JPH0466181B2 - - Google Patents
Info
- Publication number
- JPH0466181B2 JPH0466181B2 JP63202313A JP20231388A JPH0466181B2 JP H0466181 B2 JPH0466181 B2 JP H0466181B2 JP 63202313 A JP63202313 A JP 63202313A JP 20231388 A JP20231388 A JP 20231388A JP H0466181 B2 JPH0466181 B2 JP H0466181B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- hole
- metal plate
- prepreg
- filler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052751 metal Inorganic materials 0.000 claims description 72
- 239000002184 metal Substances 0.000 claims description 72
- 239000011347 resin Substances 0.000 claims description 66
- 229920005989 resin Polymers 0.000 claims description 66
- 239000002131 composite material Substances 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 238000011049 filling Methods 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000004080 punching Methods 0.000 claims description 2
- 239000000945 filler Substances 0.000 description 26
- 239000011888 foil Substances 0.000 description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 239000011521 glass Substances 0.000 description 10
- 238000000465 moulding Methods 0.000 description 9
- 229920001721 polyimide Polymers 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 238000001816 cooling Methods 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 239000009719 polyimide resin Substances 0.000 description 4
- 239000002966 varnish Substances 0.000 description 4
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical class O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229920000271 Kevlar® Polymers 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- -1 Lewis acid compound Chemical class 0.000 description 1
- 229920001494 Technora Polymers 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000004761 kevlar Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000004950 technora Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63202313A JPH0250829A (ja) | 1988-08-12 | 1988-08-12 | 電気積層板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63202313A JPH0250829A (ja) | 1988-08-12 | 1988-08-12 | 電気積層板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0250829A JPH0250829A (ja) | 1990-02-20 |
| JPH0466181B2 true JPH0466181B2 (US20050192411A1-20050901-C00012.png) | 1992-10-22 |
Family
ID=16455478
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63202313A Granted JPH0250829A (ja) | 1988-08-12 | 1988-08-12 | 電気積層板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0250829A (US20050192411A1-20050901-C00012.png) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1864222B (zh) | 2003-10-07 | 2010-06-09 | 皇家飞利浦电子股份有限公司 | 用于记录信息的装置和方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59217392A (ja) * | 1983-05-25 | 1984-12-07 | 株式会社日立製作所 | 多層配線回路板 |
| JPS60236294A (ja) * | 1984-05-10 | 1985-11-25 | 松下電工株式会社 | 金属ベ−ス配線基板 |
-
1988
- 1988-08-12 JP JP63202313A patent/JPH0250829A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59217392A (ja) * | 1983-05-25 | 1984-12-07 | 株式会社日立製作所 | 多層配線回路板 |
| JPS60236294A (ja) * | 1984-05-10 | 1985-11-25 | 松下電工株式会社 | 金属ベ−ス配線基板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0250829A (ja) | 1990-02-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |