JPH04298060A - ウエハの位置合わせ装置 - Google Patents

ウエハの位置合わせ装置

Info

Publication number
JPH04298060A
JPH04298060A JP3087524A JP8752491A JPH04298060A JP H04298060 A JPH04298060 A JP H04298060A JP 3087524 A JP3087524 A JP 3087524A JP 8752491 A JP8752491 A JP 8752491A JP H04298060 A JPH04298060 A JP H04298060A
Authority
JP
Japan
Prior art keywords
wafer
wafers
load lock
lock device
deviation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3087524A
Other languages
English (en)
Japanese (ja)
Inventor
Hiroo Ono
博夫 小野
Satoru Osawa
哲 大沢
Teruo Asakawa
輝雄 浅川
Kenji Nebuka
根深　憲司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP3087524A priority Critical patent/JPH04298060A/ja
Priority to US07/857,831 priority patent/US5405230A/en
Priority to KR1019920004984A priority patent/KR0165555B1/ko
Priority to EP92105207A priority patent/EP0506044B1/fr
Priority to DE69206294T priority patent/DE69206294T2/de
Publication of JPH04298060A publication Critical patent/JPH04298060A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
JP3087524A 1991-03-26 1991-03-26 ウエハの位置合わせ装置 Pending JPH04298060A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP3087524A JPH04298060A (ja) 1991-03-26 1991-03-26 ウエハの位置合わせ装置
US07/857,831 US5405230A (en) 1991-03-26 1992-03-26 Load-lock unit and wafer transfer system
KR1019920004984A KR0165555B1 (ko) 1991-03-26 1992-03-26 로드록장치 및 웨이퍼의 반송시스템 및 웨이퍼의 위치 검출장치
EP92105207A EP0506044B1 (fr) 1991-03-26 1992-03-26 Unité de sas et système de transfert de galette semi-conductrice
DE69206294T DE69206294T2 (de) 1991-03-26 1992-03-26 Ladungsschleuse und Wafertransportsysteme.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3087524A JPH04298060A (ja) 1991-03-26 1991-03-26 ウエハの位置合わせ装置

Publications (1)

Publication Number Publication Date
JPH04298060A true JPH04298060A (ja) 1992-10-21

Family

ID=13917386

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3087524A Pending JPH04298060A (ja) 1991-03-26 1991-03-26 ウエハの位置合わせ装置

Country Status (5)

Country Link
US (1) US5405230A (fr)
EP (1) EP0506044B1 (fr)
JP (1) JPH04298060A (fr)
KR (1) KR0165555B1 (fr)
DE (1) DE69206294T2 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010219281A (ja) * 2009-03-17 2010-09-30 Tokyo Electron Ltd 基板処理システム及び基板処理方法
JP2014103156A (ja) * 2012-11-16 2014-06-05 Yaskawa Electric Corp 基板搬送ロボットおよび基板搬送方法
JP2014204017A (ja) * 2013-04-08 2014-10-27 シンフォニアテクノロジー株式会社 被処理体の受容装置

