WO2014030530A1 - Package for light-emitting device, and light-emitting device - Google Patents

Package for light-emitting device, and light-emitting device Download PDF

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Publication number
WO2014030530A1
WO2014030530A1 PCT/JP2013/071110 JP2013071110W WO2014030530A1 WO 2014030530 A1 WO2014030530 A1 WO 2014030530A1 JP 2013071110 W JP2013071110 W JP 2013071110W WO 2014030530 A1 WO2014030530 A1 WO 2014030530A1
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WO
WIPO (PCT)
Prior art keywords
package
plate portion
molded body
resin molded
emitting device
Prior art date
Application number
PCT/JP2013/071110
Other languages
French (fr)
Japanese (ja)
Inventor
一徳 梅田
純 松井
加藤　幸男
Original Assignee
三菱樹脂株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2012184309A external-priority patent/JP2014041966A/en
Priority claimed from JP2013087543A external-priority patent/JP2014116575A/en
Application filed by 三菱樹脂株式会社 filed Critical 三菱樹脂株式会社
Publication of WO2014030530A1 publication Critical patent/WO2014030530A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other

Definitions

  • the present invention relates to a light emitting device package on which a light emitting element such as an LED element is mounted, and a light emitting device using the package.
  • FIGS. 17 is a perspective view of the light emitting device 100
  • FIGS. 18a and 18b are sectional views taken along lines XVIIIa-XVIIIa and XVIIIb-XVIIIb of FIG.
  • FIG. 19 is a plan view of the package 110.
  • the package 110 of the light emitting device 100 includes a first lead electrode 101, a second lead electrode 102, and a resin molded body 103 configured to be integrated with the lead electrodes 101 and 102.
  • the resin molded body 103 has an annular shape having a hole-shaped cup portion 103a, and a part of each of the lead electrodes 101 and 102 is exposed at the bottom of the cup portion 103a.
  • the outer ends of the lead electrodes 101 and 102 extend outward from the outer peripheral edge of the resin molded body 103.
  • a light emitting element 104 such as an LED is fixed on the lead electrode.
  • the light emitting element 104 is connected to the lead electrodes 101 and 102 by metal thin wires 105 and 106.
  • a bridge portion 103b made of resin is filled.
  • the bridge portion 103b crosses the bottom of the cup portion 103a in the string direction and is integrated with the resin molded body 103.
  • the lead electrodes 101 and 102 are exposed on the bottom surface of the light emitting device 100.
  • a stepped portion 102a is provided at the side end of the lead electrodes 101 and 102 as shown in FIG. . Since the edge of the stepped portion 102a is embedded in the resin molded body 103, the lead electrodes 101 and 102 are prevented from being peeled off or lifted up. Instead of providing the stepped portion 102 a, the end surfaces of the side end portions of the lead electrodes 101 and 102 may be inclined downward, and the upper side of the end surfaces may be embedded in the resin molding 103.
  • FIG. 21 is a cross-sectional view of a mold for molding the resin molded body 103 of the package 110.
  • the resin is filled into the cavity 113 with an injection device or the like while the lead electrodes 101 and 102 are sandwiched between the upper mold 111 and the lower mold 112, and the resin molded body 103 is molded.
  • symbol 111a in FIG. 21 is the convex part provided in the upper mold
  • the lead electrodes 101 and 102 are sandwiched between the convex portion 111a and the lower mold. Part of the periphery of the lead electrodes 101 and 102 extends into the cavity 113.
  • the bridge portion 103b is centered in the z direction (up and down direction in FIG. 20a) as shown in FIGS. 20a and 20b.
  • the package 110 may be deformed so as to be bent, and breakage may occur as shown in FIG. 20c. This tendency becomes prominent when the resin is soft such as a silicone resin. In addition, this is remarkable when the difference in linear expansion coefficient between the resin molded body 103 and the lead electrodes 101 and 102 is large.
  • the strength and bending rigidity of the four corners of the package 110 are low, and the resin molded body is damaged in the vicinity of the four corners or deformed in the z direction, whereby the lead electrodes 101 and 102 to the resin molded body 103 are The stepped portions 101 a and 102 a are not bite, and the lead electrodes 101 and 102 are easily lifted from the resin molded body 103.
  • the lead electrodes 101 and 102 are lifted from the resin molded body 103, outside air enters the gaps, and deterioration and discoloration are likely to occur on the upper surfaces of the lead electrodes 101 and 102. This tendency becomes prominent when the resin is soft such as a silicone resin.
  • the present invention has high strength and rigidity in the vicinity of the corner portion, prevents the resin molded body from being damaged in the vicinity of the corner portion, and prevents the lead electrode from peeling off or floating from the resin molded body.
  • a second object is to provide a device package and a light emitting device.
  • FIG. 21 is a bottom view of the package 110.
  • an object of the present invention is to provide a light emitting device package and a light emitting device in which burrs on the back surface of the lead electrode are prevented.
  • an object of the present invention in another aspect, is to provide a light emitting device package and a light emitting device in which the suspension leads are stably held.
  • the light emitting device package of the present invention includes first and second lead electrodes arranged with one side facing each other, and a resin molded body molded so as to be integrated with the lead electrode.
  • the molded body has a ring shape, and a cup portion for arranging light emitting elements is provided inside the resin molded body.
  • the second lead electrode is provided with reinforcing pieces extending from both ends of the one side in the longitudinal direction and extending along the side of the first lead electrode.
  • An overhanging portion that protrudes toward the first lead electrode is provided on the leading end side in the extending direction of the reinforcing piece portion.
  • At least the extending direction front end side of the reinforcing piece portion is embedded in the resin molded body.
  • the first lead electrode is provided with a recessed portion in a part of the side portion along the reinforcing piece portion that overlaps the resin molded body.
  • the second lead electrode is preferably provided with second reinforcing piece portions extending in opposite directions to the reinforcing piece portions on both ends in the side length direction of the side portion on the opposite side to the one side. .
  • the second lead electrode is an extended portion in which the central portion in the longitudinal direction of the side opposite to the one side extends outward, and the resin molding of the side portion of the extended portion. It is preferable that the recessed part is provided in a part of location which overlaps with a body.
  • the tip end portion of the suspension lead is inserted into the resin molded body, and the tip portion of the suspension lead is bent so as to be separated from the bottom surface of the resin molded body toward the distal end side.
  • the suspension lead preferably has a smaller thickness toward the tip side.
  • the cup portion is recessed from one surface (hereinafter referred to as an upper surface) of the resin molded body toward the other surface (hereinafter referred to as a bottom surface).
  • the second lead electrode has a long plate portion and a second end plate portion that extends to one side of the long plate portion and extends outward from the resin molded body,
  • the first lead electrode is connected to the main plate portion facing the long plate portion, the relay plate portion connected to the opposite side of the main plate portion to the long plate portion, and connected to the opposite side of the main plate portion of the relay plate portion,
  • a first end plate portion extending outward of the resin molded body, and at least a part of an upper surface of the main plate portion is exposed to the cup portion, and at least a part of the bottom surface is a package. It is exposed on the bottom surface.
  • width W 1 of the distal end portion of the second end plate portion than the longitudinal direction of the exposed width W 2 is smaller at the bottom of the package in the longitudinal center portion of the long plate portion.
  • a second reinforcing piece portion extends from both ends of the long plate portion in the longitudinal direction in the direction opposite to the first reinforcing piece portion.
  • the reinforcing piece portion is provided with a second protruding portion that protrudes from a side portion opposite to the main plate portion.
  • the central portion in the longitudinal direction of the relay plate portion of the first lead electrode is exposed on the bottom surface of the package, and both end sides in the longitudinal direction of the relay plate portion are embedded in the resin molded body, it is smaller the second end plate portion of the distal width W 3 than exposed width W 4 to the package bottom surface of the relay plate.
  • the second lead electrode has an extended plate portion that continues to the relay plate portion and extends to a corner portion of the package, and the extended plate portion is embedded in the resin molded body. Is preferred.
  • the extending plate portion is provided with a constraining portion including a convex portion, a concave portion or an opening for constraining the resin molded body.
  • a third projecting portion projecting from the side of the main plate portion on the reinforcing piece portion side toward the reinforcing piece portion is provided.
  • a side of the reinforcing piece portion on the side of the main plate portion is provided with a receding portion that is set back from the main plate portion so as to face the third projecting portion.
  • the light emitting device of the present invention includes the package of the present invention and a light emitting element mounted on the package.
  • the second lead electrode is provided with a reinforcing piece portion extending along the side portion of the first lead electrode.
  • the reinforcing piece extends so as to cross a resin portion (bridge portion) formed between the first and second lead electrodes. Therefore, when a force is applied so that the package bends around the bridge portion, the force is countered by the reinforcing piece portion, and the bending deformation of the package is prevented.
  • the reinforcing piece portion reinforces the corner portion of the resin molded body, whereby the strength and rigidity of the corner portion of the package is improved, and deformation and breakage of the resin molded body at the corner portion are prevented, and this is caused. The peeled and lifted lead electrodes are prevented.
  • the resin molded body is further effective for deformation and damage of the resin molded body, peeling and lifting of the lead electrode, and resin molded body.
  • the first and second lead electrodes due to poor resin filling in the bridge portion, facilitating resin inflow into the resin portion (bridge portion) formed between the first and second lead electrodes. It is possible to prevent inflow of outside air between them and sealing material leakage failure.
  • the strength and rigidity of the package can be further increased by providing the reinforcing piece with an overhanging portion that protrudes toward the first lead electrode. Further, it is possible to prevent a gap from being opened in a resin portion (bridge portion) formed between the first and second lead electrodes.
  • the strength and rigidity of the package can be further increased.
  • the deformation of the resin molded body is prevented, and the lead electrode is prevented from being peeled off or lifted due to the deformation.
  • the longitudinal center portion of the long plate portion of the second lead electrode may have exposed bottom of the package, the width W 1 of the distal end side of the end plate portion of the second lead electrode to the package bottom surface of the long plate portion is made smaller than the exposure width W 2 of the burr occurrence in the end plate portion of the second it can be prevented.
  • the package bottom surface of the relay plate and the second width W 3 of the distal end side of the projecting portion of the first lead electrode It is made smaller than the exposure width W 4 of the burr generation is prevented in the first end plate portion.
  • the strength and rigidity of the package can be further increased by providing the long reinforcing plate portion with the second reinforcing piece portion and providing the extending plate portion with the restraining portion for restraining the resin molded body. Further, it is possible to prevent a gap from being opened in a resin portion (bridge portion) formed between the first and second lead electrodes.
  • the reinforcing piece part By providing the reinforcing piece part with an overhanging part projecting to the opposite side of the main plate part of the first lead electrode or the main plate part side, or a retreating part away from the main plate part, the strength and rigidity of the package can be increased. In addition, deformation of the resin molded body is prevented, and peeling and lifting of the lead electrode due to this are prevented.
  • the holding of the package is stabilized by bending the tip of the suspension lead that supports the package.
  • the thickness of the tip (claw) of the suspension lead toward the tip the thickness of the resin existing below the claw (on the bottom of the package) increases, and the holding strength of the package Will increase.
  • the electrode lead in the resin molded body near the tip of the suspension lead (claw portion) it is possible to secure the electrode lead in the resin molded body near the tip of the suspension lead (claw portion), and the strength and rigidity of the molded resin near the tip of the suspension lead (claw portion). It can be secured.
  • FIG. 2 is a sectional view taken along line II-II in FIG.
  • FIG. 3 is a view taken along the line III-III in FIG. 1.
  • FIG. 5a is a plan view of a package constituting the light emitting device of FIG. 1
  • FIG. 5b is a plan view of a lead electrode of the package.
  • FIG. 7 is a sectional view taken along line VII-VII in FIG.
  • FIG. 8 is a sectional view taken along line VIII-VIII in FIG. 5b.
  • FIG. 5b is a sectional view taken along line XX in FIG. 5a.
  • 11a is a sectional perspective view taken along line XI-XI in FIG. 5b
  • FIG. 11b is a sectional view taken along line XI-XI. It is the XII-XII sectional view taken on the line of FIG. It is the XIII-XIII sectional view taken on the line of FIG. It is a top view of the package with which the suspension lead was connected.
  • FIG. 15 is a cross-sectional view taken along line XV-XV in FIG. 14.
  • FIG. 16 is an enlarged view of the vicinity of the suspension lead in FIG. 15. It is a perspective view of the conventional light-emitting device.
  • FIG. 18a is a cross-sectional view taken along line XVIIIa-XVIIIa of FIG. 17, and FIG. 18b is a cross-sectional view taken along line XVIIIb-XVIIIb.
  • It is a top view of the package of the light-emitting device of FIG. 20a, 20b, 20c and 20d are sectional views taken along the line XX-XX in FIG.
  • 25a, 25b and 25c are configuration diagrams of lead electrodes.
  • FIG. 26a is a sectional view taken along line XXVIa-XXVIa in FIG. 26b
  • FIG. 26b is a plan view of the package. It is a top view of the package which concerns on embodiment. It is the top view of FIG. 27 which showed the external shape of the lead electrode with the broken line.
  • FIG. 6 is a layout view of lead electrodes of a package.
  • FIG. 30 is a perspective view from below of the lead electrode of FIG. 29. It is a bottom view of the package of FIG.
  • FIG. 32 is a sectional view taken along line 32-32 in FIG. 27.
  • FIG. 34 is a cross-sectional view taken along line 33-33 of FIG.
  • FIG. 34 is a cross-sectional view taken along line 34-34 in FIG. 27.
  • FIG. 35 is a sectional view taken along line 35-35 in FIG. 27.
  • FIG. 36 is a sectional view taken along line 36-36 in FIG. 27.
  • FIG. 37 is a cross-sectional view taken along line 37-37 of FIG. 27. It is a layout view showing another lead electrode of the package.
  • the light emitting device 1 has a package 2 including a first lead electrode 10, a second lead electrode 20, and a resin molded body 3 molded so as to be integrated with the lead electrodes 10 and 20.
  • the resin molded body 3 has an annular shape having a cup portion 3a, and the outer peripheral shape thereof is substantially square.
  • the lead electrodes 10 and 20 are partially exposed at the bottom of the cup portion 3a.
  • the outer ends of the lead electrodes 10 and 20 extend outward from the outer peripheral edge of the resin molded body 3.
  • a light emitting element 4 such as an LED is fixed on the lead electrode 20 in the cup portion 3a.
  • the light emitting element 4 is connected to the lead electrodes 10 and 20 by metal thin wires 5 and 6. Between the facing edges of the lead electrodes 10 and 20, a bridge portion 3b made of resin is filled. The bridge portion 3b crosses the bottom portion of the cup portion 3a in the string direction and is integrated with the resin molded body 3.
  • the light emitting element 4 on the lead electrode 20 may be single or plural.
  • FIG. 1 shows a plurality of examples.
  • step portions 10 a and 20 a are provided at necessary positions on the peripheral edge portion on the bottom surface side of the lead electrodes 10 and 20. Since the end edges of the stepped portions 10a and 20a are embedded in the resin molded body 3, the lead electrodes 10 and 20 are prevented from being peeled off or lifted up.
  • the angle of the corners of the stepped portions 10a and 20a is not limited to a right angle. Further, as shown in FIG. 23, the corner may have an arcuate cross-sectional shape. Instead of providing the stepped portions 10a and 20a, as shown in FIG. 24, the end surfaces of the side end portions of the lead electrodes 10 and 20 may be inclined downward and the upper side of the end surfaces may be embedded in the resin molded body 3. Good.
  • FIGS. 5a is a plan view of the light emitting device package 2 before the light emitting element 4 is mounted
  • FIG. 5b is a plan view of the lead electrodes 10 and 20, and the arrangement of the lead electrodes 10 and 20 in FIG.
  • the arrangement of the lead electrodes 10 and 20 in the package 2 of 5a is the same.
  • the lead electrode 10 has a thin plate shape in a substantially trapezoidal plan view shape having a rear edge 11 facing the bridge portion 3b, a front edge 12 protruding from the resin molded body 3, and a side edge connecting these. .
  • a recessed portion 13 that bites in the center direction of the plate (the direction connecting the side edges) is provided at a part of the position overlapping the resin molded body 3.
  • the side facing the notch 13 is formed on the first side edge 14 on the front edge side and the second side edge 15 on the rear edge side of the notch 13.
  • a stepped portion 10a is provided in the portion.
  • the step portion 10 a is also provided over the entire side of the rear edge 11.
