JPH0429580Y2 - - Google Patents
Info
- Publication number
- JPH0429580Y2 JPH0429580Y2 JP1986028668U JP2866886U JPH0429580Y2 JP H0429580 Y2 JPH0429580 Y2 JP H0429580Y2 JP 1986028668 U JP1986028668 U JP 1986028668U JP 2866886 U JP2866886 U JP 2866886U JP H0429580 Y2 JPH0429580 Y2 JP H0429580Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- light emitting
- emitting diode
- synthetic resin
- exterior
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920003002 synthetic resin Polymers 0.000 claims description 24
- 239000000057 synthetic resin Substances 0.000 claims description 24
- 230000007547 defect Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 238000005452 bending Methods 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- 230000035515 penetration Effects 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 239000000975 dye Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000001044 red dye Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
【考案の詳細な説明】
〔産業上の利用分野〕
この考案は、発光ダイオードに係り、特に、超
小型の発光ダイオードにおいて、透孔性合成樹脂
による外装とリード部との密着強度の向上などに
関する。[Detailed description of the invention] [Industrial application field] This invention relates to light emitting diodes, and in particular, relates to improving the adhesion strength between the exterior and the lead part using a porous synthetic resin in ultra-small light emitting diodes. .
一般に、発光ダイオードは、第３図に示すよう
に、導電性の高いリードフレームにカソード側の
リード部２とアノード側のリード部４とを打抜き
加工によって一体的に形成するとともに、リード
部２に形成されたマウント部６に発光ダイオード
素子８を設置して、この発光ダイオード素子８と
リード部４との間にワイヤ１０を配設した後、透
光性のある合成樹脂を用いて外装１２を施したも
のである。そして、一辺部が２〜３mm程度の直方
体からなる超小型の発光ダイオードでは、リード
部２，４に、第４図に一点鎖線で表示するよう
に、Ｌ字形のホーミング加工を施して、半田付け
などの接続の便宜に供することが行われている。
Generally, as shown in FIG. 3, in a light emitting diode, a lead part 2 on the cathode side and a lead part 4 on the anode side are integrally formed on a highly conductive lead frame by punching. After installing the light emitting diode element 8 on the formed mount part 6 and disposing the wire 10 between the light emitting diode element 8 and the lead part 4, the exterior 12 is made of a transparent synthetic resin. This is what was done. In the case of an ultra-small light emitting diode made of a rectangular parallelepiped with a side of about 2 to 3 mm, the lead parts 2 and 4 are subjected to an L-shaped homing process, as shown by the dashed line in Figure 4, and then soldered. It is being done to provide convenience for connection such as.
ところで、発光ダイオードは、その機能上、光
を外部に効率よく放射することが要請されるの
で、外装１２にはエポキシ樹脂などの透光性の良
好な合成樹脂が用いられる。透光性を最優先にし
た合成樹脂では、リード部との密着性、硬度、耐
湿性などを高めるために混入させるフイラやその
他の成分が限定され、透光性を必要としない他の
半導体装置の外装用のものに比較してリード部と
の密着性、硬度、耐湿性などが低くなる。
By the way, since the light emitting diode is required to efficiently emit light to the outside due to its function, the exterior 12 is made of a synthetic resin with good translucency, such as epoxy resin. Synthetic resins that prioritize translucency have limited fillers and other ingredients mixed in to improve adhesion with leads, hardness, moisture resistance, etc., and are suitable for use in other semiconductor devices that do not require translucency. The adhesion to the lead part, hardness, moisture resistance, etc. are lower than those for exterior use.
しかも、超小型の発光ダイオードでは、その小
型化の要請に応じるため、外装１２を小さくして
おり、第３図に示すように、外装１２に対するリ
ード部２，４の比率が大きく、外装１２とリード
部２，４との接合面積も狭小化する傾向にある。
そして、超小型の発光ダイオードでは、第４図に
示すように、リード部２，４を外装１２の沿面近
傍において、接続の便宜に供するためにホーミン
グ加工を施している。 Moreover, in order to meet the demand for miniaturization of ultra-small light emitting diodes, the outer casing 12 is made smaller, and as shown in FIG. The bonding area with the lead parts 2 and 4 also tends to become smaller.
In the ultra-small light emitting diode, as shown in FIG. 4, the lead portions 2 and 4 are subjected to homing processing near the creeping surface of the outer casing 12 for convenience of connection.
このため、密着性が低い合成樹脂を用いて外装
１２を施した場合、リード部２，４のホーミング
加工のために、リード部２，４の曲げ応力が外装
１２との密着部分に加わると、その曲げ応力によ
つて、外装１２の変形、ワイヤ１０の断線、リー
ド部２，４と外装１２との密着度の低下ないしリ
ード部２，４と外装１２との剥離、また、耐湿性
が損なわれ、たとえば、第５図に示すように、リ
ード部２，４と外装１２との間に隙間１４などの
欠陥を生じさせて、発光ダイオード素子８を外気
に触れさせるなどのオープン状態が起こる。 For this reason, when the exterior 12 is made of a synthetic resin with low adhesion, if the bending stress of the lead parts 2, 4 is applied to the part that is in close contact with the exterior 12 due to the homing process of the lead parts 2, 4, The bending stress may cause deformation of the sheath 12, breakage of the wire 10, decrease in adhesion between the lead parts 2, 4 and sheath 12, or peeling of the lead parts 2, 4 and sheath 12, and loss of moisture resistance. For example, as shown in FIG. 5, a defect such as a gap 14 is created between the lead portions 2, 4 and the exterior casing 12, resulting in an open state in which the light emitting diode element 8 is exposed to the outside air.
従来、この種の発光ダイオードでは、密着部分
に対して赤色の色素を浸透させて、その浸透の度
合から隙間の発生を知る色素浸透検査法が用いら
れているが、この色素浸透検査によると、製造工
程上の検査で製品100個当たり、２〜３％の不良
が発生することが確認されている。 Conventionally, for this type of light-emitting diode, a dye penetration test method has been used in which a red dye penetrates into the areas of close contact, and the occurrence of gaps can be determined from the degree of penetration.According to this dye penetration test, Inspections during the manufacturing process have confirmed that 2 to 3% of defects occur per 100 products.
そこで、この考案は、このような超小型の発光
ダイオードにおいて、そのリード部と外装との密
着性を改善した発光ダイオードの提供を目的とす
る。 Therefore, the object of this invention is to provide such an ultra-small light emitting diode in which the adhesion between the lead portion and the exterior of the light emitting diode is improved.
この考案の発光ダイオードは、第１図および第
２図に示すように、透光性を持つ合成樹脂によつ
て外装１２が施される発光ダイオードにおいて、
リード部２，４の合成樹脂内に埋め込まれる部分
に貫通孔１６，１８，２０，２２を形成して、貫
通孔１６〜２２を通してリード部２，４の表裏面
間に前記合成樹脂を短絡させてなるものである。
As shown in FIGS. 1 and 2, the light emitting diode of this invention is a light emitting diode in which an exterior 12 is made of a synthetic resin having translucency.
Through holes 16, 18, 20, and 22 are formed in the parts of the lead parts 2 and 4 that are embedded in the synthetic resin, and the synthetic resin is short-circuited between the front and back surfaces of the lead parts 2 and 4 through the through holes 16 to 22. This is what happens.
リード部２，４の適宜箇所に形成した貫通孔１
６〜２２を通して外装１２を形成する合成樹脂を
短絡させると、その短絡によつて、リード部２，
４と外装１２との密着度に、短絡部分の合成樹脂
自体の強度が加わるので、貫通孔１６〜２２がな
い場合のリード部２，４と外装１２との密着度を
遥かに越える接合強度が得られる。この結果、リ
ード部２，４間の引張り強度が高められ、ホーミ
ング加工などによる外装１２とリード部２，４と
の剥離や隙間などの欠陥の発生を防止できる。
Through-holes 1 formed at appropriate locations on the lead parts 2 and 4
When the synthetic resin forming the exterior 12 is short-circuited through 6 to 22, the lead portion 2,
Since the strength of the synthetic resin itself at the short-circuited portion is added to the degree of adhesion between the leads 2 and 4 and the sheath 12, the bonding strength far exceeds the degree of adhesion between the lead parts 2, 4 and the sheath 12 without the through holes 16 to 22. can get. As a result, the tensile strength between the lead parts 2 and 4 is increased, and it is possible to prevent defects such as peeling and gaps between the exterior 12 and the lead parts 2 and 4 due to homing processing or the like.
ところで、発光ダイオードは、発光ダイオード
素子８を設置したリード部２，４を合成樹脂のト
ランスフア成形などの成形技術によつて外装１２
を施すので、合成樹脂は、その成形加工によつて
リード部２，４と密着するとともに、リード部
２，４および発光ダイオード素子８などの必要な
周面を合成樹脂が持つ流動性によつて覆い、成形
型に応じた形状を持つ外装１２を得る。 By the way, the light emitting diode is manufactured by molding the lead portions 2 and 4 on which the light emitting diode element 8 is installed into the exterior 12 using a molding technique such as transfer molding of synthetic resin.
The synthetic resin adheres closely to the lead parts 2 and 4 through its molding process, and the fluidity of the synthetic resin also allows the necessary peripheral surfaces of the lead parts 2 and 4 and the light emitting diode element 8 to be formed. An exterior 12 having a shape corresponding to the mold is obtained.
この場合、リード部２，４の適宜箇所に貫通孔
１６〜２２が形成されていると、その貫通孔１６
〜２２を通じて合成樹脂が流れ、貫通孔１６〜２
２を介してリード部２，４の表裏面の合成樹脂が
短縮されることになる。 In this case, if the through holes 16 to 22 are formed at appropriate locations on the lead parts 2 and 4, the through holes 16
The synthetic resin flows through the through holes 16 to 22.
2, the synthetic resin on the front and back surfaces of the lead parts 2 and 4 is shortened.
以下、この考案の実施例を図面を参照して説明
する。
Hereinafter, embodiments of this invention will be described with reference to the drawings.
第１図および第２図は、この考案の発光ダイオ
ードの実施例を示す。 1 and 2 show an embodiment of the light emitting diode of this invention.
リード部２，４は連続した導電性の良い金属板
からなるリードフレームにおいて打ち抜き加工に
よつて形成する。 The lead parts 2 and 4 are formed by punching a lead frame made of a continuous metal plate with good conductivity.
この場合、カソード側のリード部２には、発光
ダイオード素子８を設置するためのエリヤとして
任意形状、たとえば、矩形形状のマウント部２４
が形成されており、このマウント部２４に連続し
てマウント部２４より大きい形状の固定部２６が
形成され、この固定部２６に対して僅かに小さい
補助固定部２８が形成され、この補助固定部２８
に連続して引出し部３０が形成されている。そし
て、リード部２の固定部２６および補助固定部２
８から引出し部３０側、外装１２の端面側に近い
部分には、表裏面に貫通する任意形状の貫通孔と
して、たとえば円形の貫通孔１６が形成されてい
る。 In this case, the lead part 2 on the cathode side has a mount part 24 having an arbitrary shape, for example, a rectangular shape, as an area for installing the light emitting diode element 8.
A fixing part 26 having a larger shape than the mount part 24 is formed continuously from the mount part 24, and an auxiliary fixing part 28, which is slightly smaller than the fixing part 26, is formed. 28
A drawer portion 30 is formed continuously. Then, the fixing part 26 of the lead part 2 and the auxiliary fixing part 2
A circular through-hole 16, for example, is formed as a through-hole of an arbitrary shape that penetrates the front and back surfaces of the housing 12 on the drawer portion 30 side and close to the end face side of the exterior 12.
一方、アノード側のリード部４には、リード部
２のマウント部２４に対向する固定部３２が設け
られ、この固定部３２の前縁両側部にマウント部
２４に対して一定の絶縁間隙を保持しながら、マ
ウント部２４の両辺部側に固定部３２の両縁部を
延長する範囲で補助固定部３４が設けられ、ま
た、固定部３２の後縁側央から引出し部３０と同
様の引出し部３６が形成されている。そして、こ
のリード部４には、固定部３２の両縁の補助固定
部３４側に表裏面に貫通する任意形状の貫通孔と
して、円形の貫通孔１８，２０が形成されている
とともに、固定部３２の引出し部３６側の部分に
任意形状の貫通孔として、円形の貫通孔２２が形
成されている。 On the other hand, the lead part 4 on the anode side is provided with a fixing part 32 facing the mount part 24 of the lead part 2, and a certain insulating gap is maintained with respect to the mount part 24 on both sides of the front edge of the fixing part 32. Meanwhile, an auxiliary fixing part 34 is provided on both sides of the mount part 24 in a range extending both edges of the fixing part 32, and a drawer part 36 similar to the drawer part 30 is provided from the center of the rear edge of the fixing part 32. is formed. In this lead part 4, circular through-holes 18 and 20 are formed as through-holes of arbitrary shapes penetrating the front and back surfaces on both sides of the fixing part 32 on the auxiliary fixing part 34 side, and the fixing part A circular through hole 22 is formed as an arbitrarily shaped through hole in a portion of the drawer portion 36 side of the through hole 32 .
各リード部２，４に形成された貫通孔１６〜２
２の位置関係は、貫通孔１６，１８，２０がほぼ
正三角形の頂点に位置し、かつ、各貫通孔１６，
１８，２０，２２は、固定部３２のマウント部２
４寄りの部分を中心にした十字線上に位置してい
る。 Through holes 16 to 2 formed in each lead part 2, 4
2, the through holes 16, 18, and 20 are located at the vertices of an approximately equilateral triangle, and each through hole 16,
18, 20, 22 are the mount parts 2 of the fixing part 32;
It is located on the cross line centered on the 4th part.
そして、リード部２のマウント部２４には、発
光ダイオード素子８が固定され、その発光ダイオ
ード素子８とリード部４の固定部３２との間にワ
イヤ１０が配設される。このように発光ダイオー
ド素子８とともにリード部２，４は、成形型にリ
ードフレームごと挿入された後、透孔性を持つ合
成樹脂、たとえば、エポキシ樹脂などを用いてト
ランスフア成形などによつて外装１２が施され
る。 A light emitting diode element 8 is fixed to the mount part 24 of the lead part 2, and a wire 10 is disposed between the light emitting diode element 8 and the fixing part 32 of the lead part 4. In this way, the lead parts 2 and 4 together with the light emitting diode element 8 are inserted into a mold together with the lead frame, and then covered with a transparent synthetic resin such as epoxy resin by transfer molding or the like. 12 will be applied.
このような外装１２が施されると、リード部
２，４に形成された各貫通孔１６〜２２には、第
２図に示すように、その表裏面側から合成樹脂が
流れ込んで満たされ、その合成樹脂が貫通孔１６
〜２２を通して短絡される。 When such an exterior 12 is applied, the synthetic resin flows into and fills the through holes 16 to 22 formed in the lead parts 2 and 4 from the front and back sides, as shown in FIG. The synthetic resin is the through hole 16
~22 is shorted.
そして、この外装１２の処理の後、第２図に示
すように、リード部２，４をＬ字形のホーミング
加工の処理とともに所定の長さに切断し、１枚の
リードフレーム上から複数個の発光ダイオードを
得る。 After processing the exterior 12, as shown in FIG. 2, the lead parts 2 and 4 are subjected to an L-shaped homing process and cut to a predetermined length, and a plurality of lead parts are cut from one lead frame. Get a light emitting diode.
このようにリード部２，４を構成して合成樹脂
によつて外装１２を施せば、各リード部２，４の
固定部２６，３２、補助固定部２８，３４および
引出し部３０，３６の平面形状に加えて、貫通孔
１６〜２２を通して合成樹脂がリード部２，４の
表裏面間で短絡し、外装１２とリード部２，４と
を十分に密着させ、両者の密着度を高めることが
できるとともに、リード部２，４間の引張り強度
を高めることができる。 If the lead parts 2 and 4 are constructed in this way and the exterior 12 is made of synthetic resin, the fixed parts 26 and 32, the auxiliary fixed parts 28 and 34, and the drawer parts 30 and 36 of each lead part 2 and 4 will have a flat surface. In addition to the shape, the synthetic resin short-circuits between the front and back surfaces of the lead parts 2 and 4 through the through holes 16 to 22, allowing the exterior 12 and the lead parts 2 and 4 to be brought into close contact with each other, thereby increasing the degree of adhesion between the two. At the same time, the tensile strength between the lead parts 2 and 4 can be increased.
