JPH0422332B2 - - Google Patents

Info

Publication number
JPH0422332B2
JPH0422332B2 JP60073029A JP7302985A JPH0422332B2 JP H0422332 B2 JPH0422332 B2 JP H0422332B2 JP 60073029 A JP60073029 A JP 60073029A JP 7302985 A JP7302985 A JP 7302985A JP H0422332 B2 JPH0422332 B2 JP H0422332B2
Authority
JP
Japan
Prior art keywords
lead
bonding
semiconductor device
manufacturing
copper alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60073029A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61231730A (ja
Inventor
Miho Hirota
Kazumichi Machida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP60073029A priority Critical patent/JPS61231730A/ja
Publication of JPS61231730A publication Critical patent/JPS61231730A/ja
Publication of JPH0422332B2 publication Critical patent/JPH0422332B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711—
    • H10W72/07141—
    • H10W72/075—
    • H10W72/07511—
    • H10W72/07521—
    • H10W72/07532—
    • H10W72/07533—
    • H10W72/07535—
    • H10W72/50—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5525—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
JP60073029A 1985-04-05 1985-04-05 半導体装置の製造方法 Granted JPS61231730A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60073029A JPS61231730A (ja) 1985-04-05 1985-04-05 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60073029A JPS61231730A (ja) 1985-04-05 1985-04-05 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS61231730A JPS61231730A (ja) 1986-10-16
JPH0422332B2 true JPH0422332B2 (index.php) 1992-04-16

Family

ID=13506511

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60073029A Granted JPS61231730A (ja) 1985-04-05 1985-04-05 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS61231730A (index.php)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003282478A (ja) 2002-01-17 2003-10-03 Sony Corp 合金化方法及び配線形成方法、表示素子の形成方法、画像表示装置の製造方法

Also Published As

Publication number Publication date
JPS61231730A (ja) 1986-10-16

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