JPH0438158B2 - - Google Patents
Info
- Publication number
- JPH0438158B2 JPH0438158B2 JP60019776A JP1977685A JPH0438158B2 JP H0438158 B2 JPH0438158 B2 JP H0438158B2 JP 60019776 A JP60019776 A JP 60019776A JP 1977685 A JP1977685 A JP 1977685A JP H0438158 B2 JPH0438158 B2 JP H0438158B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- conductive layer
- forming
- conductive
- polyimide resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1977685A JPS61179598A (ja) | 1985-02-04 | 1985-02-04 | 多層配線形成方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1977685A JPS61179598A (ja) | 1985-02-04 | 1985-02-04 | 多層配線形成方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61179598A JPS61179598A (ja) | 1986-08-12 |
JPH0438158B2 true JPH0438158B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1992-06-23 |
Family
ID=12008729
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1977685A Granted JPS61179598A (ja) | 1985-02-04 | 1985-02-04 | 多層配線形成方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61179598A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63244795A (ja) * | 1987-03-31 | 1988-10-12 | 松下電器産業株式会社 | 配線基板 |
JPH0638551B2 (ja) * | 1989-02-20 | 1994-05-18 | 松下電工株式会社 | 多層配線板の製造方法 |
JPH0710030B2 (ja) * | 1990-05-18 | 1995-02-01 | インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン | 多層配線基板の製造方法 |
JP5842686B2 (ja) * | 2012-03-13 | 2016-01-13 | 住友金属鉱山株式会社 | 立体的回路基板の製造方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS557957B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1972-08-04 | 1980-02-29 | ||
CA1022356A (en) * | 1973-02-28 | 1977-12-13 | Brian M. Turner | Process for the continuous melt thermoforming of polymers |
JPS5064767A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1973-10-12 | 1975-06-02 |
-
1985
- 1985-02-04 JP JP1977685A patent/JPS61179598A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS61179598A (ja) | 1986-08-12 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |