JPS5929035U - リ−ドフレ−ム - Google Patents

リ−ドフレ−ム

Info

Publication number
JPS5929035U
JPS5929035U JP12416582U JP12416582U JPS5929035U JP S5929035 U JPS5929035 U JP S5929035U JP 12416582 U JP12416582 U JP 12416582U JP 12416582 U JP12416582 U JP 12416582U JP S5929035 U JPS5929035 U JP S5929035U
Authority
JP
Japan
Prior art keywords
lead
frame
frame portion
lead frame
extending
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12416582U
Other languages
English (en)
Inventor
南部　哲司
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP12416582U priority Critical patent/JPS5929035U/ja
Publication of JPS5929035U publication Critical patent/JPS5929035U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図及び第２図は従来及び本案の一実施例を示す平面
図、第３図は第２図のリードフレームを適用した半導体
装置の横断面図である。 、　　図中、１は枠部分、２は基板、３は吊りピン、４
．５はタイバー、６□〜６□０はリード、７は連結部材
である。

Claims (1)

  1. 【実用新案登録請求の範囲】 平行に延びる枠部分間に半導体素子を固定するための基
    板を、枠部分より延びる吊りピンによって支持すると共
    に、枠部分より延びるタイバーによって支持された複数
    のリードを、その一端が基板の近傍に位置するように配
    設したものにおいて、上記吊りピンに隣接するリードの
    、タイバーより。 吊りピン側に離隔した部分を枠部分に連結部材を介して
    一体化したことを特徴とするリードフレーム。
JP12416582U 1982-08-17 1982-08-17 リ−ドフレ−ム Pending JPS5929035U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12416582U JPS5929035U (ja) 1982-08-17 1982-08-17 リ−ドフレ−ム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12416582U JPS5929035U (ja) 1982-08-17 1982-08-17 リ−ドフレ−ム

Publications (1)

Publication Number Publication Date
JPS5929035U true JPS5929035U (ja) 1984-02-23

Family

ID=30283152

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12416582U Pending JPS5929035U (ja) 1982-08-17 1982-08-17 リ−ドフレ−ム

Country Status (1)

Country Link
JP (1) JPS5929035U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0774198A (ja) * 1994-09-07 1995-03-17 Sony Corp 半導体装置
JP2015179737A (ja) * 2014-03-19 2015-10-08 セイコーインスツル株式会社 半導体装置及びその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0774198A (ja) * 1994-09-07 1995-03-17 Sony Corp 半導体装置
JP2015179737A (ja) * 2014-03-19 2015-10-08 セイコーインスツル株式会社 半導体装置及びその製造方法

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