JPH0432741Y2 - - Google Patents
Info
- Publication number
- JPH0432741Y2 JPH0432741Y2 JP1988134874U JP13487488U JPH0432741Y2 JP H0432741 Y2 JPH0432741 Y2 JP H0432741Y2 JP 1988134874 U JP1988134874 U JP 1988134874U JP 13487488 U JP13487488 U JP 13487488U JP H0432741 Y2 JPH0432741 Y2 JP H0432741Y2
- Authority
- JP
- Japan
- Prior art keywords
- chip
- electronic component
- type electronic
- electrodes
- solder paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000007423 decrease Effects 0.000 claims description 4
- 230000001747 exhibiting effect Effects 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 28
- 238000005476 soldering Methods 0.000 description 21
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 239000003973 paint Substances 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- 229910052573 porcelain Inorganic materials 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910001120 nichrome Inorganic materials 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- -1 etc. Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 208000018883 loss of balance Diseases 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
Landscapes
- Ceramic Capacitors (AREA)
- Non-Adjustable Resistors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988134874U JPH0432741Y2 (de) | 1988-10-15 | 1988-10-15 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988134874U JPH0432741Y2 (de) | 1988-10-15 | 1988-10-15 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0256426U JPH0256426U (de) | 1990-04-24 |
JPH0432741Y2 true JPH0432741Y2 (de) | 1992-08-06 |
Family
ID=31394013
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988134874U Expired JPH0432741Y2 (de) | 1988-10-15 | 1988-10-15 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0432741Y2 (de) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3425848B2 (ja) * | 1997-06-02 | 2003-07-14 | 太陽誘電株式会社 | チップ部品 |
JP4707895B2 (ja) * | 2001-08-30 | 2011-06-22 | コーア株式会社 | チップ抵抗器 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5718699A (en) * | 1971-11-20 | 1982-01-30 | Araujo Vincent De | Manufacture of 17,21-dihydroxy-20-ketopregnanes |
JPS58173822A (ja) * | 1982-04-05 | 1983-10-12 | 株式会社村田製作所 | 三端子型セラミツクコンデンサの製造方法 |
JPS6260809A (ja) * | 1985-09-09 | 1987-03-17 | Kawasaki Heavy Ind Ltd | 冶金炉の副原料投入孔 |
JPS639901A (ja) * | 1986-07-01 | 1988-01-16 | 正和産業株式会社 | 抵抗器、コンデンサ用絶縁性基体 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61142434U (de) * | 1985-02-22 | 1986-09-03 |
-
1988
- 1988-10-15 JP JP1988134874U patent/JPH0432741Y2/ja not_active Expired
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5718699A (en) * | 1971-11-20 | 1982-01-30 | Araujo Vincent De | Manufacture of 17,21-dihydroxy-20-ketopregnanes |
JPS58173822A (ja) * | 1982-04-05 | 1983-10-12 | 株式会社村田製作所 | 三端子型セラミツクコンデンサの製造方法 |
JPS6260809A (ja) * | 1985-09-09 | 1987-03-17 | Kawasaki Heavy Ind Ltd | 冶金炉の副原料投入孔 |
JPS639901A (ja) * | 1986-07-01 | 1988-01-16 | 正和産業株式会社 | 抵抗器、コンデンサ用絶縁性基体 |
Also Published As
Publication number | Publication date |
---|---|
JPH0256426U (de) | 1990-04-24 |
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