  • the recesses 13 are provided at positions where the recesses 13 are not exposed to the bottom of the cup portion 3a of the resin molded body 3 so that the recesses 13 are arranged closer to the line VIII-VIII in FIG. Since generation
  • the recess 13 may be extended and its end closer to the line VIII-VIII, but the second side edge 15 is extended and the recess 13 is formed at the tip. It is preferable to provide a structure in which the recesses 13 are arranged closer to each other with respect to the line VIII-VIII because the effect of preventing peeling and lifting by the stepped portion 10a is also improved.
  • the step portion 10a may be either the first side edge portion 14 on the front edge side or the second side edge portion 15 on the rear edge side.
  • the reinforcement is improved against peeling and lifting.
  • the lead electrode 20 has a thin plate shape having a rear edge 21 facing the bridge portion 3b, a front edge 22 protruding from the resin molded body 3, and a side edge connecting them.
  • a central portion in the longitudinal direction of the front edge 22 is an extended portion 28 that extends outward in a substantially trapezoidal shape.
  • a recessed portion 23 is provided at a position overlapping the resin molded body 3 so as to bite in the center direction of the plate (the direction connecting the side edges).
  • a step 20a is provided on the side facing the recess 23.
  • the stepped portion 20 a is also provided over substantially the entire side of the trailing edge 21.
  • the recesses 23 are provided at positions where the recesses 23 are not exposed to the bottom of the cup portion 3a of the resin molded body 3 so that the recesses 23 are closer to the line VIII-VIII in FIG. Since generation
  • the recess 23 may be extended and its end closer to the line VIII-VIII, but the second side edge 25 is extended and the recess 23 is formed at the tip.
  • the step 20a may be either the first side edge 24 on the front edge side or the second side edge 25 on the rear edge side.
  • a projecting piece portion 26 extending outward is provided on the side portion of the main plate portion 27 between the rear edge 21 and the front edge 22 of the lead electrode 20.
  • a stepped portion 20 a is formed on the bottom surface side of the projecting piece portion 26.
  • a first reinforcing piece 30 is extended from both ends of the rear edge 21 of the lead electrode 20 (both ends in the extending direction of the bridge 3b) in a direction orthogonal to the bridge 3b.
  • the reinforcing piece 30 extends to the vicinity of the corner 3 ⁇ / b> C of the resin molded body 3.
  • Each reinforcing piece 30 has a proximal end portion 31 on the proximal end side in the extending direction and a distal end portion 32 on the distal end side with respect to the proximal end portion 31.
  • the upper surface of the base end portion 31 is flush with the main plate portion 27, but the upper surface of the distal end portion 32 rises more than that, and a step-shaped portion 33 is formed between them.
  • the bottom surface of the first reinforcing piece portion 30 is higher than the bottom surface of the main plate portion 27 by a height difference d, and the resin molded body 3 is molded below the reinforcing piece portion 30.
  • the resin sometimes wraps around, and the entire reinforcing piece 30 is embedded in the resin molded body 3.
  • only the distal end portion 32 of the reinforcing piece portion 30 may be embedded in the resin molded body 3.
  • the tip 32 is thinned by coining or the like, the top surface of the tip 32 is flush with the main plate 27, and the bottom of the tip 32 rises from the bottom of the main plate 27 to ensure a height difference d. May be.
  • the height difference d it is effective for deformation and breakage of the resin molded body, peeling and lifting of the lead electrodes, and made of resin formed between the first and second lead electrodes. Resin inflow into the part (bridge part) is facilitated from the gap of the part of the height difference d, outside air inflow between the first and second lead electrodes due to defective resin filling in the bridge part, sealing material leakage failure Can be prevented.
  • the side part on the lead electrode 10 side of the tip part 32 is an overhang part 34 that projects toward the lead electrode 10.
  • the second reinforcing piece 40 is extended from both ends of the front edge 22 of the lead electrode 20 in the extending direction of the extending portion 28 (in the direction orthogonal to the bridge portion 3b).
  • the reinforcing piece portion 40 extends to the vicinity of the corner portion 3D of the resin molded body 3.
  • Each reinforcing piece 40 includes a base end 41 on the base end side in the extending direction and a front end 42 on the front end side of the base end 41.
  • the upper surface of the base end portion 41 is flush with the main plate portion 27, but the upper surface of the distal end portion 42 rises more than that, and a step-shaped portion 43 is formed between the two.
  • the bottom surface of the second reinforcing piece portion 40 is higher than the bottom surface of the main plate portion 27 by the height difference d, and the resin molded body 3 is disposed below the second reinforcing piece portion 40.
  • the resin wraps around at the time of molding, and the entire reinforcing piece 40 is embedded in the resin molded body 3.
  • the distal end portion 42 of the reinforcing piece portion 40 may be embedded in the resin molded body 3.
  • a side portion of the distal end portion 42 on the extending portion 28 side is a protruding portion 44 that protrudes toward the extending portion 28.
  • the tip portion 42 is thinned by coining or the like, the top surface of the tip portion 42 is flush with the main plate portion 27, and the bottom surface of the tip portion 42 rises from the bottom surface of the main plate portion 27 to ensure a height difference d. May be.
  • the package 2 is manufactured by molding the resin molded body 3 by arranging the lead electrodes 1 and 2 in the mold as shown in FIG. 21 and supplying resin to the cavity.
  • the second side edge portions 15 and 25 are arranged so as to follow the contour of the convex portion 111a of the upper mold 111 provided to form the cup portion 3a of the resin molded body 3, so that the nearest portion thereof is the upper mold. Since it is clamped between the convex part 111a (FIG. 21) and the lower mold
  • the width between the recesses 13 and 13 of each lead electrode 10 and 20 and between the recesses 23 and 23 is a narrowed portion having a small width, when molding the resin molded body 3, between the recesses 13 and 13.
  • the upper die and the lower die, which are larger between the recesses 23 and 23, are not lifted from the lower die between 14, 14 and 24, 24, and the generation of burrs is prevented.
  • the reinforcing piece 30 extends toward the corner 3C so as to cross both ends of the bridge 3b. Therefore, with respect to the package 2, when a force for bending the axis A 1 around along the bridge portion 3b is applied, this force is opposed by the reinforcing piece 30, the deformation of the package 2 can be prevented.
  • the reinforcing piece portions 30 and 40 are present in the corner portions 3C and 3D of the resin molded body 3, the strength and rigidity of the resin molded body 3 in the vicinity of the corner portions 3C and 3D are high.
  • the reinforcing piece portions 30, 40 and the resin molded body 3 are firmly integrated, The strength and rigidity of the resin molded body 3 at the corner portions 3C and 3D are high.
  • the protruding pieces 34 and 44 are provided on the reinforcing piece portions 30 and 40. Therefore, a high bending stiffness of the shaft A 2 around including ⁇ piece 34, 44 of the package 2.
  • a large number of packages 2 are connected to a lead frame (not shown) through suspension leads 50.
  • the tip portion of the suspension lead 50 is bent away from the bottom surface of the package 2 toward the tip side to form a claw-like portion 51.
  • the bending angle ⁇ on the bottom side of the claw-like portion 51 is preferably about 10 to 80 °, particularly about 30 to 60 °.
  • the thickness b of the tip of the claw-like portion 51 is made smaller than the thickness a of the main body portion side of the suspension lead 50, and the thickness is made smaller toward the tip side of the claw-like portion 51. Thereby, the thickness of the resin existing on the bottom surface side of the claw-like portion 51 is increased, and the holding force of the package 2 by the suspension leads 50 can be increased.
  • the reinforcing piece portions 30 and 40 are embedded in the corner portions 3C and 3D of the package 2 to increase the rigidity of the package 2 at the corner portions.
  • the claw-like portion 51 is prevented from coming off and the holding of the package 2 is stabilized.
  • the claw-shaped portion 51 of the suspension lead 50 is provided in the vicinity of the corner portions 3C and 3D of the package 2. Is provided, the space for embedding the reinforcing pieces 30 and 40 of the corner portions 3C and 3D of the package 2 can be secured, so that the strength and rigidity of the resin molded body 3 at the corner portions 3C and 3D can be secured high. And the suspension lead which raises the retention strength of the package 2 can be comprised.
  • FIG. 25a is a plan view of a lead electrode used in a package according to another embodiment, and FIGS. 25b and 25c are cross-sectional views taken along lines XXVb-XXVb and XXVc-XXVc in FIG. 25a.
  • a notch 26k is provided in the protruding piece 26A of the lead electrode 20A.
  • a plurality of cutout portions 26k (three in this embodiment) are provided at intervals in the longitudinal direction of the protruding piece portion 26A.
  • the number of notches 26k is not limited to a plurality, and may be one.
  • the other configuration of the lead electrode 20A in FIG. 25a and the configuration of the lead electrode 10 are the same as those in the above embodiment, and the same reference numerals indicate the same parts.
  • the integrity of the lower resin and the upper resin of the step portion 20a is improved, and the projecting piece portion 26A is more firmly held by the resin molded body 3. Further, the resin filling property to the lower side of the stepped portion 20a is also improved.
  • the lead electrode 20B used in the package 2 of FIGS. 26a and 26b has a rib shape in which the protruding piece portion 26B is folded upward with respect to the main plate portion 27.
  • FIG. The other configuration of the lead electrode 20B and the configuration of the lead electrode 10 are the same as those in the above embodiment, and the same reference numerals indicate the same parts.
  • 26b is a plan view of the package, and FIG. 26a is a sectional view taken along line XXVIa-XXVIa of FIG. 26b.
  • the lead electrode 20B has a high bending rigidity in the vicinity of the projecting piece 26B, and deformation of the package 2 is prevented.
  • a package 2H according to another embodiment will be described with reference to FIGS.
  • the package 2H includes a second lead electrode 80, a first lead electrode 60, and a resin molded body 3H formed so as to be integrated with the lead electrodes 80 and 60.
  • the resin molded body 3H has a ring shape having a concave hole-shaped cup portion 3r, and the outer peripheral shape thereof is substantially square.
  • the upper surface of one corner portion of the resin molded body 3H is a notch-shaped recess 3h.
  • the recess 3h is provided to identify the direction of the package 2H.
  • the end plate portions 81 and 63 of the lead electrodes 80 and 60 extend outward (in opposite directions) from the outer peripheral edge of the resin molded body 3H.
  • a light emitting element 4 such as an LED (not shown in FIGS. 27 to 37) is fixed on the main plate 61.
  • the light emitting element 4 is connected to the long plate portion 82 and the main plate portion 61 by thin metal wires 5 and 6 (not shown in FIGS. 27 to 37) by wire bonding.
  • a bridge portion 3v made of resin is filled.
  • the bridge portion 3v connects the resin portions 3j and 3j.
  • the bridge portion 3v and the resin portion 3j are integrated with the resin molded body 3H.
  • the second lead electrode 80 includes a second end plate portion 81 extending from one side of the resin molded body 3H, a long plate portion 82 connected to the end plate portion 81, and the long plate portion.
  • a second overhanging portion 84, an inward first overhanging portion 96 overhanging from the main plate portion 61 side on the distal end side of each reinforcing piece portion 83, and an end plate portion 81 side of each reinforcing piece portion 83 are extended.
  • a cutout portion 97 is provided in the long plate portion 82 at an intersection corner between the reinforcing piece portion 83 and the long plate portion 82.
  • stepped portions 91 and 91 are provided on the back surface in the middle of the long plate portion 82 in the longitudinal direction (Y direction in FIG. 29).
  • the step portion 91 extends in a direction orthogonal to the longitudinal direction of the long plate portion 82 (X direction in FIG. 29).
  • the width W 1 in the Y direction of the second end plate portion 81 is smaller than the distance W 2 between the step portions 91 and 91.
  • the back surface 92 of the long plate portion 82 and the back surface of the second reinforcing piece portion 85 on both ends in the Y direction from the step portion 91 are the center portion and the second end plate portion of the long plate portion 82 corresponding to the height of the step portion 91. It is higher than the back surface of 81.
  • the back surface of the first reinforcing piece 83 is flush with the back surface 92 except for the groove 94.
  • the upper surface side of the edge portion along the main plate portion 61 of the long plate portion 82 is a protruding piece portion 82t.
  • the back surface of the projecting piece portion 82 t is higher than the center portion of the long plate portion 82 and the back surface of the second end plate portion 81 by the rising height of the stepped portion 93.
  • the stepped portion 93 extends along the longitudinal direction of the long plate portion 82 and reaches both end edges of the second lead electrode 80.
  • the reinforcing piece 83 is provided with a stepped portion 98 parallel to the stepped portion 93.
  • the step portion 98 is located on the distal end side of the reinforcing piece portion 83 with respect to the step portion 93.
  • a groove 94 is formed between the stepped portions 93 and 98. The bottom surface of the groove portion 94 is flush with the back surface of the protruding piece portion 82t.
  • the center portion of the long plate portion 82 and the second end plate portion 81 are located at the lowest position and are exposed on the bottom surface of the resin molded body 3H.
  • the both ends of the long plate portion 82 in the Y direction, the reinforcing piece 83, and the second reinforcing piece 85 are embedded in the resin molded body 3H. A part of the upper surface of the long plate portion 82 is exposed in the cup portion 3r. One end of the thin metal wire 5 is connected to the exposed upper surface of the long plate portion 82.
  • the reinforcing piece portion 83 Since the overhang portions 84 and 96 are provided in the reinforcing piece portion 83, the reinforcing piece portion 83 and the resin molded body 3H are firmly integrated. Instead of the overhang portions 84 and 96, the reinforcing piece portion 83 may be provided with a plurality of small overhang portions.
  • the second reinforcing piece 85 extends toward the corner 3C ′ of the resin molded body 3H, and the resin molded body 3H of the corner 3C ′ is reinforced.
  • the first lead electrode 60 includes a substantially square main plate portion 61, a relay plate portion 62 that continues to the main plate portion 61, and a second end plate portion 63 that continues to the relay plate portion 62.
  • a pair of extending plate portions 64, 64 extending from the relay plate portion 62 to both ends in the Y direction, and a restraining portion 65 extending from each extending plate portion 64 toward the corner portion 3D ′ of the package 2H. , 65.
  • the restricting portion 65 extends to the opposite side of the reinforcing piece portion 83 with the extending plate portion 64 interposed therebetween.
  • the main plate portion 61 is disposed in a U-shaped frame-shaped portion composed of the reinforcing piece portions 83 and 83 and the long plate portion 82 of the lead electrode 80.
  • a predetermined gap is provided between the main plate portion 61 and the reinforcing piece portions 83 and 83 and the long plate portion 82. This gap is filled with resin of the resin molded body 3H.
  • the resin molded body 3H between the main plate portion 61 and the long plate portion 82 is a bridge portion 3v that connects the two.
  • the bottom surface side is notched and the top surface side is a protruding piece portion 61t, and this protruding piece portion 61t is in the resin molded body 3H. Buried. As a result, the main plate portion 61 is prevented from floating in the bottom direction from the resin molded body 3H.
  • a third projecting portion 72 projecting sideways is provided on the long plate portion 82 side of the side portion (reinforcing piece portion 83 side) of the main plate portion 61.
  • the back surface of the third overhang portion 72 is flush with the back surface of the protruding piece portion 61t.
  • the back surface of the projecting piece portion 61t is higher than the back surface of the main plate portion 61 on the center side by the rising height of the stepped portion 70.
  • the stepped portion 70 reaches the end of the first lead electrode 60 through the relay plate portion 62.
  • the back surface of the boundary between the relay plate portion 62 and the extended plate portion 64 is a stepped portion 71.
  • the step portion 71 is parallel to the step portion 70, and a gap 73 is formed between the step portions 70 and 71.
  • the width W 3 in the Y direction of the first end plate portion 63 is smaller than the width W 4 between the step portions 70 and 70 in the relay plate portion 62.
  • the bottom surface of the main plate portion 61 excluding the projecting piece portion 61t, the relay plate portion 62 between the step portions 70 and 70, and the end plate portion 63 is flush.
  • the bottom surfaces of the projecting piece portion 61 t and the groove portion 73 are higher than the bottom surface of the main plate portion 61 by the rising height of the stepped portion 70.
  • the bottom surface of the extension plate portion 64 and the bottom surface of the restraint portion 65 are flush with each other.
  • the bottom surfaces of the extension plate portion 64 and the restraining portion 65 are lower than the bottom surface of the groove portion 73 by the rising height of the stepped portion 71.
  • the rising height of the stepped portion 71 is smaller than the rising height of the stepped portion 70. Therefore, the bottom surfaces of the extension plate portion 64 and the restraint portion 65 are higher than the bottom surfaces of the main plate portion 61, the relay plate portion 62, and the end plate portion 63. Is located.
