JPH0439778B2 - - Google Patents
Info
- Publication number
- JPH0439778B2 JPH0439778B2 JP59005888A JP588884A JPH0439778B2 JP H0439778 B2 JPH0439778 B2 JP H0439778B2 JP 59005888 A JP59005888 A JP 59005888A JP 588884 A JP588884 A JP 588884A JP H0439778 B2 JPH0439778 B2 JP H0439778B2
- Authority
- JP
- Japan
- Prior art keywords
- welding
- lid
- welding electrode
- semiconductor package
- package base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K11/00—Resistance welding; Severing by resistance heating
- B23K11/002—Resistance welding; Severing by resistance heating specially adapted for particular articles or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/04—Tubular or hollow articles
- B23K2101/12—Vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59005888A JPS60149152A (ja) | 1984-01-17 | 1984-01-17 | シ−ム溶接方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59005888A JPS60149152A (ja) | 1984-01-17 | 1984-01-17 | シ−ム溶接方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60149152A JPS60149152A (ja) | 1985-08-06 |
| JPH0439778B2 true JPH0439778B2 (cs) | 1992-06-30 |
Family
ID=11623426
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59005888A Granted JPS60149152A (ja) | 1984-01-17 | 1984-01-17 | シ−ム溶接方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60149152A (cs) |
-
1984
- 1984-01-17 JP JP59005888A patent/JPS60149152A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60149152A (ja) | 1985-08-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2003188294A (ja) | 電子部品の製造方法 | |
| JP4219524B2 (ja) | 半導体素子用パッケージ | |
| JPH0252425B2 (cs) | ||
| JPH0439778B2 (cs) | ||
| JPS5929001B2 (ja) | スイシヨウハツシンキノ セイゾウホウホウ | |
| JPH0138373B2 (cs) | ||
| JP3194208B2 (ja) | シーム接合法 | |
| JP2689621B2 (ja) | 半導体装置とその製造方法 | |
| JPH0774576A (ja) | 圧電振動子 | |
| JP4824063B2 (ja) | 半導体素子用パッケージ | |
| JPS60223143A (ja) | パツケ−ジング方法 | |
| JPH09205160A (ja) | 蓋体のシーム接合法 | |
| JPS5915080Y2 (ja) | 半導体装置 | |
| JPS63240051A (ja) | セラミツクキヤツプ | |
| JPH10148736A (ja) | 光通信用パッケージ | |
| JPS635234Y2 (cs) | ||
| JPH0226041A (ja) | ワイヤボンデイング方法 | |
| JPH07245356A (ja) | 半導体パッケージおよびその製造方法 | |
| JPS6052581B2 (ja) | 半導体装置用容器の気密封止方法 | |
| JPH0457344A (ja) | 半導体装置の製造方法及び半導体装置 | |
| JPH03255650A (ja) | Icパッケージ | |
| JPH06112338A (ja) | 半導体用パッケージ | |
| JPS5984555A (ja) | 半導体装置用容器の気密封止方法 | |
| JPS63249355A (ja) | 集積回路の外囲器 | |
| JPH051240U (ja) | 封止用治具 |