JPH0448855B2 - - Google Patents
Info
- Publication number
- JPH0448855B2 JPH0448855B2 JP61082181A JP8218186A JPH0448855B2 JP H0448855 B2 JPH0448855 B2 JP H0448855B2 JP 61082181 A JP61082181 A JP 61082181A JP 8218186 A JP8218186 A JP 8218186A JP H0448855 B2 JPH0448855 B2 JP H0448855B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- alloy
- alloying elements
- group
- electromigration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Conductive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8218186A JPS62240733A (ja) | 1986-04-11 | 1986-04-11 | 半導体配線材料用ｂ含有アルミニウム合金 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8218186A JPS62240733A (ja) | 1986-04-11 | 1986-04-11 | 半導体配線材料用ｂ含有アルミニウム合金 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62240733A JPS62240733A (ja) | 1987-10-21 |
| JPH0448855B2 true JPH0448855B2 (enrdf_load_stackoverflow) | 1992-08-07 |
Family
ID=13767266
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8218186A Granted JPS62240733A (ja) | 1986-04-11 | 1986-04-11 | 半導体配線材料用ｂ含有アルミニウム合金 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62240733A (enrdf_load_stackoverflow) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5554889A (en) * | 1992-04-03 | 1996-09-10 | Motorola, Inc. | Structure and method for metallization of semiconductor devices |
| FR2756572B1 (fr) * | 1996-12-04 | 1999-01-08 | Pechiney Aluminium | Alliages d'aluminium a temperature de recristallisation elevee utilisee dans les cibles de pulverisation cathodiques |
| US6465376B2 (en) | 1999-08-18 | 2002-10-15 | International Business Machines Corporation | Method and structure for improving electromigration of chip interconnects |
| US20010047838A1 (en) | 2000-03-28 | 2001-12-06 | Segal Vladimir M. | Methods of forming aluminum-comprising physical vapor deposition targets; sputtered films; and target constructions |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60100644A (ja) * | 1983-11-02 | 1985-06-04 | Sumitomo Electric Ind Ltd | ボンデイングワイヤ用アルミニウム合金 |
| JPS60248861A (ja) * | 1984-05-22 | 1985-12-09 | Sumitomo Electric Ind Ltd | ボンデイングワイヤ用アルミニウム合金 |
| JPS619536A (ja) * | 1984-06-21 | 1986-01-17 | Sumitomo Electric Ind Ltd | ボンディングワイヤ用アルミ合金細線の製造方法 |
-
1986
- 1986-04-11 JP JP8218186A patent/JPS62240733A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62240733A (ja) | 1987-10-21 |
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