  • the bottom surface of the main plate portion 61 other than the projecting piece portion 61t, the relay plate portion 62 between the step portions 70, 70, and the end plate portion 63 is flush with the bottom surface of the resin molded body 3H, and the bottom surface of the resin molded body 3H, respectively. It is exposed to.
  • the projecting piece portion 61t, the groove portion 73, the extending plate portion 64, and the restricting portion 65 are higher than the main plate portion 21 and the end plate portion 23, and are embedded in the resin molded body 3H as a whole. Therefore, the width W 3 in the Y direction of the tip end portion of the first end plate portion 63 is smaller than the exposed width W 4 of the relay plate portion 62 on the bottom surface of the resin molded body 3H.
  • the projecting portion 61t of the three sides of the main plate portion 61 is embedded in the resin molded body 3H, and is firmly held by the resin molded body 3H.
  • the restricting portion 65 extends from the extending plate portions 64 and 64 toward the corner portion 3D ′ of the package 2H, and the resin molded body 3H of the corner portion 3D ′ is reinforced by the extending plate portion 64 and the restricting portion 65. Has been.
  • the resin portions 3j and 3j cover the projecting piece portion 61t and the reinforcing piece portion 83 on the bottom surface of the cup portion 3r of the resin molded body 3H.
  • the bridge portion 3v is integral with the resin portions 3j and 3j.
  • the upper surfaces of the resin portions 3j, 3j are inclined surfaces that are downwardly inclined toward the main plate portion 61, but may not be inclined. That is, the upper surfaces of the resin portions 3j and 3j may be parallel to the main plate portion 61.
  • the upper surface of the bridge portion 3v rises above the upper surfaces of the main plate portion 61 and the long plate portion 82, that is, the upper surfaces of the protruding piece portions 61t and 82t, and the upper edges of the protruding piece portions 61t and 82t. Covered. This prevents the protrusions 61t and 82t from floating upward, and prevents the resin from leaking to the upper surfaces of the main plate portion 61 and the long plate portion 82 when the resin molded body 3H is injection molded. The In addition, the rigidity of the bridge portion 3v is increased.
  • the package 2H is formed by installing lead electrodes 80 and 60 in a mold and injecting resin.
  • the width W 1 of the second end plate portion 81 is smaller than the exposed width (width between the step portions 91 and 91) W 2 of the long plate portion 82. For this reason, when the resin molded body 3H is injection-molded, the resin is prevented from entering between the back surface on the base end side of the second end plate portion 81 and the inner surface of the molding die, and burrs are generated. Is prevented.
  • W 1 is preferably about 40 to 90% of W 2 and particularly about 50 to 80%.
  • the width W 3 of the first end plate portion 63 is smaller than the exposed width (width between the stepped portions 70, 70) W 4 of the relay plate portion 62. For this reason, when the resin molded body 3H is injection-molded, the resin is prevented from entering between the back surface on the base end side of the first end plate portion 63 and the inner surface of the molding die, and burrs are generated. Is prevented.
  • W 3 is preferably about 40 to 90%, more preferably about 50 to 80% of W 4 . Note that the upper surfaces of the lead electrodes 60 and 80 are all flush.
  • the projecting piece portions 82t and 61t having a small wall thickness, both end sides of the long plate portion 82, and the reinforcing piece portion 83 can be formed by subjecting a metal plate to a coining process to reduce the wall thickness.
  • the reinforcing piece 83 extends in the direction orthogonal to the bridge 3v (X direction) at both ends in the longitudinal direction (Y direction) of the bridge 3v. Therefore, when a force for bending the package 2H around the axis A 1 ′ along the bridge portion 3v is applied, this force is countered by the reinforcing piece portion 83, and deformation of the package 2H is prevented. .
  • the long plate portion 82 of the lead electrode 80 and the relay plate portion of the lead electrode 60 extend in the Y direction at both ends in the X direction of the resin portion 3j between the main plate portion 61 and the reinforcing piece portion 83. 62 and the extension plate part 64 exist. Therefore, when a force to bend around the axis A 2 ′ is applied to the package 2H, this force is countered by the long plate portion 82, the relay plate portion 62, and the extending plate portion 64, and the package 2H. Is prevented from being deformed.
  • both end sides in the Y direction of the long plate portion 82 of the lead electrode 80 and the reinforcing piece portion 83, and both end sides of the relay plate portion 62 in the Y direction of the lead electrode 60 and the extending plate portion 64 are resin molded. Embedded in the body 3H. Further, groove portions 94 and 73 are provided in the reinforcing piece portion 83 and the relay plate portion 62, and the resin covering thickness of the groove portions 94 and 73 is increased. Thereby, the coupling
  • the strength and rigidity of the resin molded body 3H near the corner portions 3C ′ and 3D ′ are increased. It becomes high and can prevent the chipping and breakage at the corner portions 3C ′ and 3D ′ of the resin molded body 3H.
  • the second reinforcing piece 85 and the restraining portion 65 protrude in the X direction of FIG. Therefore, even when a deformation force in the Y direction in FIG. 29 is applied, the resin molded body 3H is restrained by the second reinforcing piece portion 85 and the restraining portion 65, and the gap opening can be prevented. Leakage can be prevented.
  • the second reinforcing piece 85 and the restraining portion 65 may be a cut recess, a protruding protrusion, or a rising protrusion.
  • the reinforcing piece portion 83 is provided with an outward second overhang portion 84 and an inward first overhang portion 96, and the main plate portion 61 is directed toward the reinforcing piece portion 83.
  • projection part 72 is protrudingly provided.
  • These overhang portions 84, 96, and 72 bite into the resin molded body 3H. Therefore, even if an external force in the X direction is applied to increase the width of the bridge portion 3v, that is, the interval between the main plate portion 61 and the long plate portion 82, this external force is countered by the overhang portions 84, 96, 72, An increase in the width of the bridge portion 3v is prevented.
  • the lead electrodes 80 ′ and 60 ′ in FIG. 38 are reinforced in accordance with the extension length of the third extension portion 72 from the main plate portion 61 larger than that of the package 2H in FIGS.
  • a receding portion 75 is provided on the side of the piece 83 facing the main plate 61.
  • the retreating part 75 has retreated in the direction away from the main plate part 61.
  • Other configurations of the lead electrodes 80 'and 60' in FIG. 38 are the same as those of the lead electrodes 80 and 60 in FIGS. 27 to 37, and other reference numerals in FIG. 38 indicate the same parts as those in FIGS.
  • the gap of the bridge portion 3 v is prevented from being opened when an external force in the X direction is applied.
  • the back surface of the overhanging portion 72 has the same height as the back surface of the extending plate portion 64 at the tip of the overhanging portion 72 (the portion closer to the reinforcing piece portion 83 than on the X-direction extension line of the stepped portion 71).
  • the back surface of the overhang portion 72 is a groove portion having the same height as the groove portion 73.
  • a large number of packages 2H are connected to a lead frame (not shown) through suspension leads 50 as shown in FIGS.
  • the claw-like portion 51 is formed by bending the tip portion of the suspension lead 50 so as to be farther from the bottom surface of the package 2H toward the tip side. Is preferably embedded in the resin molded body 3H.
  • the thickness b of the tip of the claw-like portion 51 is made smaller than the thickness a on the main body portion side of the suspension lead 50, and the thickness is made smaller toward the tip side of the claw-like portion 51. preferable.
  • the reinforcing piece 85 and the restraining portion 65 are embedded in the corner portions 3C ′ and 3D ′ of the package 2H to increase the rigidity of the package 2H, the package 2H is deformed.
  • the claw-like portion 51 is prevented from coming off and the holding of the package 2H is stabilized.
  • the holding force of the package 2H can be increased without excessively increasing the insertion depth of the claw-like portion 51, the claw-like shape of the suspension lead 50 is provided in the vicinity of the corner portions 3C ′ and 3D ′ of the package 2H.
  • the portion 51 When the portion 51 is disposed, a space for embedding the reinforcing piece 85 and the restraining portion 65 of the corner portions 3C ′ and 3D ′ of the package 2H can be secured, so that the resin molded body 3H of the corner portions 3C ′ and 3D ′ can be secured. It is possible to configure the suspension lead that ensures high strength and rigidity and increases the holding force of the package 2H.
  • the above embodiment is an example of the present invention, and the present invention may be other than illustrated.
  • the resin of the resin molded body is preferably a silicone resin, but is not limited thereto.
  • the lead electrode material is exemplified by a copper alloy, but is not limited thereto.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

The present invention provides a package capable of preventing deformation centered in a resin portion between lead electrodes, and a light-emitting device using the package. A package (2) has lead electrodes (10, 20), and a resin molded body (3) in which the lead electrodes (10, 20) are molded, the resin molded body (3) being ring-shaped, and a cup part (3a) for positioning a light-emitting element being provided on the inner side of the resin molded body (3). The lead electrode (20) is provided with a reinforcing part (30) extending along the lateral side of the lead electrode (10). The reinforcing part (30) is embedded in a corner section (3C) of the resin molded body (3).

Description

発光装置用パッケージ及び発光装置Light emitting device package and light emitting device
　本発明は、ＬＥＤ素子などの発光素子が実装される発光装置用パッケージと、このパッケージを用いた発光装置に関する。 The present invention relates to a light emitting device package on which a light emitting element such as an LED element is mounted, and a light emitting device using the package.
　ＬＥＤ発光素子を搭載した樹脂封止型発光装置の一例を図１７～１９に示す。図１７は発光装置１００の斜視図、図１８ａ，１８ｂは図１７のXVIIIａ－XVIIIａ，XVIIIｂ－XVIIIｂ線断面図である。図１９はパッケージ１１０の平面図である。 Examples of resin-sealed light-emitting devices equipped with LED light-emitting elements are shown in FIGS. 17 is a perspective view of the light emitting device 100, and FIGS. 18a and 18b are sectional views taken along lines XVIIIa-XVIIIa and XVIIIb-XVIIIb of FIG. FIG. 19 is a plan view of the package 110.
　この発光装置１００のパッケージ１１０は、第１のリード電極１０１と、第２のリード電極１０２と、該リード電極１０１，１０２と一体化するように構成された樹脂成形体１０３とを有する。樹脂成形体１０３は穴状のカップ部１０３ａを有した環形状であり、リード電極１０１，１０２の一部がそれぞれカップ部１０３ａの底部に露呈している。リード電極１０１，１０２の外側の端部は樹脂成形体１０３の外周縁から外方に延出している。 The package 110 of the light emitting device 100 includes a first lead electrode 101, a second lead electrode 102, and a resin molded body 103 configured to be integrated with the lead electrodes 101 and 102. The resin molded body 103 has an annular shape having a hole-shaped cup portion 103a, and a part of each of the lead electrodes 101 and 102 is exposed at the bottom of the cup portion 103a. The outer ends of the lead electrodes 101 and 102 extend outward from the outer peripheral edge of the resin molded body 103.
　カップ部１０３ａ内において、リード電極１０２上にＬＥＤ等の発光素子１０４が固着されている。発光素子１０４は、金属細線１０５，１０６によって各リード電極１０１，１０２に接続されている。 In the cup portion 103a, a light emitting element 104 such as an LED is fixed on the lead electrode. The light emitting element 104 is connected to the lead electrodes 101 and 102 by metal thin wires 105 and 106.
　リード電極１０１，１０２の対峙縁同士の間には樹脂よりなるブリッジ部１０３ｂが充填されている。このブリッジ部１０３ｂは、カップ部１０３ａの底部を弦方向に横断し、樹脂成形体１０３と一体となっている。 Between the facing edges of the lead electrodes 101 and 102, a bridge portion 103b made of resin is filled. The bridge portion 103b crosses the bottom of the cup portion 103a in the string direction and is integrated with the resin molded body 103.
　リード電極１０１，１０２は、発光装置１００の底面に露呈している。リード電極１０１，１０２が樹脂成形体１０３の底面から剥離したり浮き上がったりすることを防止するために、図１８ｂのように、リード電極１０１，１０２の側端部に段差部１０２ａが設けられている。この段差部１０２ａの端縁が樹脂成形体１０３中に埋設されることにより、リード電極１０１，１０２の剥離や浮き上りが防止される。段差部１０２ａを設ける代りに、リード電極１０１，１０２の側端部の端面を下向きの傾斜面とし、該端面の上辺側を樹脂成形体１０３中に埋設することもある。 The lead electrodes 101 and 102 are exposed on the bottom surface of the light emitting device 100. In order to prevent the lead electrodes 101 and 102 from peeling off or floating from the bottom surface of the resin molded body 103, a stepped portion 102a is provided at the side end of the lead electrodes 101 and 102 as shown in FIG. . Since the edge of the stepped portion 102a is embedded in the resin molded body 103, the lead electrodes 101 and 102 are prevented from being peeled off or lifted up. Instead of providing the stepped portion 102 a, the end surfaces of the side end portions of the lead electrodes 101 and 102 may be inclined downward, and the upper side of the end surfaces may be embedded in the resin molding 103.
　図２１は、このパッケージ１１０の樹脂成形体１０３を成形する金型の断面図である。上型１１１と下型１１２との間にリード電極１０１，１０２を挟んだ状態でキャビティ１１３に樹脂を射出装置などにより充填し、樹脂成形体１０３を成形する。図２１中の符号１１１ａは、カップ部１０３ａを形成するために上型１１１に設けられた凸部である。リード電極１０１，１０２はこの凸部１１１ａと下型との間で挟持される。リード電極１０１，１０２の周縁の一部は、キャビティ１１３内に延在している。 FIG. 21 is a cross-sectional view of a mold for molding the resin molded body 103 of the package 110. The resin is filled into the cavity 113 with an injection device or the like while the lead electrodes 101 and 102 are sandwiched between the upper mold 111 and the lower mold 112, and the resin molded body 103 is molded. The code | symbol 111a in FIG. 21 is the convex part provided in the upper mold | type 111 in order to form the cup part 103a. The lead electrodes 101 and 102 are sandwiched between the convex portion 111a and the lower mold. Part of the periphery of the lead electrodes 101 and 102 extends into the cavity 113.
特開２００８－１４０９４４号公報JP 2008-140944 A
ｉ）　図１９に示すように、図１９のｘ方向（リード電極１０１，１０２を結ぶ方向）においては、ブリッジ部１０３ｂ部分においてリード電極１０１，１０２が存在しない。そのため、樹脂成形体１０３とリード電極１０１，１０２との線膨張率の違いや取扱い時の負荷力により、図２０ａ，２０ｂのようにブリッジ部１０３ｂを中心としてｚ方向（図２０ａの上下方向）に屈曲するようにパッケージ１１０が変形し、図２０ｃのように破断が生じることがある。この傾向は、樹脂がシリコーン樹脂など軟質である場合に顕著となる。また、樹脂成形体１０３とリード電極１０１，１０２との線膨張率差が大きい場合には顕著となる。 i) As shown in FIG. 19, in the x direction (direction in which the lead electrodes 101 and 102 are connected) in FIG. 19, the lead electrodes 101 and 102 do not exist in the bridge portion 103b. Therefore, due to a difference in linear expansion coefficient between the resin molded body 103 and the lead electrodes 101 and 102 and a load force during handling, the bridge portion 103b is centered in the z direction (up and down direction in FIG. 20a) as shown in FIGS. 20a and 20b. The package 110 may be deformed so as to be bent, and breakage may occur as shown in FIG. 20c. This tendency becomes prominent when the resin is soft such as a silicone resin. In addition, this is remarkable when the difference in linear expansion coefficient between the resin molded body 103 and the lead electrodes 101 and 102 is large.
　本発明は、かかるブリッジ部を中心とした変形が防止（抑制を含む。以下、同様。）することができる発光装置用パッケージと、このパッケージを用いた発光装置とを提供することを第１の目的とする。
ii）　図１９に示すように、パッケージ１１０の平面視において４隅部（コーナー部）にはリード電極１０１，１０２は存在せず、パッケージ１１０の４隅部は樹脂のみによって構成されている。このため、パッケージ１１０の４隅部の強度及び曲げ剛性が低く、該４隅部近傍で樹脂成形体が損壊したり、ｚ方向に変形することにより樹脂成形体１０３へのリード電極１０１，１０２の段差部１０１ａ，１０２ａの食い込みが外れ、リード電極１０１，１０２が樹脂成形体１０３から浮き上り易くなる。リード電極１０１，１０２が樹脂成形体１０３から浮き上ると、隙間に外気が侵入し、リード電極１０１，１０２の上面に劣化や変色が生じ易くなる。この傾向は、樹脂がシリコーン樹脂等のように軟質である場合に顕著となる。 It is a first object of the present invention to provide a package for a light emitting device capable of preventing (including suppression, the same applies hereinafter) a deformation around the bridge portion, and a light emitting device using the package. Objective.
ii) As shown in FIG. 19, in the plan view of the package 110, the lead electrodes 101 and 102 do not exist at the four corners (corner portions), and the four corners of the package 110 are made of only resin. Therefore, the strength and bending rigidity of the four corners of the package 110 are low, and the resin molded body is damaged in the vicinity of the four corners or deformed in the z direction, whereby the lead electrodes 101 and 102 to the resin molded body 103 are The stepped portions 101 a and 102 a are not bite, and the lead electrodes 101 and 102 are easily lifted from the resin molded body 103. When the lead electrodes 101 and 102 are lifted from the resin molded body 103, outside air enters the gaps, and deterioration and discoloration are likely to occur on the upper surfaces of the lead electrodes 101 and 102. This tendency becomes prominent when the resin is soft such as a silicone resin.
