パッケージ
JP2006036922A (ja) * 2004-07-27 2006-02-09 Hitachi Chem Co Ltd 樹脂用特性調整剤及びそれを用いた特性調整化樹脂組成物
JP2006063297A (ja) * 2004-07-27 2006-03-09 Hitachi Chem Co Ltd 低誘電率絶縁性樹脂組成物
JP2015088752A (ja) * 2013-10-28 2015-05-07 サムソン エレクトロ−メカニックス カンパニーリミテッド． コア基板及びコア基板の製造方法
JP2016103611A (ja) * 2014-11-28 2016-06-02 デンカ株式会社 窒化ホウ素樹脂複合体回路基板
JP2016111171A (ja) * 2014-12-05 2016-06-20 デンカ株式会社 セラミックス樹脂複合体回路基板及びそれを用いたパワー半導体モジュール
JPWO2021230323A1 (enrdf_load_stackoverflow) * 2020-05-15 2021-11-18
WO2021230323A1 (ja) * 2020-05-15 2021-11-18 デンカ株式会社 複合体及び複合体の製造方法

Also Published As

Publication number Publication date
JPH046907Y2 (enrdf_load_stackoverflow) 1992-02-25

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