JPH0463881B2 - - Google Patents

Info

Publication number
JPH0463881B2
JPH0463881B2 JP57192762A JP19276282A JPH0463881B2 JP H0463881 B2 JPH0463881 B2 JP H0463881B2 JP 57192762 A JP57192762 A JP 57192762A JP 19276282 A JP19276282 A JP 19276282A JP H0463881 B2 JPH0463881 B2 JP H0463881B2
Authority
JP
Japan
Prior art keywords
powder
silver
weight
copper powder
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57192762A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5981303A (ja
Inventor
Hiroshi Fujimoto
Shinichiro Mori
Hideo Myake
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyobo Co Ltd
Original Assignee
Toyobo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyobo Co Ltd filed Critical Toyobo Co Ltd
Priority to JP57192762A priority Critical patent/JPS5981303A/ja
Publication of JPS5981303A publication Critical patent/JPS5981303A/ja
Publication of JPH0463881B2 publication Critical patent/JPH0463881B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder

Landscapes

  • Paints Or Removers (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Powder Metallurgy (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymerisation Methods In General (AREA)
JP57192762A 1982-11-02 1982-11-02 活性光線硬化型導電性組成物 Granted JPS5981303A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57192762A JPS5981303A (ja) 1982-11-02 1982-11-02 活性光線硬化型導電性組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57192762A JPS5981303A (ja) 1982-11-02 1982-11-02 活性光線硬化型導電性組成物

Publications (2)

Publication Number Publication Date
JPS5981303A JPS5981303A (ja) 1984-05-11
JPH0463881B2 true JPH0463881B2 (enExample) 1992-10-13

Family

ID=16296621

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57192762A Granted JPS5981303A (ja) 1982-11-02 1982-11-02 活性光線硬化型導電性組成物

Country Status (1)

Country Link
JP (1) JPS5981303A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61163975A (ja) * 1985-01-16 1986-07-24 Nissan Chem Ind Ltd 導電性塗料組成物
US4959178A (en) * 1987-01-27 1990-09-25 Advanced Products Inc. Actinic radiation-curable conductive polymer thick film compositions and their use thereof
KR100669725B1 (ko) * 2004-09-09 2007-01-16 삼성에스디아이 주식회사 감광성 페이스트 조성물
KR100637174B1 (ko) 2004-10-06 2006-10-20 삼성에스디아이 주식회사 Pdp 전극 형성용 포지티브형 감광성 페이스트 조성물,이를 이용하여 제조된 pdp 전극 및 이를 포함하는 pdp
CN104841932A (zh) * 2015-06-04 2015-08-19 山东理工大学 制备核壳型聚苯乙烯包覆纳米银复合粒子的新方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5822041B2 (ja) * 1979-10-09 1983-05-06 四国化成工業株式会社 紫外線硬化型導電性樹脂組成物

Also Published As

Publication number Publication date
JPS5981303A (ja) 1984-05-11

Similar Documents

Publication Publication Date Title
US3988647A (en) Method for making a circuit board and article made thereby
USRE30274E (en) Method for making a circuit board and article made thereby
US4049844A (en) Method for making a circuit board and article made thereby
EP1972660B1 (en) Conductive composition, conductive paint, and method of forming conductive paint
USRE31411E (en) Radiation curable inks
US4122143A (en) Process for producing cured products
TWI603374B (zh) Method for manufacturing conductive pattern, touch sensor, touch panel and display panel
CN1746770A (zh) 光敏糊状物组合物
EP1897971A1 (en) Method for electrically conductive circuit formation
JP3279713B2 (ja) 無電解メツキされた金属層の付着力の改善法
JPH0463881B2 (enExample)
JPH10317153A (ja) 光硬化性無電解めっき用プライマー組成物及びそれを用いた無電解めっき方法
JP4108538B2 (ja) 無電解めっきパターン形成用組成物、無電解めっきパターン及びその形成方法
JPS6028160B2 (ja) 導電回路の形成方法
US4857614A (en) Radiation-sensitive polymers which form a metal complex, process for the polymerization of acetylene, and coated material
KR20160122694A (ko) 도전 페이스트, 패턴의 제조 방법, 도전 패턴의 제조 방법 및 센서
JP4459016B2 (ja) 電磁波シールド材及びその製造方法
JP7093156B2 (ja) 透明導電膜
JPH02199179A (ja) 塗料の硬化方法
JP2967117B2 (ja) 電子線硬化型導電性ペースト組成物
JPH08148035A (ja) 導電性材料及びそれを用いた導電性ペースト
JPH0572926B2 (enExample)
JPS6162558A (ja) 導電性を有する樹脂組成物
JP2758432B2 (ja) 電子線硬化型導電ペースト
WO2020184569A1 (ja) 回路基板及び回路基板の製造方法