　本発明は、コーナー部付近の強度及び剛性が高く、コーナー部近傍における樹脂成形体の損壊が防止されると共に、リード電極が樹脂成形体から剥離したり浮き上ったりすることが防止された発光装置用パッケージ及び発光装置を提供することを第２の目的とする。 The present invention has high strength and rigidity in the vicinity of the corner portion, prevents the resin molded body from being damaged in the vicinity of the corner portion, and prevents the lead electrode from peeling off or floating from the resin molded body. A second object is to provide a device package and a light emitting device.
iii）　図２１に示すように、樹脂成形体１０３を成形するための金型内において、リード電極１０１，１０２の辺縁の一部はキャビティ１１３内に延出しており、上型１１１の凸部１１１ａによって拘束されていない。そのため、樹脂がリード電極１０１，１０２の辺縁部と下型１１２との間に回り込み、図２２のようにバリ１０３Ｂが生じ易い。バリ１０３Ｂが生じた発光装置１００は、リフロー半田の領域の確保が不安定になり、リフロー半田不良になる。この傾向は、特に樹脂が流動性の高いシリコーン樹脂等の場合に顕著となる。なお、図２２はパッケージ１１０の底面図である。 iii) As shown in FIG. 21, in the mold for molding the resin molded body 103, a part of the edge of the lead electrodes 101, 102 extends into the cavity 113, and the convex portion of the upper mold 111 It is not restrained by 111a. Therefore, the resin wraps around between the edge portions of the lead electrodes 101 and 102 and the lower mold 112, and the burr 103B is easily generated as shown in FIG. In the light emitting device 100 in which the burr 103B is generated, the reflow soldering area becomes unstable and the reflow soldering becomes defective. This tendency is particularly remarkable when the resin is a silicone resin having high fluidity. FIG. 22 is a bottom view of the package 110.
　本発明は、その一態様において、リード電極裏面のバリが防止される発光装置用パッケージ及び発光装置を提供することを目的とする。 In one aspect of the present invention, an object of the present invention is to provide a light emitting device package and a light emitting device in which burrs on the back surface of the lead electrode are prevented.
　さらに、本発明は、別の一態様において、吊りリードの保持が安定している発光装置用パッケージ及び発光装置を提供することを目的とする。 Furthermore, an object of the present invention, in another aspect, is to provide a light emitting device package and a light emitting device in which the suspension leads are stably held.
　本発明の発光装置用パッケージは、一辺同士を対峙させて配置された第１及び第２のリード電極と、該リード電極と一体となるように成形された樹脂成形体とを有し、該樹脂成形体は環形であり、該樹脂成形体の内側に発光素子配置用のカップ部が設けられている。該第２のリード電極に、前記一辺の長手方向両端側から延出し、第１のリード電極の側辺に沿って延在する補強片部が設けられている。 The light emitting device package of the present invention includes first and second lead electrodes arranged with one side facing each other, and a resin molded body molded so as to be integrated with the lead electrode. The molded body has a ring shape, and a cup portion for arranging light emitting elements is provided inside the resin molded body. The second lead electrode is provided with reinforcing pieces extending from both ends of the one side in the longitudinal direction and extending along the side of the first lead electrode.
　前記補強片部の延在方向先端側に、第１のリード電極に向って張り出す張出部が設けられている。 An overhanging portion that protrudes toward the first lead electrode is provided on the leading end side in the extending direction of the reinforcing piece portion.
　前記補強片部の少なくとも延出方向先端側が前記樹脂成形体に埋設されていることが好ましい。 It is preferable that at least the extending direction front end side of the reinforcing piece portion is embedded in the resin molded body.
　前記第１のリード電極は、前記補強片部に沿う側辺部のうち前記樹脂成形体と重なる箇所の一部に、凹欠部が設けられていることが好ましい。 It is preferable that the first lead electrode is provided with a recessed portion in a part of the side portion along the reinforcing piece portion that overlaps the resin molded body.
　前記第２のリード電極は、前記一辺と反対側の辺部の辺長方向の両端側に、前記補強片部と反対方向に延出する第２の補強片部が設けられていることが好ましい。 The second lead electrode is preferably provided with second reinforcing piece portions extending in opposite directions to the reinforcing piece portions on both ends in the side length direction of the side portion on the opposite side to the one side. .
　前記第２のリード電極は、前記一辺と反対側の辺部の長手方向の中央部が外方に延出した延出部となっており、この延出部の側辺部のうち前記樹脂成形体と重なる箇所の一部に凹欠部が設けられていることが好ましい。 The second lead electrode is an extended portion in which the central portion in the longitudinal direction of the side opposite to the one side extends outward, and the resin molding of the side portion of the extended portion. It is preferable that the recessed part is provided in a part of location which overlaps with a body.
　前記樹脂成形体に吊りリードの先端部が刺し込まれており、該吊りリードの該先端部は、先端側ほど樹脂成形体の底面から離反するように屈曲していることが好ましい。 It is preferable that the tip end portion of the suspension lead is inserted into the resin molded body, and the tip portion of the suspension lead is bent so as to be separated from the bottom surface of the resin molded body toward the distal end side.
　該吊りリードは、先端側ほど厚みが小さいことが好ましい。 The suspension lead preferably has a smaller thickness toward the tip side.
　本発明の一態様に係る発光装置用パッケージでは、前記カップ部は前記樹脂成形体の一方の面（以下、上面という。）から他方の面（以下、底面という。）に向って凹設されており、前記第２のリード電極は、長板部と、該長板部の一方の長辺に連なり、樹脂成形体の外方に延出した第２端板部とを有しており、前記第１のリード電極は、該長板部に対峙する主板部と、該主板部の前記長板部と反対側に連なる中継板部と、該中継板部の該主板部と反対側に連なり、樹脂成形体の外方に延出した第１端板部とを有しており、該主板部は、その上面の少なくとも一部が前記カップ部に露呈しており、底面の少なくとも一部がパッケージの底面に露呈している。 In the light emitting device package according to an aspect of the present invention, the cup portion is recessed from one surface (hereinafter referred to as an upper surface) of the resin molded body toward the other surface (hereinafter referred to as a bottom surface). The second lead electrode has a long plate portion and a second end plate portion that extends to one side of the long plate portion and extends outward from the resin molded body, The first lead electrode is connected to the main plate portion facing the long plate portion, the relay plate portion connected to the opposite side of the main plate portion to the long plate portion, and connected to the opposite side of the main plate portion of the relay plate portion, A first end plate portion extending outward of the resin molded body, and at least a part of an upper surface of the main plate portion is exposed to the cup portion, and at least a part of the bottom surface is a package. It is exposed on the bottom surface.
　前記長板部の長手方向の中央部のパッケージ底面における該長手方向の露呈幅Ｗ２よりも前記第２端板部の先端部の幅Ｗ１が小さいことが好ましい。 It is preferable that the width W 1 of the distal end portion of the second end plate portion than the longitudinal direction of the exposed width W 2 is smaller at the bottom of the package in the longitudinal center portion of the long plate portion.
　前記長板部の長手方向の両端部から前記第１の補強片部と反対方向に第２の補強片部が延設されていることが好ましい。 It is preferable that a second reinforcing piece portion extends from both ends of the long plate portion in the longitudinal direction in the direction opposite to the first reinforcing piece portion.
　前記補強片部には、前記主板部と反対側の辺部から張り出す第２の張出部が設けられていることが好ましい。 It is preferable that the reinforcing piece portion is provided with a second protruding portion that protrudes from a side portion opposite to the main plate portion.
　前記第１のリード電極の前記中継板部の長手方向の中央部は前記パッケージの底面に露呈しており、該中継板部の長手方向の両端側は前記樹脂成形体中に埋設されており、この中継板部のパッケージ底面への露呈幅Ｗ４よりも前記第２端板部の先端側の幅Ｗ３が小さいことが好ましい。 The central portion in the longitudinal direction of the relay plate portion of the first lead electrode is exposed on the bottom surface of the package, and both end sides in the longitudinal direction of the relay plate portion are embedded in the resin molded body, it is smaller the the second end plate portion of the distal width W 3 than exposed width W 4 to the package bottom surface of the relay plate.
　前記第２のリード電極は、前記中継板部に連なり、該パッケージのコーナー部まで延出した延出板部を有しており、該延出板部が前記樹脂成形体に埋設されていることが好ましい。 The second lead electrode has an extended plate portion that continues to the relay plate portion and extends to a corner portion of the package, and the extended plate portion is embedded in the resin molded body. Is preferred.
　前記延出板部に、前記樹脂成形体を拘束するための凸部、凹部又は開口よりなる拘束部が設けられていることが好ましい。 It is preferable that the extending plate portion is provided with a constraining portion including a convex portion, a concave portion or an opening for constraining the resin molded body.
　前記主板部の前記補強片部側の辺部から該補強片部に向かって張り出す第３の張出部が設けられていることが好ましい。 It is preferable that a third projecting portion projecting from the side of the main plate portion on the reinforcing piece portion side toward the reinforcing piece portion is provided.
　前記補強片部の前記主板部側の辺部には、該第３の張出部に対峙して、主板部から遠ざかるように後退した後退部が設けられていることが好ましい。 It is preferable that a side of the reinforcing piece portion on the side of the main plate portion is provided with a receding portion that is set back from the main plate portion so as to face the third projecting portion.
　本発明の発光装置は、かかる本発明のパッケージと、該パッケージに実装された発光素子とを有する。 The light emitting device of the present invention includes the package of the present invention and a light emitting element mounted on the package.
　本発明の発光装置用パッケージにあっては、第２のリード電極に第１のリード電極の側部に沿うように延出する補強片部が設けられている。この補強片部は、第１及び第２のリード電極同士の間に形成される樹脂製部分（ブリッジ部）を横切るように延在する。そのため、ブリッジ部を中心としてパッケージが屈曲するように力が加えられたときに、この力が該補強片部によって対抗されるようになり、パッケージの屈曲変形が防止される。 In the light emitting device package of the present invention, the second lead electrode is provided with a reinforcing piece portion extending along the side portion of the first lead electrode. The reinforcing piece extends so as to cross a resin portion (bridge portion) formed between the first and second lead electrodes. Therefore, when a force is applied so that the package bends around the bridge portion, the force is countered by the reinforcing piece portion, and the bending deformation of the package is prevented.
　また、この補強片部が樹脂成形体のコーナー部を補強することにより、パッケージのコーナー部の強度及び剛性が向上し、コーナー部の樹脂成形体の変形や損壊が防止されると共に、これに起因したリード電極の剥離や浮き上がりが防止される。 In addition, the reinforcing piece portion reinforces the corner portion of the resin molded body, whereby the strength and rigidity of the corner portion of the package is improved, and deformation and breakage of the resin molded body at the corner portion are prevented, and this is caused. The peeled and lifted lead electrodes are prevented.
　また、補強片部の少なくとも延出方向先端側が前記樹脂成形体に埋設されていることにより、さらに樹脂成形体の変形や損壊，リード電極の剥離や浮き上がりに対し効果的であるとともに、樹脂成形体の成形時に、第１及び第２のリード電極同士の間に形成される樹脂製部分（ブリッジ部）への樹脂流入をしやすくし、ブリッジ部の樹脂充填不良による
第１及び第２のリード電極同士の間での外気流入，封止材漏れ不良を防止できる。 Further, since at least the front end side in the extending direction of the reinforcing piece is embedded in the resin molded body, the resin molded body is further effective for deformation and damage of the resin molded body, peeling and lifting of the lead electrode, and resin molded body. The first and second lead electrodes due to poor resin filling in the bridge portion, facilitating resin inflow into the resin portion (bridge portion) formed between the first and second lead electrodes. It is possible to prevent inflow of outside air between them and sealing material leakage failure.
　補強片部に、第１のリード電極に向って張り出す張出部を設けることにより、パッケージの強度及び剛性をさらに増大させることができる。また、第１及び第２のリード電極同士の間に形成される樹脂製部分（ブリッジ部）における隙間開きを防止できる。 The strength and rigidity of the package can be further increased by providing the reinforcing piece with an overhanging portion that protrudes toward the first lead electrode. Further, it is possible to prevent a gap from being opened in a resin portion (bridge portion) formed between the first and second lead electrodes.
　第１のリード電極側に延出する補強片部だけでなく、これと反対側に延出する第２の補強片部をさらに設けることにより、パッケージの強度、剛性をさらに増大させることができ、樹脂成形体の変形が防止されると共に、これに起因したリード電極の剥離や浮き上がりが防止される。 By providing not only the reinforcing piece portion extending to the first lead electrode side but also the second reinforcing piece portion extending to the opposite side, the strength and rigidity of the package can be further increased. The deformation of the resin molded body is prevented, and the lead electrode is prevented from being peeled off or lifted due to the deformation.
　第１のリード電極の側辺部のうち樹脂成形体と重なる部分の一部に凹欠部を設けることにより、この部分におけるバリ発生が防止される。第２のリード電極にも同様の凹欠部を設けることにより、当該部分でのバリ発生が防止される。このことにより、流動性のよい樹脂成形体においても基板実装リフロー半田領域を確実に確保でき、リフロー半田接続不良を防止できる。 By providing a recessed portion in a part of the side portion of the first lead electrode that overlaps the resin molded body, generation of burrs at this portion is prevented. By providing a similar recess in the second lead electrode, the occurrence of burrs at that portion is prevented. As a result, even in a resin molded body having good fluidity, a board-mounted reflow soldering area can be ensured reliably, and poor reflow soldering connection can be prevented.
　また、第２のリード電極の長板部の長手方向中央部がパッケージ底面に露呈している場合、第２のリード電極の端板部の先端側の幅Ｗ１を長板部のパッケージ底面への露呈幅Ｗ２よりも小さくすることにより、該第２の端板部におけるバリ発生が防止される。 Further, the longitudinal center portion of the long plate portion of the second lead electrode may have exposed bottom of the package, the width W 1 of the distal end side of the end plate portion of the second lead electrode to the package bottom surface of the long plate portion is made smaller than the exposure width W 2 of the burr occurrence in the end plate portion of the second it can be prevented.
　第１のリード電極の中継板部の長手方向中央部がパッケージ底面に露呈している場合、第１のリード電極の第２の張出部の先端側の幅Ｗ３を中継板部のパッケージ底面への露呈幅Ｗ４よりも小さくすることにより、第１の端板部におけるバリ発生が防止される。 If the longitudinal center portion of the relay plate portion of the first lead electrode is exposed to the bottom of the package, the package bottom surface of the relay plate and the second width W 3 of the distal end side of the projecting portion of the first lead electrode It is made smaller than the exposure width W 4 of the burr generation is prevented in the first end plate portion.
　このように張出部におけるバリが防止されることにより、流動性のよい樹脂組成物を用いて成形した樹脂成形体においても基板実装リフロー半田領域を確実に確保でき、リフロー半田接続不良を防止できる。 By preventing burrs in the overhanging portion in this way, it is possible to reliably secure a board-mounted reflow solder region even in a resin molded body molded using a resin composition having good fluidity, and prevent reflow solder connection failure. .
　長板部に第２の補強片部を設け、延出板部に、樹脂成形体を拘束する拘束部を設けることにより、パッケージの強度及び剛性をさらに増大させることができる。また、第１及び第２のリード電極同士の間に形成される樹脂製部分（ブリッジ部）における隙間開きを防止できる。 The strength and rigidity of the package can be further increased by providing the long reinforcing plate portion with the second reinforcing piece portion and providing the extending plate portion with the restraining portion for restraining the resin molded body. Further, it is possible to prevent a gap from being opened in a resin portion (bridge portion) formed between the first and second lead electrodes.
