JPH0429580Y2 - - Google Patents
Info
- Publication number
- JPH0429580Y2 JPH0429580Y2 JP1986028668U JP2866886U JPH0429580Y2 JP H0429580 Y2 JPH0429580 Y2 JP H0429580Y2 JP 1986028668 U JP1986028668 U JP 1986028668U JP 2866886 U JP2866886 U JP 2866886U JP H0429580 Y2 JPH0429580 Y2 JP H0429580Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- light emitting
- emitting diode
- synthetic resin
- exterior
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920003002 synthetic resin Polymers 0.000 claims description 24
- 239000000057 synthetic resin Substances 0.000 claims description 24
- 230000007547 defect Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 238000005452 bending Methods 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- 230000035515 penetration Effects 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 239000000975 dye Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000001044 red dye Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986028668U JPH0429580Y2 (US20030220297A1-20031127-C00009.png) | 1986-02-28 | 1986-02-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986028668U JPH0429580Y2 (US20030220297A1-20031127-C00009.png) | 1986-02-28 | 1986-02-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62140758U JPS62140758U (US20030220297A1-20031127-C00009.png) | 1987-09-05 |
| JPH0429580Y2 true JPH0429580Y2 (US20030220297A1-20031127-C00009.png) | 1992-07-17 |
Family
ID=30831851
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986028668U Expired JPH0429580Y2 (US20030220297A1-20031127-C00009.png) | 1986-02-28 | 1986-02-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0429580Y2 (US20030220297A1-20031127-C00009.png) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3659635B2 (ja) * | 2001-04-10 | 2005-06-15 | 株式会社東芝 | 光半導体装置 |
| DE10131698A1 (de) * | 2001-06-29 | 2003-01-30 | Osram Opto Semiconductors Gmbh | Oberflächenmontierbares strahlungsemittierendes Bauelement und Verfahren zu dessen Herstellung |
| JP2004014857A (ja) * | 2002-06-07 | 2004-01-15 | Stanley Electric Co Ltd | チップタイプ光半導体素子 |
| US9070850B2 (en) | 2007-10-31 | 2015-06-30 | Cree, Inc. | Light emitting diode package and method for fabricating same |
| US7675145B2 (en) | 2006-03-28 | 2010-03-09 | Cree Hong Kong Limited | Apparatus, system and method for use in mounting electronic elements |
| US8866169B2 (en) | 2007-10-31 | 2014-10-21 | Cree, Inc. | LED package with increased feature sizes |
| KR100998233B1 (ko) * | 2007-12-03 | 2010-12-07 | 서울반도체 주식회사 | 슬림형 ｌｅｄ 패키지 |
| JP2010171060A (ja) * | 2009-01-20 | 2010-08-05 | Fuji Electric Fa Components & Systems Co Ltd | 樹脂封止形デバイスのリードフレーム |
| JP2011060801A (ja) * | 2009-09-07 | 2011-03-24 | Nichia Corp | 発光装置及びその製造方法 |
| JP5347953B2 (ja) * | 2009-12-28 | 2013-11-20 | 日亜化学工業株式会社 | 発光装置およびその製造方法 |
| WO2014030530A1 (ja) * | 2012-08-23 | 2014-02-27 | 三菱樹脂株式会社 | 発光装置用パッケージ及び発光装置 |
| US9601670B2 (en) | 2014-07-11 | 2017-03-21 | Cree, Inc. | Method to form primary optic with variable shapes and/or geometries without a substrate |
-
1986
- 1986-02-28 JP JP1986028668U patent/JPH0429580Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62140758U (US20030220297A1-20031127-C00009.png) | 1987-09-05 |