このため、リードフレーム上からリード部２，
４にホーミング加工を施して切断する際に、リー
ド部２，４に曲げ応力が作用した場合、その曲げ
応力に打ち勝つに十分な密着度が得られていると
ともに、貫通孔１６，２２の部分で曲げ応力の吸
収効果も得られるので、第５図に示したような外
装１２とリード部２，４との間に剥離や隙間１４
を発生させることがなく、十分な耐湿性が得ら
れ、外装１２の信頼性を飛躍的に向上させること
ができる。この結果、外装１２の処理工程での不
良チエツクやスクーリングなどが不要になり、検
査時間を短縮できる。 For this reason, the lead portion 2,
When bending stress is applied to the lead parts 2 and 4 when homing and cutting the lead parts 4, sufficient adhesion is obtained to overcome the bending stress, and the through holes 16 and 22 are Since the effect of absorbing bending stress is also obtained, there is no possibility of peeling or gaps 14 between the sheath 12 and the lead parts 2 and 4 as shown in FIG.
Therefore, sufficient moisture resistance can be obtained without causing the occurrence of moisture, and the reliability of the exterior 12 can be dramatically improved. As a result, defect checking and schooling in the processing process of the exterior packaging 12 are no longer necessary, and inspection time can be shortened.
また、実施例のように、リード部２，４に合計
４箇所に十字上に貫通孔１６〜２２を形成すれ
ば、リード部２，４の機械的な強度を低下させる
ことなく、最小限の貫通孔１６〜２２で効率的に
外装１２とリード部２，４との密着度を高めるこ
とができ、しかも、リード部２，４の固定部２
６，３２、補助固定部２８，３４の外形的な平面
状とが相まつて水平方向の回転応力に対して十分
な強度が得られる。 Furthermore, if the through holes 16 to 22 are formed in a cross shape at four locations in total in the lead parts 2 and 4 as in the embodiment, the mechanical strength of the lead parts 2 and 4 can be maintained without reducing the mechanical strength of the lead parts 2 and 4. The through holes 16 to 22 can efficiently increase the degree of adhesion between the sheath 12 and the lead parts 2, 4, and the fixing parts 2 of the lead parts 2, 4 can be effectively improved.
6, 32 and the external planar shape of the auxiliary fixing parts 28, 34 together provide sufficient strength against rotational stress in the horizontal direction.
なお、実施例ではリード部２，４に合計４箇所
に十字上に貫通孔１６〜２２を形成したが、貫通
孔１６〜２２は、リード部２，４の形状や機械的
な強度などを考慮して適当箇所に、四角形や三角
形などの任意形状のものを形成すればよく、実施
例の位置や形状に限定されるものではない。 In the example, the through holes 16 to 22 were formed in a cross shape at four locations in total in the lead parts 2 and 4, but the through holes 16 to 22 were formed in consideration of the shape and mechanical strength of the lead parts 2 and 4. It is sufficient to form an arbitrary shape such as a quadrangle or a triangle at an appropriate location, and the shape is not limited to the position and shape of the embodiment.
実験によれば、リード部２，４にホーミング加
工を施した後の製品において、色素浸透検査を行
つた場合、隙間発生などの不良品の発生は100個
中０％であつた。また、リード部２，４間の引張
り強度についても、従来のものに比較して２倍以
上の強度が確認された。 According to experiments, when a dye penetration test was performed on products after the homing process was performed on the lead parts 2 and 4, the occurrence of defects such as the occurrence of gaps was 0% out of 100 products. Furthermore, the tensile strength between the lead parts 2 and 4 was confirmed to be more than twice that of the conventional one.
以上説明したように、この考案によれば、リー
ド部に貫通孔を形成し、その貫通孔を介して外装
を形成する合成樹脂を短絡させたので、リード部
と外装との密着度およびリード部間の引張り強度
を向上させることができ、リード部にホーミング
加工を施しても外装とリード部との剥離、隙間、
亀裂などの欠陥の発生を防止でき、信頼性の高い
外装ないし封止を実現でき、品質の高い製品を提
供できるとともに、製造工程の簡略化および歩留
りを向上させ、製品コストの低減を図ることがで
きる。
As explained above, according to this invention, a through hole is formed in the lead part, and the synthetic resin forming the exterior is short-circuited through the through hole, so that the adhesion between the lead part and the exterior can be improved. This improves the tensile strength between the lead parts and prevents peeling, gaps, and
It is possible to prevent the occurrence of defects such as cracks, achieve highly reliable packaging or sealing, provide high quality products, simplify the manufacturing process, improve yields, and reduce product costs. can.
