JPS6367257U - - Google Patents
Info
- Publication number
- JPS6367257U JPS6367257U JP1986161922U JP16192286U JPS6367257U JP S6367257 U JPS6367257 U JP S6367257U JP 1986161922 U JP1986161922 U JP 1986161922U JP 16192286 U JP16192286 U JP 16192286U JP S6367257 U JPS6367257 U JP S6367257U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- row
- main body
- body portions
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/0198—Manufacture or treatment batch processes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986161922U JPH0453000Y2 (enFirst) | 1986-10-22 | 1986-10-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986161922U JPH0453000Y2 (enFirst) | 1986-10-22 | 1986-10-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6367257U true JPS6367257U (enFirst) | 1988-05-06 |
| JPH0453000Y2 JPH0453000Y2 (enFirst) | 1992-12-14 |
Family
ID=31088694
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986161922U Expired JPH0453000Y2 (enFirst) | 1986-10-22 | 1986-10-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0453000Y2 (enFirst) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4942859U (enFirst) * | 1972-07-17 | 1974-04-15 | ||
| JPS5252464U (enFirst) * | 1975-10-13 | 1977-04-14 | ||
| JPS5331968U (enFirst) * | 1976-08-26 | 1978-03-18 | ||
| JPS56161357U (enFirst) * | 1980-04-28 | 1981-12-01 |
-
1986
- 1986-10-22 JP JP1986161922U patent/JPH0453000Y2/ja not_active Expired
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4942859U (enFirst) * | 1972-07-17 | 1974-04-15 | ||
| JPS5252464U (enFirst) * | 1975-10-13 | 1977-04-14 | ||
| JPS5331968U (enFirst) * | 1976-08-26 | 1978-03-18 | ||
| JPS56161357U (enFirst) * | 1980-04-28 | 1981-12-01 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0453000Y2 (enFirst) | 1992-12-14 |