JPH0453000Y2 - - Google Patents

Info

Publication number
JPH0453000Y2
JPH0453000Y2 JP1986161922U JP16192286U JPH0453000Y2 JP H0453000 Y2 JPH0453000 Y2 JP H0453000Y2 JP 1986161922 U JP1986161922 U JP 1986161922U JP 16192286 U JP16192286 U JP 16192286U JP H0453000 Y2 JPH0453000 Y2 JP H0453000Y2
Authority
JP
Japan
Prior art keywords
lead
straight line
imaginary straight
main body
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1986161922U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6367257U (enFirst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986161922U priority Critical patent/JPH0453000Y2/ja
Publication of JPS6367257U publication Critical patent/JPS6367257U/ja
Application granted granted Critical
Publication of JPH0453000Y2 publication Critical patent/JPH0453000Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP1986161922U 1986-10-22 1986-10-22 Expired JPH0453000Y2 (enFirst)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986161922U JPH0453000Y2 (enFirst) 1986-10-22 1986-10-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986161922U JPH0453000Y2 (enFirst) 1986-10-22 1986-10-22

Publications (2)

Publication Number Publication Date
JPS6367257U JPS6367257U (enFirst) 1988-05-06
JPH0453000Y2 true JPH0453000Y2 (enFirst) 1992-12-14

Family

ID=31088694

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986161922U Expired JPH0453000Y2 (enFirst) 1986-10-22 1986-10-22

Country Status (1)

Country Link
JP (1) JPH0453000Y2 (enFirst)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4942859U (enFirst) * 1972-07-17 1974-04-15
JPS5252464U (enFirst) * 1975-10-13 1977-04-14
JPS5331968U (enFirst) * 1976-08-26 1978-03-18
JPS6228782Y2 (enFirst) * 1980-04-28 1987-07-23

Also Published As

Publication number Publication date
JPS6367257U (enFirst) 1988-05-06

Similar Documents

Publication Publication Date Title
US5808359A (en) Semiconductor device having a heat sink with bumpers for protecting outer leads
KR101420877B1 (ko) 리드프레임 패널
JP3209696B2 (ja) 電子部品の製造方法
US20020056905A1 (en) Semiconductor device and method of fabricating the same
KR20130001705U (ko) 센서 모듈
US7732910B2 (en) Lead frame including suspending leads having trenches formed therein
JPH0453000Y2 (enFirst)
US4949161A (en) Interdigitized leadframe strip
KR980006563A (ko) 리드 온 칩 타입의 리드프레임
JPH0715918B2 (ja) 半導体チップ実装用リード構造体
JPH06268103A (ja) リードフレーム、成形金型、半導体素子の製造方法および半導体素子の半製品
KR950021455A (ko) 수지 봉지형 반도체 장치
US20080119012A1 (en) Mold array process for chip encapsulation and substrate strip utilized
JPS6050347B2 (ja) シングルインライン半導体装置用リ−ドフレ−ム
JPH0126110Y2 (enFirst)
JP2002076231A (ja) リードフレーム、成形金型、及び半導体装置
KR100575859B1 (ko) 볼 그리드 어레이 패키지
KR100473338B1 (ko) 반도체패키지용 리드프레임 및 그 봉지 방법
KR0135890Y1 (ko) 리드온칩 패키지
JPH05109957A (ja) 樹脂封止型半導体装置の製造方法およびリードフレーム
KR100234351B1 (ko) 리드 프레임
KR200159486Y1 (ko) 반도체 패키지
JPS6233748B2 (enFirst)
KR950006232Y1 (ko) 반도체 패키지용 리드프레임 패들
KR970024095A (ko) 차등 리드 피치를 갖는 내부 리드를 구비하는 리드 프레임 및 이를 이용한 패키지