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US6473157B2 (en) * 1992-02-07 2002-10-29 Nikon Corporation Method of manufacturing exposure apparatus and method for exposing a pattern on a mask onto a substrate
US6048655A (en) * 1992-02-07 2000-04-11 Nikon Corporation Method of carrying and aligning a substrate
KR940006241A (ko) * 1992-06-05 1994-03-23 이노우에 아키라 기판이재장치 및 이재방법
US5586585A (en) * 1995-02-27 1996-12-24 Asyst Technologies, Inc. Direct loadlock interface
JP3483648B2 (ja) * 1995-03-24 2004-01-06 東芝機械株式会社 研磨装置
JP3200326B2 (ja) * 1995-04-24 2001-08-20 東京応化工業株式会社 円板状被処理物の移載方法及び移載装置
JPH0936198A (ja) * 1995-07-19 1997-02-07 Hitachi Ltd 真空処理装置およびそれを用いた半導体製造ライン
US6019564A (en) * 1995-10-27 2000-02-01 Advantest Corporation Semiconductor device transporting and handling apparatus
US5644400A (en) * 1996-03-29 1997-07-01 Lam Research Corporation Method and apparatus for determining the center and orientation of a wafer-like object
US5980195A (en) * 1996-04-24 1999-11-09 Tokyo Electron, Ltd. Positioning apparatus for substrates to be processed
US5997235A (en) * 1996-09-20 1999-12-07 Brooks Automation, Inc. Swap out plate and assembly
US6082949A (en) * 1996-10-11 2000-07-04 Asyst Technologies, Inc. Load port opener
JPH10144599A (ja) * 1996-11-11 1998-05-29 Tokyo Electron Ltd 回転処理装置およびその洗浄方法
US6152070A (en) 1996-11-18 2000-11-28 Applied Materials, Inc. Tandem process chamber
US6082950A (en) * 1996-11-18 2000-07-04 Applied Materials, Inc. Front end wafer staging with wafer cassette turntables and on-the-fly wafer center finding
US6099596A (en) * 1997-07-23 2000-08-08 Applied Materials, Inc. Wafer out-of-pocket detection tool
US6270306B1 (en) * 1998-01-14 2001-08-07 Applied Materials, Inc. Wafer aligner in center of front end frame of vacuum system
US6075334A (en) * 1999-03-15 2000-06-13 Berkeley Process Control, Inc Automatic calibration system for wafer transfer robot
JP4255091B2 (ja) * 1999-04-07 2009-04-15 株式会社日立国際電気 半導体製造方法
US6275742B1 (en) 1999-04-16 2001-08-14 Berkeley Process Control, Inc. Wafer aligner system
US6162008A (en) * 1999-06-08 2000-12-19 Varian Semiconductor Equipment Associates, Inc. Wafer orientation sensor
EP1269521A1 (fr) 2000-04-07 2003-01-02 Varian Semiconductor Equipment Associates Inc. DETECTEUR D'ORIENTATION DE TRANCHES DE GaAs
US6448567B1 (en) * 2000-04-25 2002-09-10 Varian Semiconductor Equipment Associates, Inc. Method and apparatus for shielding a valve gate and other valve parts
US6630053B2 (en) * 2000-08-22 2003-10-07 Asm Japan K.K. Semiconductor processing module and apparatus
US6591161B2 (en) * 2001-01-31 2003-07-08 Wafermasters, Inc. Method for determining robot alignment
US6556887B2 (en) * 2001-07-12 2003-04-29 Applied Materials, Inc. Method for determining a position of a robot
JP2003059999A (ja) * 2001-08-14 2003-02-28 Tokyo Electron Ltd 処理システム
MXPA05007215A (es) * 2003-01-02 2005-09-12 Univ Loma Linda Med Sistema para administracion de configuracion y recuperacion para sistema de terapia con haz de protones.
US20070286710A1 (en) * 2003-11-10 2007-12-13 Van Der Meulen Peter Semiconductor manufacturing process modules
US10086511B2 (en) 2003-11-10 2018-10-02 Brooks Automation, Inc. Semiconductor manufacturing systems
US7458763B2 (en) 2003-11-10 2008-12-02 Blueshift Technologies, Inc. Mid-entry load lock for semiconductor handling system
US8313277B2 (en) * 2003-11-10 2012-11-20 Brooks Automation, Inc. Semiconductor manufacturing process modules
US8267632B2 (en) 2003-11-10 2012-09-18 Brooks Automation, Inc. Semiconductor manufacturing process modules
US8696298B2 (en) * 2003-11-10 2014-04-15 Brooks Automation, Inc. Semiconductor manufacturing process modules
US20070269297A1 (en) * 2003-11-10 2007-11-22 Meulen Peter V D Semiconductor wafer handling and transport
US7246985B2 (en) * 2004-04-16 2007-07-24 Axcelis Technologies, Inc. Work-piece processing system
DE102004025150B4 (de) * 2004-05-21 2019-05-09 Mattson Technology, Inc. Lagebestimmung eines Halbleitersubstrats auf einer Rotationsvorrichtung
US7467916B2 (en) * 2005-03-08 2008-12-23 Asm Japan K.K. Semiconductor-manufacturing apparatus equipped with cooling stage and semiconductor-manufacturing method using same
US7604449B1 (en) * 2005-06-27 2009-10-20 Kla-Tencor Technologies Corporation Equipment front end module
US20080101912A1 (en) * 2006-10-26 2008-05-01 Martin Todd W Deposition analysis for robot motion correction
FR2927175B1 (fr) * 2008-02-05 2011-02-18 Altatech Semiconductor Dispositif d'inspection de plaquettes semi-conductrices
WO2010105967A2 (fr) * 2009-03-18 2010-09-23 Oc Oerlikon Balzers Ag Appareil de traitement à vide
JP2011119468A (ja) * 2009-12-03 2011-06-16 Tokyo Electron Ltd 被処理体の搬送方法および被処理体処理装置
KR101940580B1 (ko) * 2012-05-24 2019-01-22 에이씨엠 리서치 (상하이) 인코포레이티드 로드록 챔버와, 그를 이용하여 기판을 처리하는 방법

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US4457664A (en) * 1982-03-22 1984-07-03 Ade Corporation Wafer alignment station
US4553069A (en) * 1984-01-05 1985-11-12 General Ionex Corporation Wafer holding apparatus for ion implantation
US5004924A (en) * 1985-01-28 1991-04-02 Tokyo Electron Limited Wafer transport apparatus for ion implantation apparatus
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US4752898A (en) * 1987-01-28 1988-06-21 Tencor Instruments Edge finding in wafers
US4973217A (en) * 1987-02-09 1990-11-27 Svg Lithography Systems, Inc. Wafer handling system
US4819167A (en) * 1987-04-20 1989-04-04 Applied Materials, Inc. System and method for detecting the center of an integrated circuit wafer
US4880348A (en) * 1987-05-15 1989-11-14 Roboptek, Inc. Wafer centration device
JPS6464047A (en) * 1987-09-04 1989-03-09 Fujitsu Ltd Disk cache control system
JPH0620097B2 (ja) * 1987-10-20 1994-03-16 富士通株式会社 ウエハ位置決め装置
JPH0287546A (ja) * 1988-09-22 1990-03-28 Nitto Denko Corp 保護フイルムの貼付方法
US5102280A (en) * 1989-03-07 1992-04-07 Ade Corporation Robot prealigner
JPH0736417B2 (ja) * 1989-10-24 1995-04-19 株式会社メツクス ウエハーの位置決め装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010219281A (ja) * 2009-03-17 2010-09-30 Tokyo Electron Ltd 基板処理システム及び基板処理方法
JP2014103156A (ja) * 2012-11-16 2014-06-05 Yaskawa Electric Corp 基板搬送ロボットおよび基板搬送方法
JP2014204017A (ja) * 2013-04-08 2014-10-27 シンフォニアテクノロジー株式会社 被処理体の受容装置

Also Published As

Publication number Publication date
EP0506044B1 (fr) 1995-11-29
DE69206294T2 (de) 1996-05-02
EP0506044A3 (en) 1992-11-25
EP0506044A2 (fr) 1992-09-30
KR920018888A (ko) 1992-10-22
KR0165555B1 (ko) 1999-02-01
DE69206294D1 (de) 1996-01-11
US5405230A (en) 1995-04-11

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