JPH045752B2 - - Google Patents

Info

Publication number
JPH045752B2
JPH045752B2 JP21181283A JP21181283A JPH045752B2 JP H045752 B2 JPH045752 B2 JP H045752B2 JP 21181283 A JP21181283 A JP 21181283A JP 21181283 A JP21181283 A JP 21181283A JP H045752 B2 JPH045752 B2 JP H045752B2
Authority
JP
Japan
Prior art keywords
ions
plating bath
bath
magnetic
4πms
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP21181283A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60103181A (ja
Inventor
Fumio Goto
Tetsuya Aisaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP21181283A priority Critical patent/JPS60103181A/ja
Publication of JPS60103181A publication Critical patent/JPS60103181A/ja
Publication of JPH045752B2 publication Critical patent/JPH045752B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
JP21181283A 1983-11-11 1983-11-11 無電解めつき浴 Granted JPS60103181A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21181283A JPS60103181A (ja) 1983-11-11 1983-11-11 無電解めつき浴

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21181283A JPS60103181A (ja) 1983-11-11 1983-11-11 無電解めつき浴

Publications (2)

Publication Number Publication Date
JPS60103181A JPS60103181A (ja) 1985-06-07
JPH045752B2 true JPH045752B2 (enrdf_load_html_response) 1992-02-03

Family

ID=16611998

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21181283A Granted JPS60103181A (ja) 1983-11-11 1983-11-11 無電解めつき浴

Country Status (1)

Country Link
JP (1) JPS60103181A (enrdf_load_html_response)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2826441T3 (es) * 2017-06-02 2021-05-18 Atotech Deutschland Gmbh Baños de metalizado no electrolítico de aleación de níquel, un método de deposición de aleaciones de níquel, depósitos de aleación de níquel y usos de dichos depósitos de aleación de níquel formados

Also Published As

Publication number Publication date
JPS60103181A (ja) 1985-06-07

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