JPH0432755Y2 - - Google Patents
Info
- Publication number
- JPH0432755Y2 JPH0432755Y2 JP1985152935U JP15293585U JPH0432755Y2 JP H0432755 Y2 JPH0432755 Y2 JP H0432755Y2 JP 1985152935 U JP1985152935 U JP 1985152935U JP 15293585 U JP15293585 U JP 15293585U JP H0432755 Y2 JPH0432755 Y2 JP H0432755Y2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- resin
- cavity
- resin material
- molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011347 resin Substances 0.000 claims description 46
- 229920005989 resin Polymers 0.000 claims description 46
- 239000000463 material Substances 0.000 claims description 25
- 239000004065 semiconductor Substances 0.000 claims description 16
- 238000007789 sealing Methods 0.000 claims description 8
- 238000005538 encapsulation Methods 0.000 claims description 7
- 238000000465 moulding Methods 0.000 description 31
- 238000004519 manufacturing process Methods 0.000 description 15
- 238000000034 method Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000005580 one pot reaction Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985152935U JPH0432755Y2 (US07655688-20100202-C00548.png) | 1985-10-04 | 1985-10-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985152935U JPH0432755Y2 (US07655688-20100202-C00548.png) | 1985-10-04 | 1985-10-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6262435U JPS6262435U (US07655688-20100202-C00548.png) | 1987-04-17 |
| JPH0432755Y2 true JPH0432755Y2 (US07655688-20100202-C00548.png) | 1992-08-06 |
Family
ID=31071366
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985152935U Expired JPH0432755Y2 (US07655688-20100202-C00548.png) | 1985-10-04 | 1985-10-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0432755Y2 (US07655688-20100202-C00548.png) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2771340B2 (ja) * | 1991-03-28 | 1998-07-02 | 日本電気株式会社 | 半導体製造装置 |
| JP2932136B2 (ja) * | 1993-07-22 | 1999-08-09 | トーワ株式会社 | 電子部品の樹脂封止成形方法及び装置 |
| JP2932137B2 (ja) * | 1993-07-22 | 1999-08-09 | トーワ株式会社 | 電子部品の樹脂封止成形方法及び装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5138875A (en) * | 1974-09-27 | 1976-03-31 | Matsushita Electronics Corp | Handotaisochino jushifujihoho |
| JPS59159535A (ja) * | 1983-03-02 | 1984-09-10 | Sanyo Electric Co Ltd | 半導体素子の樹脂モ−ルド方法 |
-
1985
- 1985-10-04 JP JP1985152935U patent/JPH0432755Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5138875A (en) * | 1974-09-27 | 1976-03-31 | Matsushita Electronics Corp | Handotaisochino jushifujihoho |
| JPS59159535A (ja) * | 1983-03-02 | 1984-09-10 | Sanyo Electric Co Ltd | 半導体素子の樹脂モ−ルド方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6262435U (US07655688-20100202-C00548.png) | 1987-04-17 |
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