JPH0458181B2 - - Google Patents
Info
- Publication number
- JPH0458181B2 JPH0458181B2 JP722287A JP722287A JPH0458181B2 JP H0458181 B2 JPH0458181 B2 JP H0458181B2 JP 722287 A JP722287 A JP 722287A JP 722287 A JP722287 A JP 722287A JP H0458181 B2 JPH0458181 B2 JP H0458181B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- mold
- support plate
- semiconductor chip
- thermoplastic resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims abstract description 78
- 239000011347 resin Substances 0.000 claims abstract description 78
- 239000004065 semiconductor Substances 0.000 claims abstract description 32
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 29
- 239000011248 coating agent Substances 0.000 claims abstract description 25
- 238000000576 coating method Methods 0.000 claims abstract description 25
- 238000000465 moulding Methods 0.000 claims abstract description 14
- 238000004519 manufacturing process Methods 0.000 claims abstract description 9
- 229920001187 thermosetting polymer Polymers 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 15
- 238000003825 pressing Methods 0.000 claims description 3
- 238000007789 sealing Methods 0.000 abstract description 6
- 238000010438 heat treatment Methods 0.000 abstract description 4
- 239000004634 thermosetting polymer Substances 0.000 abstract 1
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- -1 polybutylene terephthalate Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP722287A JPS63175436A (ja) | 1987-01-14 | 1987-01-14 | 樹脂封止型半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP722287A JPS63175436A (ja) | 1987-01-14 | 1987-01-14 | 樹脂封止型半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63175436A JPS63175436A (ja) | 1988-07-19 |
| JPH0458181B2 true JPH0458181B2 (enrdf_load_stackoverflow) | 1992-09-16 |
Family
ID=11659967
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP722287A Granted JPS63175436A (ja) | 1987-01-14 | 1987-01-14 | 樹脂封止型半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63175436A (enrdf_load_stackoverflow) |
-
1987
- 1987-01-14 JP JP722287A patent/JPS63175436A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63175436A (ja) | 1988-07-19 |
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