　補強片部に、第１のリード電極の主板部と反対側又は該主板部側に張り出す張出部や、主板部から遠ざかる後退部を設けることにより、パッケージの強度、剛性を増大させることができ、樹脂成形体の変形が防止されると共に、これに起因したリード電極の剥離や浮き上がりが防止される。 By providing the reinforcing piece part with an overhanging part projecting to the opposite side of the main plate part of the first lead electrode or the main plate part side, or a retreating part away from the main plate part, the strength and rigidity of the package can be increased. In addition, deformation of the resin molded body is prevented, and peeling and lifting of the lead electrode due to this are prevented.
　パッケージを支持する吊りリードの先端部を屈曲させることにより、パッケージの保持が安定する。特に、この吊りリードの先端部（爪部）を、先端側ほど厚みが小さくなるようにすることにより、爪部の下側（パッケージ底面側）に存在する樹脂厚みが大きくなり、パッケージの保持強度が増大する。また、吊りリードの保持強度を確保しつつ、吊りリード先端部（爪部）近傍の樹脂成形体内の電極リードを確保でき、吊りリード先端部（爪部）近傍の樹脂成形体の強度，剛性を確保できる。 ¡The holding of the package is stabilized by bending the tip of the suspension lead that supports the package. In particular, by reducing the thickness of the tip (claw) of the suspension lead toward the tip, the thickness of the resin existing below the claw (on the bottom of the package) increases, and the holding strength of the package Will increase. In addition, while maintaining the holding strength of the suspension lead, it is possible to secure the electrode lead in the resin molded body near the tip of the suspension lead (claw portion), and the strength and rigidity of the molded resin near the tip of the suspension lead (claw portion). It can be secured.
実施の形態に係る発光装置の平面図である。It is a top view of the light-emitting device concerning an embodiment. 図１のII－II線断面図である。FIG. 2 is a sectional view taken along line II-II in FIG. 図１のIII－III線矢視図である。FIG. 3 is a view taken along the line III-III in FIG. 1. 図１の発光装置の底面図である。It is a bottom view of the light-emitting device of FIG. 図５ａは図１の発光装置を構成するパッケージの平面図、図５ｂはパッケージのリード電極の平面図である。FIG. 5a is a plan view of a package constituting the light emitting device of FIG. 1, and FIG. 5b is a plan view of a lead electrode of the package. 図５ａのVI－VI線断面図である。It is the VI-VI sectional view taken on the line of FIG. 図５ｂのVII－VII線切断部端面図である。FIG. 7 is a sectional view taken along line VII-VII in FIG. 図５ｂのVIII－VIII線切断部端面図である。FIG. 8 is a sectional view taken along line VIII-VIII in FIG. 5b. 図５ａのIX－IX線断面図である。It is the IX-IX sectional view taken on the line of FIG. 図５ａのＸ－Ｘ線断面図である。FIG. 5b is a sectional view taken along line XX in FIG. 5a. 図１１ａは図５ｂのXI－XI線に沿う断面斜視図、図１１ｂはXI－XI線に沿う断面図である。11a is a sectional perspective view taken along line XI-XI in FIG. 5b, and FIG. 11b is a sectional view taken along line XI-XI. 図５ｂのXII－XII線断面図である。It is the XII-XII sectional view taken on the line of FIG. 図５ｂのXIII－XIII線断面図である。It is the XIII-XIII sectional view taken on the line of FIG. 吊りリードが接続されたパッケージの平面図である。It is a top view of the package with which the suspension lead was connected. 図１４のXV－XV線断面図である。FIG. 15 is a cross-sectional view taken along line XV-XV in FIG. 14. 図１５の吊りリード付近の拡大図である。FIG. 16 is an enlarged view of the vicinity of the suspension lead in FIG. 15. 従来の発光装置の斜視図である。It is a perspective view of the conventional light-emitting device. 図１８ａは図１７のXVIIIａ－XVIIIａ線断面図、図１８ｂはXVIIIｂ－XVIIIｂ線断面図である。18a is a cross-sectional view taken along line XVIIIa-XVIIIa of FIG. 17, and FIG. 18b is a cross-sectional view taken along line XVIIIb-XVIIIb. 図１７の発光装置のパッケージの平面図である。It is a top view of the package of the light-emitting device of FIG. 図２０ａ，２０ｂ，２０ｃ及び２０ｄは図１９のXX－XX線断面図である。20a, 20b, 20c and 20d are sectional views taken along the line XX-XX in FIG. パッケージ製造用金型の断面図である。It is sectional drawing of the metal mold | die for package manufacture. 製造されたパッケージの底面図である。It is a bottom view of the manufactured package. リード電極の端辺部の断面図である。It is sectional drawing of the edge part of a lead electrode. リード電極の端辺部の断面図である。It is sectional drawing of the edge part of a lead electrode. 図２５ａ，２５ｂ及び２５ｃはリード電極の構成図である。25a, 25b and 25c are configuration diagrams of lead electrodes. 図２６ａは図２６ｂのXXVIａ－XXVIａ線に沿う断面図、図２６ｂはパッケージの平面図である。26a is a sectional view taken along line XXVIa-XXVIa in FIG. 26b, and FIG. 26b is a plan view of the package. 実施の形態に係るパッケージの平面図である。It is a top view of the package which concerns on embodiment. リード電極の外形を破線で示した図２７の平面図である。It is the top view of FIG. 27 which showed the external shape of the lead electrode with the broken line. パッケージのリード電極の配置図である。FIG. 6 is a layout view of lead electrodes of a package. 図２９のリード電極の下方からの斜視図である。FIG. 30 is a perspective view from below of the lead electrode of FIG. 29. 図２７のパッケージの底面図である。It is a bottom view of the package of FIG. 図２７の３２－３２線断面図である。FIG. 32 is a sectional view taken along line 32-32 in FIG. 27. 図２７の３３－３３線断面図である。FIG. 34 is a cross-sectional view taken along line 33-33 of FIG. 図２７の３４－３４線断面図である。FIG. 34 is a cross-sectional view taken along line 34-34 in FIG. 27. 図２７の３５－３５線断面図である。FIG. 35 is a sectional view taken along line 35-35 in FIG. 27. 図２７の３６－３６線断面図である。FIG. 36 is a sectional view taken along line 36-36 in FIG. 27. 図２７の３７－３７線断面図である。FIG. 37 is a cross-sectional view taken along line 37-37 of FIG. 27. パッケージの別のリード電極を示す配置図である。It is a layout view showing another lead electrode of the package.
　以下、図１～１６を参照して実施の形態に係る発光装置１について説明する。 Hereinafter, the light emitting device 1 according to the embodiment will be described with reference to FIGS.
　この発光装置１は、第１のリード電極１０と、第２のリード電極２０と、該リード電極１０，２０と一体化するように成形された樹脂成形体３とからなるパッケージ２を有する。樹脂成形体３はカップ部３ａを有した環形状であり、その外周形状は略正方形状となっている。 The light emitting device 1 has a package 2 including a first lead electrode 10, a second lead electrode 20, and a resin molded body 3 molded so as to be integrated with the lead electrodes 10 and 20. The resin molded body 3 has an annular shape having a cup portion 3a, and the outer peripheral shape thereof is substantially square.
　リード電極１０，２０の一部がそれぞれカップ部３ａの底部に露呈している。リード電極１０，２０の外側の端部は樹脂成形体３の外周縁から外方に延出している。 The lead electrodes 10 and 20 are partially exposed at the bottom of the cup portion 3a. The outer ends of the lead electrodes 10 and 20 extend outward from the outer peripheral edge of the resin molded body 3.
　カップ部３ａ内において、リード電極２０上にＬＥＤ等の発光素子４が固着されている。発光素子４は、金属細線５，６によって各リード電極１０，２０と接続されている。リード電極１０，２０の対峙縁同士の間に樹脂よりなるブリッジ部３ｂが充填されている。このブリッジ部３ｂはカップ部３ａの底部を弦方向に横断し、樹脂成形体３と一体となっている。なお、リード電極２０上の発光素子４は、単一または複数あってもよい。図１は複数の一例を示す。 A light emitting element 4 such as an LED is fixed on the lead electrode 20 in the cup portion 3a. The light emitting element 4 is connected to the lead electrodes 10 and 20 by metal thin wires 5 and 6. Between the facing edges of the lead electrodes 10 and 20, a bridge portion 3b made of resin is filled. The bridge portion 3b crosses the bottom portion of the cup portion 3a in the string direction and is integrated with the resin molded body 3. In addition, the light emitting element 4 on the lead electrode 20 may be single or plural. FIG. 1 shows a plurality of examples.
　リード電極１０，２０は、発光装置１の底面に露呈している。リード電極１０，２０が樹脂成形体３から剥離したり浮き上がったりすることを防止するために、リード電極１０，２０の底面側の周縁部の所要箇所に段差部１０ａ，２０ａが設けられている。この段差部１０ａ，２０ａの端縁が樹脂成形体３中に埋設されることにより、リード電極１０，２０の剥離や浮き上りが防止される。 The lead electrodes 10 and 20 are exposed on the bottom surface of the light emitting device 1. In order to prevent the lead electrodes 10 and 20 from being peeled off or lifted from the resin molded body 3, step portions 10 a and 20 a are provided at necessary positions on the peripheral edge portion on the bottom surface side of the lead electrodes 10 and 20. Since the end edges of the stepped portions 10a and 20a are embedded in the resin molded body 3, the lead electrodes 10 and 20 are prevented from being peeled off or lifted up.
　なお、段差部１０ａ，２０ａの隅角の角度は直角に限定されるものではない。また、図２３のように隅角は円弧状断面形状であってもよい。段差部１０ａ，２０ａを設ける代りに、図２４のように、リード電極１０，２０の側端部の端面を下向きの傾斜面とし、該端面の上辺側を樹脂成形体３中に埋設してもよい。 Note that the angle of the corners of the stepped portions 10a and 20a is not limited to a right angle. Further, as shown in FIG. 23, the corner may have an arcuate cross-sectional shape. Instead of providing the stepped portions 10a and 20a, as shown in FIG. 24, the end surfaces of the side end portions of the lead electrodes 10 and 20 may be inclined downward and the upper side of the end surfaces may be embedded in the resin molded body 3. Good.
　図５ａ～８を参照して、リード電極１０，２０の構成について詳細に説明する。なお、図５ａは、発光素子４を実装する前の発光装置用パッケージ２の平面図、図５ｂはリード電極１０，２０の平面図であり、図５ｂにおけるリード電極１０，２０の配置は、図５ａのパッケージ２におけるリード電極１０，２０の配置と同一である。 The configuration of the lead electrodes 10 and 20 will be described in detail with reference to FIGS. 5a is a plan view of the light emitting device package 2 before the light emitting element 4 is mounted, FIG. 5b is a plan view of the lead electrodes 10 and 20, and the arrangement of the lead electrodes 10 and 20 in FIG. The arrangement of the lead electrodes 10 and 20 in the package 2 of 5a is the same.
　図５ｂの通り、リード電極１０は、ブリッジ部３ｂに臨む後縁１１、樹脂成形体３から突出する前縁１２、これらを結ぶ側縁を有した略々台形の平面視形状の薄板状である。この側縁の途中であって、樹脂成形体３と重なる位置の一部に、板の中央方向（側縁同士を結ぶ方向）に食い込む凹欠部１３が設けられている。この凹欠部１３よりも前縁側の第１側縁部１４及び後縁側の第２側縁部１５には、図１１ａ，１１ｂ，１２に詳細に示される通り、該凹欠部１３に臨む辺部に段差部１０ａが設けられている。段差部１０ａは、後縁１１の全辺にわたっても設けられている。 As shown in FIG. 5b, the lead electrode 10 has a thin plate shape in a substantially trapezoidal plan view shape having a rear edge 11 facing the bridge portion 3b, a front edge 12 protruding from the resin molded body 3, and a side edge connecting these. . In the middle of this side edge, a recessed portion 13 that bites in the center direction of the plate (the direction connecting the side edges) is provided at a part of the position overlapping the resin molded body 3. As shown in detail in FIGS. 11 a, 11 b, and 12, the side facing the notch 13 is formed on the first side edge 14 on the front edge side and the second side edge 15 on the rear edge side of the notch 13. A stepped portion 10a is provided in the portion. The step portion 10 a is also provided over the entire side of the rear edge 11.
　凹欠部１３は、樹脂成形体３のカップ部３ａの底部に露呈させない位置で、図５ｂにおけるＶＩＩＩ－ＶＩＩＩ線に対して凹欠部１３同士がより近い配置となる様に設けることにより、バリ発生を抑制出来るので好ましい。この場合、凹欠部１３を延伸し、その端部をＶＩＩＩ－ＶＩＩＩ線に対してより近い配置としてもよいが、中でも、第２側縁部１５を延伸し、その先端に凹欠部１３を設けることにより、ＶＩＩＩ－ＶＩＩＩ線に対して凹欠部１３同士をより近い配置とする構造にすることで、段差部１０ａによる、剥離・浮き上がり防止効果も併せて向上するので好ましい。 The recesses 13 are provided at positions where the recesses 13 are not exposed to the bottom of the cup portion 3a of the resin molded body 3 so that the recesses 13 are arranged closer to the line VIII-VIII in FIG. Since generation | occurrence | production can be suppressed, it is preferable. In this case, the recess 13 may be extended and its end closer to the line VIII-VIII, but the second side edge 15 is extended and the recess 13 is formed at the tip. It is preferable to provide a structure in which the recesses 13 are arranged closer to each other with respect to the line VIII-VIII because the effect of preventing peeling and lifting by the stepped portion 10a is also improved.
　また、段差部１０ａは、前縁側の第１側縁部１４または後縁側の第２側縁部１５のどちらか一方でもよい。前縁側の第１側縁部１４と後縁側の第２側縁部１５の両方を設けることにより、剥離・浮き上がりに対し補強が向上する。 Further, the step portion 10a may be either the first side edge portion 14 on the front edge side or the second side edge portion 15 on the rear edge side. By providing both the first side edge portion 14 on the front edge side and the second side edge portion 15 on the rear edge side, the reinforcement is improved against peeling and lifting.
　リード電極２０は、ブリッジ部３ｂに臨む後縁２１、樹脂成形体３から突出する前縁２２、これらを結ぶ側縁を有した薄板状である。この前縁２２の長手方向の中央部は外方へ略台形状に延出する延出部２８となっている。延出部２８の側縁の途中であって、樹脂成形体３と重なる位置に、板の中央方向（該側縁同士を結ぶ方向）に食い込む凹欠部２３が設けられている。この凹欠部２３よりも前縁側の第１側縁部２４及び後縁側の第２側縁部２５には、該凹欠部２３に臨む辺部に段差部２０ａが設けられている。段差部２０ａは、後縁２１の略全辺にわたっても設けられている。 The lead electrode 20 has a thin plate shape having a rear edge 21 facing the bridge portion 3b, a front edge 22 protruding from the resin molded body 3, and a side edge connecting them. A central portion in the longitudinal direction of the front edge 22 is an extended portion 28 that extends outward in a substantially trapezoidal shape. In the middle of the side edge of the extending portion 28, a recessed portion 23 is provided at a position overlapping the resin molded body 3 so as to bite in the center direction of the plate (the direction connecting the side edges). On the first side edge 24 on the front edge side and the second side edge 25 on the rear edge side of the recess 23, a step 20a is provided on the side facing the recess 23. The stepped portion 20 a is also provided over substantially the entire side of the trailing edge 21.
　凹欠部２３は、樹脂成形体３のカップ部３ａの底部に露呈させない位置で、図５ｂにおけるＶＩＩＩ－ＶＩＩＩ線に対して凹欠部２３同士がより近い配置となる様に設けることにより、バリ発生を抑制出来るので好ましい。この場合、凹欠部２３を延伸し、その端部をＶＩＩＩ－ＶＩＩＩ線に対してより近い配置としてもよいが、中でも、第２側縁部２５を延伸し、その先端に凹欠部２３を設けることにより、ＶＩＩＩ－ＶＩＩＩ線に対して凹欠部２３同士をより近い配置とする構造にすることで、段差部２０ａによる、剥離・浮き上がり防止効果も併せて向上するので好ましい。 The recesses 23 are provided at positions where the recesses 23 are not exposed to the bottom of the cup portion 3a of the resin molded body 3 so that the recesses 23 are closer to the line VIII-VIII in FIG. Since generation | occurrence | production can be suppressed, it is preferable. In this case, the recess 23 may be extended and its end closer to the line VIII-VIII, but the second side edge 25 is extended and the recess 23 is formed at the tip. By providing, the structure in which the recessed portions 23 are arranged closer to each other with respect to the line VIII-VIII is preferable because the effect of preventing peeling and lifting by the stepped portion 20a is also improved.
