JPH0431182B2 - - Google Patents

Info

Publication number
JPH0431182B2
JPH0431182B2 JP60073030A JP7303085A JPH0431182B2 JP H0431182 B2 JPH0431182 B2 JP H0431182B2 JP 60073030 A JP60073030 A JP 60073030A JP 7303085 A JP7303085 A JP 7303085A JP H0431182 B2 JPH0431182 B2 JP H0431182B2
Authority
JP
Japan
Prior art keywords
lead
bonding
copper alloy
back surface
alloy lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60073030A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61231731A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP60073030A priority Critical patent/JPS61231731A/ja
Publication of JPS61231731A publication Critical patent/JPS61231731A/ja
Publication of JPH0431182B2 publication Critical patent/JPH0431182B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711—
    • H10W72/07141—
    • H10W72/075—
    • H10W72/07521—
    • H10W72/07533—
    • H10W72/07535—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5522—
    • H10W72/5525—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
JP60073030A 1985-04-05 1985-04-05 半導体装置の製造方法 Granted JPS61231731A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60073030A JPS61231731A (ja) 1985-04-05 1985-04-05 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60073030A JPS61231731A (ja) 1985-04-05 1985-04-05 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS61231731A JPS61231731A (ja) 1986-10-16
JPH0431182B2 true JPH0431182B2 (index.php) 1992-05-25

Family

ID=13506540

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60073030A Granted JPS61231731A (ja) 1985-04-05 1985-04-05 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS61231731A (index.php)

Also Published As

Publication number Publication date
JPS61231731A (ja) 1986-10-16

Similar Documents

Publication Publication Date Title
KR100454198B1 (ko) 반도체장치및그제조방법
JPH0431182B2 (index.php)
JPS62136835A (ja) 半導体装置の製造方法
JPH03153048A (ja) 半導体装置
JPH0452618B2 (index.php)
JPH0418696B2 (index.php)
JP3160555B2 (ja) 半導体装置およびその製造方法
JPH04155854A (ja) 半導体集積回路装置およびそれに用いるリードフレーム
JPS5948947A (ja) 半導体装置
JPS61231730A (ja) 半導体装置の製造方法
JPS62136836A (ja) 半導体装置の製造方法
JPS62136843A (ja) ワイヤボンデイング方法
JPH03228339A (ja) ボンディングツール
JPS62136834A (ja) 半導体装置の製造方法
JPS62136838A (ja) 半導体装置
JPS62136833A (ja) 半導体装置の製造方法
JP3420745B2 (ja) 半導体装置の製造方法
JPH06120290A (ja) 半導体装置
JPS61231735A (ja) 半導体装置の製造方法
JPS62136842A (ja) 半導体装置の製造方法
JPS61234554A (ja) 半導体用リ−ドフレ−ムの製造方法
JP2754712B2 (ja) 半導体装置
JPS62136839A (ja) 半導体装置
JPH09223767A (ja) リードフレーム
JPS61158154A (ja) 加熱圧着ツ−ル