JPH0445244Y2 - - Google Patents
Info
- Publication number
- JPH0445244Y2 JPH0445244Y2 JP1985147747U JP14774785U JPH0445244Y2 JP H0445244 Y2 JPH0445244 Y2 JP H0445244Y2 JP 1985147747 U JP1985147747 U JP 1985147747U JP 14774785 U JP14774785 U JP 14774785U JP H0445244 Y2 JPH0445244 Y2 JP H0445244Y2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- electrode terminal
- semiconductor chip
- substrate
- metal wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W72/884—
-
- H10W90/734—
-
- H10W90/754—
Landscapes
- Die Bonding (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985147747U JPH0445244Y2 (cg-RX-API-DMAC10.html) | 1985-09-27 | 1985-09-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985147747U JPH0445244Y2 (cg-RX-API-DMAC10.html) | 1985-09-27 | 1985-09-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6255348U JPS6255348U (cg-RX-API-DMAC10.html) | 1987-04-06 |
| JPH0445244Y2 true JPH0445244Y2 (cg-RX-API-DMAC10.html) | 1992-10-23 |
Family
ID=31061393
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985147747U Expired JPH0445244Y2 (cg-RX-API-DMAC10.html) | 1985-09-27 | 1985-09-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0445244Y2 (cg-RX-API-DMAC10.html) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2705658B2 (ja) * | 1994-08-31 | 1998-01-28 | 日本電気株式会社 | 電子デバイス組立体およびその製造方法 |
| KR100574215B1 (ko) * | 1997-04-17 | 2006-04-27 | 세키스이가가쿠 고교가부시키가이샤 | 도전성 미립자 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5120941A (ja) * | 1974-08-14 | 1976-02-19 | Seikosha Kk | Dodenseisetsuchakuzai |
| JPS5431566A (en) * | 1977-08-12 | 1979-03-08 | Nippon Kokuen Kogyo Kk | Way of connecting large scale integrated circuit to current carrying circuit portions on insulated substrate |
-
1985
- 1985-09-27 JP JP1985147747U patent/JPH0445244Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6255348U (cg-RX-API-DMAC10.html) | 1987-04-06 |
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