　また、段差部２０ａは、前縁側の第１側縁部２４または後縁側の第２側縁部２５のどちらか一方でもよい。前縁側の第１側縁部２４と後縁側の第２側縁部２５の両方を設けることにより、はく離,浮き上がりに対し補強が向上する。 The step 20a may be either the first side edge 24 on the front edge side or the second side edge 25 on the rear edge side. By providing both the first side edge portion 24 on the front edge side and the second side edge portion 25 on the rear edge side, the reinforcement is improved against peeling and lifting.
　リード電極２０の後縁２１と前縁２２との間の主板部２７の側辺部には、外方に延出した突片部２６が設けられている。突片部２６の底面側に段差部２０ａが形成されている。 A projecting piece portion 26 extending outward is provided on the side portion of the main plate portion 27 between the rear edge 21 and the front edge 22 of the lead electrode 20. A stepped portion 20 a is formed on the bottom surface side of the projecting piece portion 26.
　リード電極２０の後縁２１の両端側（ブリッジ部３ｂの延在方向両端側）からは、ブリッジ部３ｂと直交方向に第１の補強片部３０がそれぞれ延設されている。補強片部３０は、樹脂成形体３のコーナー部３Ｃ近傍にまで延在している。各補強片部３０は、延出方向基端側の基端部３１と、該基端部３１よりも先端側の先端部３２とを有している。基端部３１の上面は主板部２７と面一状であるが、先端部３２の上面はそれよりも立ち上っており、両者の間が段差形状部３３となっている。 A first reinforcing piece 30 is extended from both ends of the rear edge 21 of the lead electrode 20 (both ends in the extending direction of the bridge 3b) in a direction orthogonal to the bridge 3b. The reinforcing piece 30 extends to the vicinity of the corner 3 </ b> C of the resin molded body 3. Each reinforcing piece 30 has a proximal end portion 31 on the proximal end side in the extending direction and a distal end portion 32 on the distal end side with respect to the proximal end portion 31. The upper surface of the base end portion 31 is flush with the main plate portion 27, but the upper surface of the distal end portion 32 rises more than that, and a step-shaped portion 33 is formed between them.
　図７，図１１ｂの通り、第１の補強片部３０の底面は主板部２７の底面よりも高低差ｄだけ高位となっており、補強片部３０の下側に、樹脂成形体３の成形時に樹脂が回り込み、補強片部３０の全体が樹脂成形体３内に埋設されるようになっている。ただし、補強片部３０の先端部３２のみが樹脂成形体３内に埋設されてもよい。 As shown in FIGS. 7 and 11 b, the bottom surface of the first reinforcing piece portion 30 is higher than the bottom surface of the main plate portion 27 by a height difference d, and the resin molded body 3 is molded below the reinforcing piece portion 30. The resin sometimes wraps around, and the entire reinforcing piece 30 is embedded in the resin molded body 3. However, only the distal end portion 32 of the reinforcing piece portion 30 may be embedded in the resin molded body 3.
　先端部３２の肉厚をコイニング等で薄くし、先端部３２の上面は主板部２７と面一状で、先端部３２の底面は主板部２７の底面よりも立ち上って、高低差ｄを確保してもよい。 The tip 32 is thinned by coining or the like, the top surface of the tip 32 is flush with the main plate 27, and the bottom of the tip 32 rises from the bottom of the main plate 27 to ensure a height difference d. May be.
　また、高低差ｄを確保させることにより、樹脂成形体の変形や損壊，リード電極の剥離や浮き上がりに対し効果的であるとともに、第１及び第２のリード電極同士の間に形成される樹脂製部分（ブリッジ部）への樹脂流入を高低差ｄの部分の隙間からしやすくし、ブリッジ部の樹脂充填不良による第１及び第２のリード電極同士の間での外気流入，封止材漏れ不良を防止できる。 Further, by ensuring the height difference d, it is effective for deformation and breakage of the resin molded body, peeling and lifting of the lead electrodes, and made of resin formed between the first and second lead electrodes. Resin inflow into the part (bridge part) is facilitated from the gap of the part of the height difference d, outside air inflow between the first and second lead electrodes due to defective resin filling in the bridge part, sealing material leakage failure Can be prevented.
　先端部３２のうちリード電極１０側の側辺部は、リード電極１０に向って張り出す張出部３４となっている。 The side part on the lead electrode 10 side of the tip part 32 is an overhang part 34 that projects toward the lead electrode 10.
　リード電極２０の前縁２２の両端側からは、延出部２８の延出方向（ブリッジ部３ｂと直交方向）に第２の補強片部４０がそれぞれ延設されている。補強片部４０は、樹脂成形体３のコーナー部３Ｄ近傍にまで延在している。各補強片部４０は、延出方向基端側の基端部４１と、該基端部４１よりも先端側の先端部４２とを有している。基端部４１の上面は主板部２７と面一状であるが、先端部４２の上面はそれよりも立ち上っており、両者の間が段差形状部４３となっている。 The second reinforcing piece 40 is extended from both ends of the front edge 22 of the lead electrode 20 in the extending direction of the extending portion 28 (in the direction orthogonal to the bridge portion 3b). The reinforcing piece portion 40 extends to the vicinity of the corner portion 3D of the resin molded body 3. Each reinforcing piece 40 includes a base end 41 on the base end side in the extending direction and a front end 42 on the front end side of the base end 41. The upper surface of the base end portion 41 is flush with the main plate portion 27, but the upper surface of the distal end portion 42 rises more than that, and a step-shaped portion 43 is formed between the two.
　図７の通り、第２の補強片部４０の底面は主板部２７の底面よりも前記高低差ｄだけ高位となっており、第２の補強片部４０の下側に、樹脂成形体３の成形時に樹脂が回り込み、補強片部４０の全体が樹脂成形体３内に埋設されるようになっている。ただし、補強片部４０の先端部４２のみが樹脂成形体３に埋設されてもよい。先端部４２のうち延出部２８側の側辺部は、延出部２８に向って張り出す張出部４４となっている。 As shown in FIG. 7, the bottom surface of the second reinforcing piece portion 40 is higher than the bottom surface of the main plate portion 27 by the height difference d, and the resin molded body 3 is disposed below the second reinforcing piece portion 40. The resin wraps around at the time of molding, and the entire reinforcing piece 40 is embedded in the resin molded body 3. However, only the distal end portion 42 of the reinforcing piece portion 40 may be embedded in the resin molded body 3. A side portion of the distal end portion 42 on the extending portion 28 side is a protruding portion 44 that protrudes toward the extending portion 28.
　先端部４２の肉厚をコイニング等で薄くし、先端部４２の上面は主板部２７と面一状で、先端部４２の底面は主板部２７の底面よりも立ち上って、高低差ｄを確保してもよい。 The tip portion 42 is thinned by coining or the like, the top surface of the tip portion 42 is flush with the main plate portion 27, and the bottom surface of the tip portion 42 rises from the bottom surface of the main plate portion 27 to ensure a height difference d. May be.
　このパッケージ２は、リード電極１，２を前記図２１のように金型内に配置してキャビティに樹脂を供給することにより樹脂成形体３を成形して製造される。 The package 2 is manufactured by molding the resin molded body 3 by arranging the lead electrodes 1 and 2 in the mold as shown in FIG. 21 and supplying resin to the cavity.
　この実施の形態においては、リード電極１０，２０に凹欠部１３，２３が設けられているので、樹脂成形体３を成形するに際しこの凹欠部１３，２３においてバリが発生しない。なお、リード電極１０，２０の第１側縁部１４，２４の前縁１２，２２側は、樹脂成形体３の成形に際し上型と下型との間で挟持されるので、第１側縁部１４，２４の低面側にはバリは発生しない。 In this embodiment, since the recessed portions 13 and 23 are provided in the lead electrodes 10 and 20, no burrs are generated in the recessed portions 13 and 23 when the resin molded body 3 is molded. Note that the front edges 12 and 22 side of the first side edges 14 and 24 of the lead electrodes 10 and 20 are sandwiched between the upper mold and the lower mold when the resin molded body 3 is molded. No burr is generated on the lower surface side of the portions 14 and 24.
　第２側縁部１５，２５は、樹脂成形体３のカップ部３ａを形成するために設けられた上型１１１の凸部１１１ａの輪郭に沿うように配置させることにより、その直近部分が上型凸部１１１ａ（図２１）と下型１１２との間で挟持されるので、第２側縁部１５，２５の底面側にもバリは発生しない。 The second side edge portions 15 and 25 are arranged so as to follow the contour of the convex portion 111a of the upper mold 111 provided to form the cup portion 3a of the resin molded body 3, so that the nearest portion thereof is the upper mold. Since it is clamped between the convex part 111a (FIG. 21) and the lower mold | type 112, a burr | flash does not generate | occur | produce also in the bottom face side of the 2nd side edge parts 15 and 25. FIG.
　各リード電極１０，２０の凹欠部１３，１３間、凹欠部２３，２３間は幅が小さいくびれ状部分となっているので、樹脂成形体３の成形に際して、凹欠部１３，１３間、凹欠部２３，２３間より大きい上型と下型との間で狭持される１４,１４間、２４,２４間により下型から浮くことはなく、バリ発生が防止される。 Since the width between the recesses 13 and 13 of each lead electrode 10 and 20 and between the recesses 23 and 23 is a narrowed portion having a small width, when molding the resin molded body 3, between the recesses 13 and 13. The upper die and the lower die, which are larger between the recesses 23 and 23, are not lifted from the lower die between 14, 14 and 24, 24, and the generation of burrs is prevented.
　このように構成されたパッケージ２及び発光装置１においては、図５ａの通り、補強片部３０がブリッジ部３ｂの両端側を横断するようにコーナー部３Ｃに向って延在している。そのため、パッケージ２に対し、ブリッジ部３ｂに沿う軸Ａ１回りに屈曲させようとする力が加えられたときに、この力が補強片部３０によって対抗され、パッケージ２の変形が防止される。 In the package 2 and the light emitting device 1 configured as described above, as shown in FIG. 5a, the reinforcing piece 30 extends toward the corner 3C so as to cross both ends of the bridge 3b. Therefore, with respect to the package 2, when a force for bending the axis A 1 around along the bridge portion 3b is applied, this force is opposed by the reinforcing piece 30, the deformation of the package 2 can be prevented.
　また、補強片部３０，４０が樹脂成形体３のコーナー部３Ｃ，３Ｄ内に存在するので、コーナー部３Ｃ，３Ｄ付近における樹脂成形体３の強度及び剛性が高い。特に、この実施の形態では、補強片部３０，４０の全体が樹脂成形体３内に埋設されているので、補強片部３０，４０と樹脂成形体３とが強固に一体となっており、コーナー部３Ｃ，３Ｄにおける樹脂成形体３の強度及び剛性が高い。 Further, since the reinforcing piece portions 30 and 40 are present in the corner portions 3C and 3D of the resin molded body 3, the strength and rigidity of the resin molded body 3 in the vicinity of the corner portions 3C and 3D are high. In particular, in this embodiment, since the entire reinforcing piece portions 30, 40 are embedded in the resin molded body 3, the reinforcing piece portions 30, 40 and the resin molded body 3 are firmly integrated, The strength and rigidity of the resin molded body 3 at the corner portions 3C and 3D are high.
　加えて、この実施の形態では、補強片部３０，４０に張出片３４，４４が設けられている。そのため、パッケージ２の該張出片３４，４４を含む軸Ａ２回りの曲げ剛性が高い。 In addition, in this embodiment, the protruding pieces 34 and 44 are provided on the reinforcing piece portions 30 and 40. Therefore, a high bending stiffness of the shaft A 2 around including該張 piece 34, 44 of the package 2.
　また、図２０ｃに示すようなブリッジ部３ｂを境界にして引張り方向の変形力が加わった場合にも張出片３４，４４により掛止され、ブリッジ部３ｂとリード電極２０の後縁２１との間やブリッジ部３ｂとリード電極１０の後縁１１との間での隙間開きを防止でき、外気の進入，封止材の漏れを防止できる。 Further, even when a deformation force in the pulling direction is applied with the bridge portion 3b as shown in FIG. 20c as a boundary, it is hooked by the protruding pieces 34 and 44, and the bridge portion 3b and the rear edge 21 of the lead electrode 20 are connected. It is possible to prevent a gap between the gap 3b and the bridge portion 3b and the rear edge 11 of the lead electrode 10 and prevent the entry of outside air and the leakage of the sealing material.
　図１４～１６の通り、多数のパッケージ２が吊りリード５０を介してリードフレーム（図示略）に連結される。この実施の形態では、図１５，１６のように、吊りリード５０の先端部を、先端側ほどパッケージ２の底面から離反するように屈曲させて爪状部５１を形成し、この爪状部５１が樹脂成形体３に刺し込まれた形態としている。この場合の爪状部５１の底面側の屈曲角度θは１０～８０°特に３０～６０°程度が好ましい。この爪状部５１を設けることにより、爪状部５１の刺し込み深さを過度に大きくすることなく、パッケージ２が吊りリード５０に安定して保持され、脱落しにくくなる。 14 to 16, a large number of packages 2 are connected to a lead frame (not shown) through suspension leads 50. In this embodiment, as shown in FIGS. 15 and 16, the tip portion of the suspension lead 50 is bent away from the bottom surface of the package 2 toward the tip side to form a claw-like portion 51. Is embedded in the resin molded body 3. In this case, the bending angle θ on the bottom side of the claw-like portion 51 is preferably about 10 to 80 °, particularly about 30 to 60 °. By providing the claw-like portion 51, the package 2 is stably held by the suspension lead 50 without excessively increasing the penetration depth of the claw-like portion 51, and it becomes difficult to drop off.
　この実施の形態では、爪状部５１の先端の厚みｂを吊りリード５０の本体部側の厚みａよりも小さくし、爪状部５１の先端側ほど厚みが小さくなるようにしている。これにより、爪状部５１の底面側に存在する樹脂の厚みが大きくなり、吊りリード５０によるパッケージ２の保持力を高めることができる。 In this embodiment, the thickness b of the tip of the claw-like portion 51 is made smaller than the thickness a of the main body portion side of the suspension lead 50, and the thickness is made smaller toward the tip side of the claw-like portion 51. Thereby, the thickness of the resin existing on the bottom surface side of the claw-like portion 51 is increased, and the holding force of the package 2 by the suspension leads 50 can be increased.
　この実施の形態では、前述の通り、パッケージ２のコーナー部３Ｃ，３Ｄに補強片部３０，４０を埋設して該コーナー部におけるパッケージ２の剛性を高くしているため、パッケージ２が変形して爪状部５１が抜けることが防止され、パッケージ２の保持が安定する。また、爪状部５１の刺し込み深さを過度に大きくすることがなくパッケージ２の保持力を高めることができることから、パッケージ２のコーナー部３Ｃ，３Ｄの近傍に吊りリード５０の爪状部５１が配置される場合にはパッケージ２のコーナー部３Ｃ，３Ｄの補強片部３０，４０を埋設する空間を確保できるため、コーナー部３Ｃ，３Ｄにおける樹脂成形体３の強度及び剛性を高く確保しつつ、かつ、パッケージ２の保持力を高める吊りリードを構成することができる。 In this embodiment, as described above, the reinforcing piece portions 30 and 40 are embedded in the corner portions 3C and 3D of the package 2 to increase the rigidity of the package 2 at the corner portions. The claw-like portion 51 is prevented from coming off and the holding of the package 2 is stabilized. In addition, since the holding force of the package 2 can be increased without excessively increasing the insertion depth of the claw-shaped portion 51, the claw-shaped portion 51 of the suspension lead 50 is provided in the vicinity of the corner portions 3C and 3D of the package 2. Is provided, the space for embedding the reinforcing pieces 30 and 40 of the corner portions 3C and 3D of the package 2 can be secured, so that the strength and rigidity of the resin molded body 3 at the corner portions 3C and 3D can be secured high. And the suspension lead which raises the retention strength of the package 2 can be comprised.
　図２５ａは、別の実施の形態に係るパッケージに用いられるリード電極の平面図、図２５ｂ，２５ｃは図２５ａのXXVｂ－XXVｂ線、XXVｃ－XXVｃ線断面図である。 25a is a plan view of a lead electrode used in a package according to another embodiment, and FIGS. 25b and 25c are cross-sectional views taken along lines XXVb-XXVb and XXVc-XXVc in FIG. 25a.