第１図はこの考案の発光ダイオードの実施例を
示す水平断面図、第２図は第１図に示した発光ダ
イオードの−線断面図、第３図は従来の発光
ダイオードの実施例を示す水平断面図、第４図は
第３図に示した発光ダイオードの−線断面
図、第５図は第３図に示した発光ダイオードにホ
ーミング加工した最終的な製品に生じた欠陥を表
わす断面図である。
２，４……リード部、１２……外装、１６，１
８，２０，２２……貫通孔。
Fig. 1 is a horizontal sectional view showing an embodiment of the light emitting diode of this invention, Fig. 2 is a - line sectional view of the light emitting diode shown in Fig. 1, and Fig. 3 is a horizontal sectional view showing an embodiment of the conventional light emitting diode. 4 is a cross-sectional view of the light emitting diode shown in FIG. 3, and FIG. 5 is a cross-sectional view showing defects that occur in the final product obtained by homing the light emitting diode shown in FIG. 3. be. 2, 4...Lead part, 12...Exterior, 16,1
8, 20, 22...through hole.
Claims (1)
ダイオードにおいて、リード部の前記合成樹脂内
に埋め込まれる部分に貫通孔を形成し、この貫通
孔を通してリード部の表裏面間に前記合成樹脂を
短絡させてなることを特徴とする発光ダイオー
ド。 In a light emitting diode whose exterior is made of a transparent synthetic resin, a through hole is formed in the part of the lead part that is embedded in the synthetic resin, and the synthetic resin is passed between the front and back surfaces of the lead part through the through hole. A light emitting diode characterized by being short-circuited.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986028668U JPH0429580Y2 (en) | 1986-02-28 | 1986-02-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986028668U JPH0429580Y2 (en) | 1986-02-28 | 1986-02-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62140758U JPS62140758U (en) | 1987-09-05 |
| JPH0429580Y2 true JPH0429580Y2 (en) | 1992-07-17 |
Family
ID=30831851
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986028668U Expired JPH0429580Y2 (en) | 1986-02-28 | 1986-02-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0429580Y2 (en) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3659635B2 (en) * | 2001-04-10 | 2005-06-15 | 株式会社東芝 | Optical semiconductor device |
| DE10131698A1 (en) * | 2001-06-29 | 2003-01-30 | Osram Opto Semiconductors Gmbh | Surface-mountable radiation-emitting component and method for its production |
| JP2004014857A (en) * | 2002-06-07 | 2004-01-15 | Stanley Electric Co Ltd | Chip type optical semiconductor device |
| US9070850B2 (en) | 2007-10-31 | 2015-06-30 | Cree, Inc. | Light emitting diode package and method for fabricating same |
| US7675145B2 (en) | 2006-03-28 | 2010-03-09 | Cree Hong Kong Limited | Apparatus, system and method for use in mounting electronic elements |
| US8866169B2 (en) | 2007-10-31 | 2014-10-21 | Cree, Inc. | LED package with increased feature sizes |
| KR100998233B1 (en) * | 2007-12-03 | 2010-12-07 | 서울반도체 주식회사 | Slim led package |
| JP2010171060A (en) * | 2009-01-20 | 2010-08-05 | Fuji Electric Fa Components & Systems Co Ltd | Lead frame of resin-encapsulated device |
| JP2011060801A (en) * | 2009-09-07 | 2011-03-24 | Nichia Corp | Light-emitting device and method of manufacturing the same |
| JP5347953B2 (en) * | 2009-12-28 | 2013-11-20 | 日亜化学工業株式会社 | Light emitting device and manufacturing method thereof |
| WO2014030530A1 (en) * | 2012-08-23 | 2014-02-27 | 三菱樹脂株式会社 | Package for light-emitting device, and light-emitting device |
| US9601670B2 (en) | 2014-07-11 | 2017-03-21 | Cree, Inc. | Method to form primary optic with variable shapes and/or geometries without a substrate |
-
1986
- 1986-02-28 JP JP1986028668U patent/JPH0429580Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62140758U (en) | 1987-09-05 |
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