JPH0418696B2 - - Google Patents

Info

Publication number
JPH0418696B2
JPH0418696B2 JP60073028A JP7302885A JPH0418696B2 JP H0418696 B2 JPH0418696 B2 JP H0418696B2 JP 60073028 A JP60073028 A JP 60073028A JP 7302885 A JP7302885 A JP 7302885A JP H0418696 B2 JPH0418696 B2 JP H0418696B2
Authority
JP
Japan
Prior art keywords
lead
bonding
copper alloy
wire
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60073028A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61231729A (ja
Inventor
Saneyasu Hirota
Kazumichi Machida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP60073028A priority Critical patent/JPS61231729A/ja
Publication of JPS61231729A publication Critical patent/JPS61231729A/ja
Publication of JPH0418696B2 publication Critical patent/JPH0418696B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711—
    • H10W72/015—
    • H10W72/01551—
    • H10W72/01571—
    • H10W72/07141—
    • H10W72/075—
    • H10W72/07511—
    • H10W72/07532—
    • H10W72/07533—
    • H10W72/07541—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5525—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
JP60073028A 1985-04-05 1985-04-05 半導体装置の製造方法 Granted JPS61231729A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60073028A JPS61231729A (ja) 1985-04-05 1985-04-05 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60073028A JPS61231729A (ja) 1985-04-05 1985-04-05 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS61231729A JPS61231729A (ja) 1986-10-16
JPH0418696B2 true JPH0418696B2 (index.php) 1992-03-27

Family

ID=13506480

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60073028A Granted JPS61231729A (ja) 1985-04-05 1985-04-05 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS61231729A (index.php)

Also Published As

Publication number Publication date
JPS61231729A (ja) 1986-10-16

Similar Documents

Publication Publication Date Title
KR100454198B1 (ko) 반도체장치및그제조방법
JPH10275826A (ja) 半導体装置およびその製造方法
CN1130822C (zh) 表面声波装置的制造方法
JPH0418696B2 (index.php)
JPS6342855B2 (index.php)
JPH06244230A (ja) ボンディング電極を有する装置およびボンディング電極の製造方法
JPS62136835A (ja) 半導体装置の製造方法
JPS61231737A (ja) 半導体装置の製造方法
JP3160555B2 (ja) 半導体装置およびその製造方法
JPH0422332B2 (index.php)
JPH0431182B2 (index.php)
JP3805277B2 (ja) 超音波接合構造及び方法
JPS62136836A (ja) 半導体装置の製造方法
JPS61231736A (ja) 半導体装置の製造方法
JPS61105850A (ja) ワイヤボンデイング方法
JPS62136834A (ja) 半導体装置の製造方法
JP3420745B2 (ja) 半導体装置の製造方法
JPS62136833A (ja) 半導体装置の製造方法
JPS62136842A (ja) 半導体装置の製造方法
JPH01268046A (ja) リードフレームの製造方法
JP4229460B2 (ja) 電子部品及びその製造方法
JP2754712B2 (ja) 半導体装置
JPS61231728A (ja) ワイヤボンデイング方法
JPS61231735A (ja) 半導体装置の製造方法
JPS61172344A (ja) ワイヤボンデイング方法