　この実施の形態では、リード電極２０Ａの突片部２６Ａに切欠部２６ｋが設けられている。切欠部２６ｋは突片部２６Ａの長手方向に間隔をおいて複数個（この実施の形態では３個）設けられている。切欠部２６ｋの個数は複数個に限定されるものではなく、１個であってもよい。 In this embodiment, a notch 26k is provided in the protruding piece 26A of the lead electrode 20A. A plurality of cutout portions 26k (three in this embodiment) are provided at intervals in the longitudinal direction of the protruding piece portion 26A. The number of notches 26k is not limited to a plurality, and may be one.
　図２５ａのリード電極２０Ａのその他の構成及びリード電極１０の構成は前記実施の形態と同一であり、同一符号は同一部分を示している。 The other configuration of the lead electrode 20A in FIG. 25a and the configuration of the lead electrode 10 are the same as those in the above embodiment, and the same reference numerals indicate the same parts.
　この切欠部２６ｋを設けることにより、段差部２０ａの下側の樹脂と上側の樹脂との一体性が向上し、突片部２６Ａが樹脂成形体３によってより強固に保持されるようになる。また、段差部２０ａの下側への樹脂の充填性も向上する。 By providing the notch portion 26k, the integrity of the lower resin and the upper resin of the step portion 20a is improved, and the projecting piece portion 26A is more firmly held by the resin molded body 3. Further, the resin filling property to the lower side of the stepped portion 20a is also improved.
　図２６ａ，２６ｂのパッケージ２で用いているリード電極２０Ｂは、突片部２６Ｂを主板部２７に対し上方に折り立てたリブ状となっている。リード電極２０Ｂのその他の構成及びリード電極１０の構成は前記実施の形態と同一であり、同一符号は同一部分を示している。なお、図２６ｂはパッケージの平面図、図２６ａは図２６ｂのXXVIａ－XXVIａ線断面図である。 The lead electrode 20B used in the package 2 of FIGS. 26a and 26b has a rib shape in which the protruding piece portion 26B is folded upward with respect to the main plate portion 27. FIG. The other configuration of the lead electrode 20B and the configuration of the lead electrode 10 are the same as those in the above embodiment, and the same reference numerals indicate the same parts. 26b is a plan view of the package, and FIG. 26a is a sectional view taken along line XXVIa-XXVIa of FIG. 26b.
　このリード電極２０Ｂは、突片部２６Ｂ付近の曲げ剛性が高く、パッケージ２の変形が防止される。 The lead electrode 20B has a high bending rigidity in the vicinity of the projecting piece 26B, and deformation of the package 2 is prevented.
　図２７～３７を参照して別の実施の形態に係るパッケージ２Ｈについて説明する。 A package 2H according to another embodiment will be described with reference to FIGS.
　パッケージ２Ｈは、第２のリード電極８０、第１のリード電極６０、及び該リード電極８０，６０と一体化するように成形された樹脂成形体３Ｈを有する。樹脂成形体３Ｈは凹穴状のカップ部３ｒを有した環形状であり、その外周形状は略正方形状となっている。樹脂成形体３Ｈの１つのコーナー部の上面は切欠状の凹所３ｈとなっている。この凹所３ｈはパッケージ２Ｈの方向を識別するために設けられている。 The package 2H includes a second lead electrode 80, a first lead electrode 60, and a resin molded body 3H formed so as to be integrated with the lead electrodes 80 and 60. The resin molded body 3H has a ring shape having a concave hole-shaped cup portion 3r, and the outer peripheral shape thereof is substantially square. The upper surface of one corner portion of the resin molded body 3H is a notch-shaped recess 3h. The recess 3h is provided to identify the direction of the package 2H.
　カップ部３ｒの底部に、第２のリード電極８０の長板部８２の上面の一部と、第１のリード電極６０の主板部６１の上面の大部分が露呈している。リード電極８０，６０の端板部８１，６３は樹脂成形体３Ｈの外周縁から外方（互いに反対方向）に延出している。 Part of the upper surface of the long plate portion 82 of the second lead electrode 80 and most of the upper surface of the main plate portion 61 of the first lead electrode 60 are exposed at the bottom of the cup portion 3r. The end plate portions 81 and 63 of the lead electrodes 80 and 60 extend outward (in opposite directions) from the outer peripheral edge of the resin molded body 3H.
　主板部６１上にＬＥＤ等の発光素子４（図２７～３７では図示略）が固着されている。発光素子４は、ワイヤボンディングによる金属細線５，６（図２７～３７では図示略）によって長板部８２及び主板部６１と接続される。長板部８２と主板部６１の対峙縁同士の間に樹脂よりなるブリッジ部３ｖが充填されている。このブリッジ部３ｖは樹脂部３ｊ，３ｊを結んでいる。ブリッジ部３ｖ及び樹脂部３ｊは樹脂成形体３Ｈと一体となっている。 A light emitting element 4 such as an LED (not shown in FIGS. 27 to 37) is fixed on the main plate 61. The light emitting element 4 is connected to the long plate portion 82 and the main plate portion 61 by thin metal wires 5 and 6 (not shown in FIGS. 27 to 37) by wire bonding. Between the opposing edges of the long plate portion 82 and the main plate portion 61, a bridge portion 3v made of resin is filled. The bridge portion 3v connects the resin portions 3j and 3j. The bridge portion 3v and the resin portion 3j are integrated with the resin molded body 3H.
　図２９，３０の通り、第２のリード電極８０は、樹脂成形体３Ｈの一辺から延出する第２端板部８１と、該端板部８１に連なる長板部８２と、該長板部８２の長手方向の両端部に連なる１対の細長い長方形状の第１の補強片部８３，８３と、各補強片部８３のリード電極主板部６１と反対側の長辺から張り出す外向きの第２の張出部８４と、各補強片部８３の先端側の主板部６１側から張り出す内向きの第１の張出部９６と、各補強片部８３の端板部８１側から延出する第２の補強片部８５とを有する。補強片部８３と長板部８２との交差隅部において、長板部８２に切欠部９７が設けられている。 29 and 30, the second lead electrode 80 includes a second end plate portion 81 extending from one side of the resin molded body 3H, a long plate portion 82 connected to the end plate portion 81, and the long plate portion. A pair of elongated rectangular first reinforcing pieces 83, 83 connected to both ends in the longitudinal direction of 82, and outwardly extending from the long side opposite to the lead electrode main plate 61 of each reinforcing piece 83. A second overhanging portion 84, an inward first overhanging portion 96 overhanging from the main plate portion 61 side on the distal end side of each reinforcing piece portion 83, and an end plate portion 81 side of each reinforcing piece portion 83 are extended. And a second reinforcing piece portion 85 to be brought out. A cutout portion 97 is provided in the long plate portion 82 at an intersection corner between the reinforcing piece portion 83 and the long plate portion 82.
　図３０の通り、長板部８２の長手方向（図２９のＹ方向）の途中部分の裏面に段差部９１，９１が設けられている。段差部９１は長板部８２の長手方向と直交方向（図２９のＸ方向）に延在している。第２端板部８１のＹ方向の幅Ｗ１は、段差部９１，９１間の距離Ｗ２よりも小さい。 As shown in FIG. 30, stepped portions 91 and 91 are provided on the back surface in the middle of the long plate portion 82 in the longitudinal direction (Y direction in FIG. 29). The step portion 91 extends in a direction orthogonal to the longitudinal direction of the long plate portion 82 (X direction in FIG. 29). The width W 1 in the Y direction of the second end plate portion 81 is smaller than the distance W 2 between the step portions 91 and 91.
　段差部９１よりもＹ方向両端側の長板部８２の裏面９２及び第２の補強片部８５の裏面は、段差部９１の高さ分だけ長板部８２の中央部及び第２端板部８１の裏面よりも高位となっている。第１の補強片部８３の裏面は、溝部９４を除いて、該裏面９２と面一状となっている。 The back surface 92 of the long plate portion 82 and the back surface of the second reinforcing piece portion 85 on both ends in the Y direction from the step portion 91 are the center portion and the second end plate portion of the long plate portion 82 corresponding to the height of the step portion 91. It is higher than the back surface of 81. The back surface of the first reinforcing piece 83 is flush with the back surface 92 except for the groove 94.
　図２９，３０，３３の通り、長板部８２の主板部６１に沿う辺縁部の上面側は、突片部８２ｔとなっている。この突片部８２ｔの裏面は、段差部９３の立ち上り高さだけ長板部８２の中央部及び第２端板部８１の裏面よりも高位となっている。この段差部９３は、長板部８２の長手方向に沿って延在し、第２のリード電極８０の両端縁にまで到達している。 29, 30, 33, the upper surface side of the edge portion along the main plate portion 61 of the long plate portion 82 is a protruding piece portion 82t. The back surface of the projecting piece portion 82 t is higher than the center portion of the long plate portion 82 and the back surface of the second end plate portion 81 by the rising height of the stepped portion 93. The stepped portion 93 extends along the longitudinal direction of the long plate portion 82 and reaches both end edges of the second lead electrode 80.
　補強片部８３には、段差部９３と平行な段差部９８が設けられている。段差部９８は、段差部９３よりも補強片部８３の先端側に位置している。段差部９３，９８間が溝部９４となっている。この溝部９４の底面は、突片部８２ｔの裏面と面一状となっている。 The reinforcing piece 83 is provided with a stepped portion 98 parallel to the stepped portion 93. The step portion 98 is located on the distal end side of the reinforcing piece portion 83 with respect to the step portion 93. A groove 94 is formed between the stepped portions 93 and 98. The bottom surface of the groove portion 94 is flush with the back surface of the protruding piece portion 82t.
　リード電極８０の裏面のうち、長板部８２の中央部及び第２端板部８１が、最も下位に位置し、樹脂成形体３Ｈの底面に露呈している。図２７，２８，３３の通り、段差部９１，９１間の長板部８２の底面の樹脂成形体３Ｈ底面への露呈幅（すなわち段差部９１，９１間の距離）Ｗ２よりも、第２端板部８１のＹ方向の幅Ｗ１が小さいものとなっている。 Of the back surface of the lead electrode 80, the center portion of the long plate portion 82 and the second end plate portion 81 are located at the lowest position and are exposed on the bottom surface of the resin molded body 3H. Figure as 27,28,33, than the step portions 91, 91 between the expose width of the resin molding 3H bottom surface of the bottom surface of the long plate portion 82 (i.e., the distance between the stepped portions 91, 91) W 2, the second It has assumed the width W 1 of the Y-direction of the end plate portion 81 is small.
　長板部８２のＹ方向両端側、補強片部８３及び第２の補強片部８５は樹脂成形体３Ｈ内に埋設されている。長板部８２の上面の一部は、カップ部３ｒ内に露呈している。この露呈した長板部８２上面に対し、金属細線５の一端が接続されている。 The both ends of the long plate portion 82 in the Y direction, the reinforcing piece 83, and the second reinforcing piece 85 are embedded in the resin molded body 3H. A part of the upper surface of the long plate portion 82 is exposed in the cup portion 3r. One end of the thin metal wire 5 is connected to the exposed upper surface of the long plate portion 82.
　補強片部８３に張出部８４，９６が設けられているので、補強片部８３と樹脂成形体３Ｈとが強固に一体となっている。張出部８４，９６の代わりに、補強片部８３に複数の小張出部を設けてもよい。第２の補強片部８５は樹脂成形体３Ｈのコーナー部３Ｃ’に向って延出しており、該コーナー部３Ｃ’の樹脂成形体３Ｈが補強されている。 Since the overhang portions 84 and 96 are provided in the reinforcing piece portion 83, the reinforcing piece portion 83 and the resin molded body 3H are firmly integrated. Instead of the overhang portions 84 and 96, the reinforcing piece portion 83 may be provided with a plurality of small overhang portions. The second reinforcing piece 85 extends toward the corner 3C ′ of the resin molded body 3H, and the resin molded body 3H of the corner 3C ′ is reinforced.
　図２９，３０の通り、第１のリード電極６０は、略正方形状の主板部６１と、該主板部６１に連なる中継板部６２と、該中継板部６２に連なる第２端板部６３と、中継板部６２からＹ方向の両端側に延出した１対の延出板部６４，６４と、各延出板部６４からパッケージ２Ｈのコーナー部３Ｄ’に向って延出した拘束部６５，６５とを有する。拘束部６５は、延出板部６４を挟んで補強片部８３と反対側に延出している。 29 and 30, the first lead electrode 60 includes a substantially square main plate portion 61, a relay plate portion 62 that continues to the main plate portion 61, and a second end plate portion 63 that continues to the relay plate portion 62. A pair of extending plate portions 64, 64 extending from the relay plate portion 62 to both ends in the Y direction, and a restraining portion 65 extending from each extending plate portion 64 toward the corner portion 3D ′ of the package 2H. , 65. The restricting portion 65 extends to the opposite side of the reinforcing piece portion 83 with the extending plate portion 64 interposed therebetween.
　主板部６１は、リード電極８０の補強片部８３，８３及び長板部８２よりなるコ字形枠状部内に配置されている。主板部６１と補強片部８３，８３及び長板部８２との間には所定の間隙があいている。この間隙に樹脂成形体３Ｈの樹脂が充填されている。図２８の通り、主板部６１と長板部８２との間の樹脂成形体３Ｈが両者をつなぐブリッジ部３ｖである。 The main plate portion 61 is disposed in a U-shaped frame-shaped portion composed of the reinforcing piece portions 83 and 83 and the long plate portion 82 of the lead electrode 80. A predetermined gap is provided between the main plate portion 61 and the reinforcing piece portions 83 and 83 and the long plate portion 82. This gap is filled with resin of the resin molded body 3H. As shown in FIG. 28, the resin molded body 3H between the main plate portion 61 and the long plate portion 82 is a bridge portion 3v that connects the two.
　主板部６１の３辺部にあっては、図３０，３３，３６の通り、底面側が切り欠かれ、上面側が突片部６１ｔとなっており、この突片部６１ｔが樹脂成形体３Ｈ内に埋設されている。これにより、主板部６１が樹脂成形体３Ｈから底方向に浮き上ることが防止される。 In the three side portions of the main plate portion 61, as shown in FIGS. 30, 33 and 36, the bottom surface side is notched and the top surface side is a protruding piece portion 61t, and this protruding piece portion 61t is in the resin molded body 3H. Buried. As a result, the main plate portion 61 is prevented from floating in the bottom direction from the resin molded body 3H.
　この実施の形態では、主板部６１の側辺部（補強片部８３側）のうち長板部８２側に、側方に張り出す第３の張出部７２が設けられている。この第３の張出部７２の裏面は、突片部６１ｔの裏面と面一となっている。 In this embodiment, a third projecting portion 72 projecting sideways is provided on the long plate portion 82 side of the side portion (reinforcing piece portion 83 side) of the main plate portion 61. The back surface of the third overhang portion 72 is flush with the back surface of the protruding piece portion 61t.
　突片部６１ｔの裏面は、主板部６１の板央側の裏面よりも段差部７０の立ち上り高さ分だけ高位となっている。段差部７０は中継板部６２を通って第１のリード電極６０の端部にまで到達している。 The back surface of the projecting piece portion 61t is higher than the back surface of the main plate portion 61 on the center side by the rising height of the stepped portion 70. The stepped portion 70 reaches the end of the first lead electrode 60 through the relay plate portion 62.
　中継板部６２と延出板部６４との境界の裏面が段差部７１となっている。この段差部７１は、段差部７０と平行であり、段差部７０，７１間が溝部７３となっている。第１端板部６３のＹ方向の幅Ｗ３は、中継板部６２における段差部７０，７０間の幅Ｗ４よりも小さい。 The back surface of the boundary between the relay plate portion 62 and the extended plate portion 64 is a stepped portion 71. The step portion 71 is parallel to the step portion 70, and a gap 73 is formed between the step portions 70 and 71. The width W 3 in the Y direction of the first end plate portion 63 is smaller than the width W 4 between the step portions 70 and 70 in the relay plate portion 62.
　突片部６１ｔを除いた主板部６１、段差部７０，７０間の中継板部６２及び端板部６３の底面は面一状である。突片部６１ｔ及び溝部７３の底面は、段差部７０の立ち上り高さ分だけ主板部６１の底面よりも高位である。延出板部６４の底面と拘束部６５の底面は面一となっている。延出板部６４及び拘束部６５の底面は、溝部７３の底面よりも段差部７１の立ち上り高さ分だけ低位である。段差部７１の立ち上り高さは段差部７０の立ち上り高さよりも小さく、従って、延出板部６４及び拘束部６５の底面は主板部６１、中継板部６２及び端板部６３の底面よりも高位に位置している。 The bottom surface of the main plate portion 61 excluding the projecting piece portion 61t, the relay plate portion 62 between the step portions 70 and 70, and the end plate portion 63 is flush. The bottom surfaces of the projecting piece portion 61 t and the groove portion 73 are higher than the bottom surface of the main plate portion 61 by the rising height of the stepped portion 70. The bottom surface of the extension plate portion 64 and the bottom surface of the restraint portion 65 are flush with each other. The bottom surfaces of the extension plate portion 64 and the restraining portion 65 are lower than the bottom surface of the groove portion 73 by the rising height of the stepped portion 71. The rising height of the stepped portion 71 is smaller than the rising height of the stepped portion 70. Therefore, the bottom surfaces of the extension plate portion 64 and the restraint portion 65 are higher than the bottom surfaces of the main plate portion 61, the relay plate portion 62, and the end plate portion 63. Is located.
