JPH0431198B2 - - Google Patents

Info

Publication number
JPH0431198B2
JPH0431198B2 JP60167235A JP16723585A JPH0431198B2 JP H0431198 B2 JPH0431198 B2 JP H0431198B2 JP 60167235 A JP60167235 A JP 60167235A JP 16723585 A JP16723585 A JP 16723585A JP H0431198 B2 JPH0431198 B2 JP H0431198B2
Authority
JP
Japan
Prior art keywords
conductor layer
layer
conductor
firing
paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60167235A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6229194A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP16723585A priority Critical patent/JPS6229194A/ja
Priority to DE19863621667 priority patent/DE3621667A1/de
Publication of JPS6229194A publication Critical patent/JPS6229194A/ja
Priority to US07/071,669 priority patent/US4830878A/en
Priority to US07/153,432 priority patent/US4835038A/en
Publication of JPH0431198B2 publication Critical patent/JPH0431198B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP16723585A 1985-06-29 1985-07-29 厚膜基板装置 Granted JPS6229194A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP16723585A JPS6229194A (ja) 1985-07-29 1985-07-29 厚膜基板装置
DE19863621667 DE3621667A1 (de) 1985-06-29 1986-06-27 Mit einer mehrzahl von dickfilmen beschichtetes substrat, verfahren zu seiner herstellung und dieses enthaltende vorrichtung
US07/071,669 US4830878A (en) 1985-06-29 1987-07-09 Method of manufacturing a substrate coated with multiple thick films
US07/153,432 US4835038A (en) 1985-06-29 1988-02-08 Substrate coated with multiple thick films

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16723585A JPS6229194A (ja) 1985-07-29 1985-07-29 厚膜基板装置

Publications (2)

Publication Number Publication Date
JPS6229194A JPS6229194A (ja) 1987-02-07
JPH0431198B2 true JPH0431198B2 (cs) 1992-05-25

Family

ID=15845957

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16723585A Granted JPS6229194A (ja) 1985-06-29 1985-07-29 厚膜基板装置

Country Status (1)

Country Link
JP (1) JPS6229194A (cs)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5873185A (ja) * 1981-10-28 1983-05-02 株式会社東芝 厚膜回路基板の製造方法
JPS60250686A (ja) * 1984-05-25 1985-12-11 日本碍子株式会社 セラミツク配線基板の製造方法
JPS61121277A (ja) * 1984-11-19 1986-06-09 松下電器産業株式会社 布製採暖具

Also Published As

Publication number Publication date
JPS6229194A (ja) 1987-02-07

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