　突片部６１ｔ以外の主板部６１、段差部７０，７０間の中継板部６２、及び端板部６３の底面は樹脂成形体３Ｈの底面と面一状であり、それぞれ樹脂成形体３Ｈの底面に露呈している。突片部６１ｔ、溝部７３、延出板部６４及び拘束部６５は主板部２１及び端板部２３よりも高位であり、全体として樹脂成形体３Ｈ中に埋設されている。従って、中継板部６２の樹脂成形体３Ｈ底面への露呈幅Ｗ４よりも第１端板部６３の先端部のＹ方向の幅Ｗ３が小さいものとなっている。前述の通り、主板部６１は３辺部分の突片部６１ｔが樹脂成形体３Ｈに埋設されており、樹脂成形体３Ｈにしっかりと保持されている。 The bottom surface of the main plate portion 61 other than the projecting piece portion 61t, the relay plate portion 62 between the step portions 70, 70, and the end plate portion 63 is flush with the bottom surface of the resin molded body 3H, and the bottom surface of the resin molded body 3H, respectively. It is exposed to. The projecting piece portion 61t, the groove portion 73, the extending plate portion 64, and the restricting portion 65 are higher than the main plate portion 21 and the end plate portion 23, and are embedded in the resin molded body 3H as a whole. Therefore, the width W 3 in the Y direction of the tip end portion of the first end plate portion 63 is smaller than the exposed width W 4 of the relay plate portion 62 on the bottom surface of the resin molded body 3H. As described above, the projecting portion 61t of the three sides of the main plate portion 61 is embedded in the resin molded body 3H, and is firmly held by the resin molded body 3H.
　延出板部６４，６４から拘束部６５がパッケージ２Ｈのコーナー部３Ｄ’に向って延出しており、該コーナー部３Ｄ’の樹脂成形体３Ｈが該延出板部６４及び拘束部６５によって補強されている。 The restricting portion 65 extends from the extending plate portions 64 and 64 toward the corner portion 3D ′ of the package 2H, and the resin molded body 3H of the corner portion 3D ′ is reinforced by the extending plate portion 64 and the restricting portion 65. Has been.
　この実施の形態では、図２７，３６の通り、樹脂成形体３Ｈのカップ部３ｒの底面において、樹脂部３ｊ，３ｊが突片部６１ｔ及び補強片部８３に被さっている。ブリッジ部３ｖはこの樹脂部３ｊ，３ｊと一体である。この実施の形態では、樹脂部３ｊ，３ｊの上面は、主板部６１に向って下り勾配となる斜面となっているが、勾配がなくてもよい。即ち、樹脂部３ｊ，３ｊの上面は主板部６１と平行であってもよい。 In this embodiment, as shown in FIGS. 27 and 36, the resin portions 3j and 3j cover the projecting piece portion 61t and the reinforcing piece portion 83 on the bottom surface of the cup portion 3r of the resin molded body 3H. The bridge portion 3v is integral with the resin portions 3j and 3j. In this embodiment, the upper surfaces of the resin portions 3j, 3j are inclined surfaces that are downwardly inclined toward the main plate portion 61, but may not be inclined. That is, the upper surfaces of the resin portions 3j and 3j may be parallel to the main plate portion 61.
　この実施の形態では、ブリッジ部３ｖの上面は、主板部６１及び長板部８２の上面すなわち突片部６１ｔ，８２ｔの上面よりも上方にまで立ち上っており、突片部６１ｔ，８２ｔの上縁に被さっている。このため、突片部６１ｔ，８２ｔの上方への浮き上りが防止されると共に、樹脂成形体３Ｈを射出成形するときに樹脂が主板部６１及び長板部８２の上面に漏れ出すことが防止される。また、ブリッジ部３ｖの剛性も大きくなる。 In this embodiment, the upper surface of the bridge portion 3v rises above the upper surfaces of the main plate portion 61 and the long plate portion 82, that is, the upper surfaces of the protruding piece portions 61t and 82t, and the upper edges of the protruding piece portions 61t and 82t. Covered. This prevents the protrusions 61t and 82t from floating upward, and prevents the resin from leaking to the upper surfaces of the main plate portion 61 and the long plate portion 82 when the resin molded body 3H is injection molded. The In addition, the rigidity of the bridge portion 3v is increased.
　このパッケージ２Ｈは、リード電極８０，６０を金型内に設置し、樹脂を射出することにより成形される。この実施の形態では、第２端板部８１の幅Ｗ１は、長板部８２の露呈幅（段差部９１，９１間の幅）Ｗ２よりも小さくなっている。このため、樹脂成形体３Ｈを射出成形するときに、第２端板部８１の基端側の裏面と成形用金型の内面との間に樹脂が侵入することが防止され、バリの発生が防止される。Ｗ１はＷ２の４０～９０％特に５０～８０％程度であることが好ましい。 The package 2H is formed by installing lead electrodes 80 and 60 in a mold and injecting resin. In this embodiment, the width W 1 of the second end plate portion 81 is smaller than the exposed width (width between the step portions 91 and 91) W 2 of the long plate portion 82. For this reason, when the resin molded body 3H is injection-molded, the resin is prevented from entering between the back surface on the base end side of the second end plate portion 81 and the inner surface of the molding die, and burrs are generated. Is prevented. W 1 is preferably about 40 to 90% of W 2 and particularly about 50 to 80%.
　また、この実施の形態では、第１端板部６３の幅Ｗ３は、中継板部６２の露呈幅（段差部７０，７０間の幅）Ｗ４よりも小さくなっている。このため、樹脂成形体３Ｈを射出成形するときに、第１端板部６３の基端側の裏面と成形用金型の内面との間に樹脂が侵入することが防止され、バリの発生が防止される。Ｗ３はＷ４の４０～９０％特に５０～８０％程度であることが好ましい。なお、リード電極６０，８０の上面はすべて面一である。肉厚が小さい突片部８２ｔ，６１ｔ、長板部８２の両端側、補強片部８３は金属板にコイニング加工を施して肉厚を減じることにより形成することができる。 In this embodiment, the width W 3 of the first end plate portion 63 is smaller than the exposed width (width between the stepped portions 70, 70) W 4 of the relay plate portion 62. For this reason, when the resin molded body 3H is injection-molded, the resin is prevented from entering between the back surface on the base end side of the first end plate portion 63 and the inner surface of the molding die, and burrs are generated. Is prevented. W 3 is preferably about 40 to 90%, more preferably about 50 to 80% of W 4 . Note that the upper surfaces of the lead electrodes 60 and 80 are all flush. The projecting piece portions 82t and 61t having a small wall thickness, both end sides of the long plate portion 82, and the reinforcing piece portion 83 can be formed by subjecting a metal plate to a coining process to reduce the wall thickness.
　このパッケージ２Ｈにおいては、図２８，２９の通り、補強片部８３がブリッジ部３ｖの長手方向（Ｙ方向）両端側においてブリッジ部３ｖと直交方向（Ｘ方向）に延在している。そのため、パッケージ２Ｈに対し、ブリッジ部３ｖに沿う軸Ａ１’回りに屈曲させようとする力が加えられたときに、この力が補強片部８３によって対抗され、パッケージ２Ｈの変形が防止される。 In this package 2H, as shown in FIGS. 28 and 29, the reinforcing piece 83 extends in the direction orthogonal to the bridge 3v (X direction) at both ends in the longitudinal direction (Y direction) of the bridge 3v. Therefore, when a force for bending the package 2H around the axis A 1 ′ along the bridge portion 3v is applied, this force is countered by the reinforcing piece portion 83, and deformation of the package 2H is prevented. .
　また、主板部６１と補強片部８３との間の樹脂部３ｊのＸ方向の両端側において、Ｙ方向に延在するようにリード電極８０の長板部８２と、リード電極６０の中継板部６２及び延出板部６４とが存在している。そのため、パッケージ２Ｈに対し、軸Ａ２’回りに屈曲させようとする力が加えられたときに、この力が長板部８２、中継板部６２及び延出板部６４によって対抗され、パッケージ２Ｈの変形が防止される。 In addition, the long plate portion 82 of the lead electrode 80 and the relay plate portion of the lead electrode 60 extend in the Y direction at both ends in the X direction of the resin portion 3j between the main plate portion 61 and the reinforcing piece portion 83. 62 and the extension plate part 64 exist. Therefore, when a force to bend around the axis A 2 ′ is applied to the package 2H, this force is countered by the long plate portion 82, the relay plate portion 62, and the extending plate portion 64, and the package 2H. Is prevented from being deformed.
　この実施の形態では、リード電極８０の長板部８２のＹ方向の両端側及び補強片部８３と、リード電極６０のＹ方向の中継板部６２の両端側及び延出板部６４が樹脂成形体３Ｈに埋設される。
　また補強片部８３及び中継板部６２に溝部９４，７３が設けられており、溝部９４，７３における樹脂の被り厚さが大きくなっている。これにより、リード電極８０，６０と樹脂成形体３Ｈとの結合が強固となっている。 In this embodiment, both end sides in the Y direction of the long plate portion 82 of the lead electrode 80 and the reinforcing piece portion 83, and both end sides of the relay plate portion 62 in the Y direction of the lead electrode 60 and the extending plate portion 64 are resin molded. Embedded in the body 3H.
Further, groove portions 94 and 73 are provided in the reinforcing piece portion 83 and the relay plate portion 62, and the resin covering thickness of the groove portions 94 and 73 is increased. Thereby, the coupling | bonding of the lead electrodes 80 and 60 and the resin molding 3H is strengthened.
　また、第２の補強片部８５と拘束部６５が樹脂成形体３Ｈのコーナー部３Ｃ’，３Ｄ’内に存在するので、コーナー部３Ｃ’，３Ｄ’付近における樹脂成形体３Ｈの強度及び剛性が高くなり、樹脂成形体３Ｈのコーナー部３Ｃ’，３Ｄ’における欠けや破損を防止できる。 In addition, since the second reinforcing piece portion 85 and the restraining portion 65 exist in the corner portions 3C ′ and 3D ′ of the resin molded body 3H, the strength and rigidity of the resin molded body 3H near the corner portions 3C ′ and 3D ′ are increased. It becomes high and can prevent the chipping and breakage at the corner portions 3C ′ and 3D ′ of the resin molded body 3H.
　また、図２８，２９の通り、第２の補強片部８５と拘束部６５が図２９のＸ方向に張り出している。そのため、図２９のＹ方向の変形力が加わった場合にも第２の補強片部８５と拘束部６５によって樹脂成形体３Ｈが拘束され、隙間開きを防止でき、外気の進入，封止材の漏れを防止できる。第２の補強片部８５と拘束部６５は、切り込んだ凹部、または突出した凸部、あるいは立上がる凸部などでもよい。 Further, as shown in FIGS. 28 and 29, the second reinforcing piece 85 and the restraining portion 65 protrude in the X direction of FIG. Therefore, even when a deformation force in the Y direction in FIG. 29 is applied, the resin molded body 3H is restrained by the second reinforcing piece portion 85 and the restraining portion 65, and the gap opening can be prevented. Leakage can be prevented. The second reinforcing piece 85 and the restraining portion 65 may be a cut recess, a protruding protrusion, or a rising protrusion.
　この実施の形態では、補強片部８３に外向きの第２の張出部８４と内向きの第１の張出部９６が設けられると共に、主板部６１には、補強片部８３に向って第３の張出部７２が突設されている。これらの張出部８４，９６，７２は樹脂成形体３Ｈに食い込んでいる。そのため、ブリッジ部３ｖの幅、すなわち主板部６１と長板部８２との間隔を広げようとするＸ方向の外力が加えられても、この外力は張出部８４，９６，７２によって対抗され、ブリッジ部３ｖの幅が広がることが阻止される。 In this embodiment, the reinforcing piece portion 83 is provided with an outward second overhang portion 84 and an inward first overhang portion 96, and the main plate portion 61 is directed toward the reinforcing piece portion 83. The 3rd overhang | projection part 72 is protrudingly provided. These overhang portions 84, 96, and 72 bite into the resin molded body 3H. Therefore, even if an external force in the X direction is applied to increase the width of the bridge portion 3v, that is, the interval between the main plate portion 61 and the long plate portion 82, this external force is countered by the overhang portions 84, 96, 72, An increase in the width of the bridge portion 3v is prevented.
　図３８のリード電極８０’，６０’は、主板部６１からの第３の張出部７２の張出長さを図２７～３７のパッケージ２Ｈよりも大きくすると共に、これに対応して、補強片部８３の主板部６１に臨む辺部に、後退部７５を設けたものである。後退部７５は主板部６１から遠ざかる方向に後退している。図３８のリード電極８０’，６０’のその他の構成は図２７～３７のリード電極８０，６０と同一であり、図３８のその他の符号は図２７～３７と同一部分を示している。このリード電極８０’，６０’を用いたパッケージは、Ｘ方向の外力が加えられたときのブリッジ部３ｖの隙間開きが防止される。 The lead electrodes 80 ′ and 60 ′ in FIG. 38 are reinforced in accordance with the extension length of the third extension portion 72 from the main plate portion 61 larger than that of the package 2H in FIGS. A receding portion 75 is provided on the side of the piece 83 facing the main plate 61. The retreating part 75 has retreated in the direction away from the main plate part 61. Other configurations of the lead electrodes 80 'and 60' in FIG. 38 are the same as those of the lead electrodes 80 and 60 in FIGS. 27 to 37, and other reference numerals in FIG. 38 indicate the same parts as those in FIGS. In the package using the lead electrodes 80 ′ and 60 ′, the gap of the bridge portion 3 v is prevented from being opened when an external force in the X direction is applied.
　張出部７２の裏面は、張出部７２の先端部（段差部７１のＸ方向延長線上よりも補強片部８３側の部分）において延出板部６４の裏面と同一高さである。張出部７２の根元部においては、張出部７２の裏面は溝部７３と同一高さの溝部となっている。このように、張出部７２根元部の裏面に溝部を設けることにより、張出部７２の樹脂成形体３Ｈへの食い込みが強固となり、パッケージ２ＨのＹ方向に外力が加えられたときの樹脂部３ｊ，３ｊと主板部６１との間の剥離および隙間開きが防止でき、剥離間隙からの外気の進入，封止材の漏れを防止できる。 The back surface of the overhanging portion 72 has the same height as the back surface of the extending plate portion 64 at the tip of the overhanging portion 72 (the portion closer to the reinforcing piece portion 83 than on the X-direction extension line of the stepped portion 71). In the base portion of the overhang portion 72, the back surface of the overhang portion 72 is a groove portion having the same height as the groove portion 73. Thus, by providing the groove on the back surface of the base of the overhang portion 72, the biting into the resin molded body 3H of the overhang portion 72 becomes strong, and the resin portion when an external force is applied in the Y direction of the package 2H. Separation and gap opening between 3j, 3j and the main plate portion 61 can be prevented, and entry of outside air from the separation gap and leakage of the sealing material can be prevented.
　この実施の形態においても、前記実施の形態と同様に、多数のパッケージ２Ｈが図１４～１６のように吊りリード５０を介してリードフレーム（図示略）に連結される。この実施の形態でも、図１５，１６のように、吊りリード５０の先端部を、先端側ほどパッケージ２Ｈの底面から離反するように屈曲させて爪状部５１を形成し、この爪状部５１が樹脂成形体３Ｈに刺し込まれた形態とするのが好ましい。 Also in this embodiment, as in the above-described embodiment, a large number of packages 2H are connected to a lead frame (not shown) through suspension leads 50 as shown in FIGS. Also in this embodiment, as shown in FIGS. 15 and 16, the claw-like portion 51 is formed by bending the tip portion of the suspension lead 50 so as to be farther from the bottom surface of the package 2H toward the tip side. Is preferably embedded in the resin molded body 3H.
　また、この実施の形態でも、爪状部５１の先端の厚みｂを吊りリード５０の本体部側の厚みａよりも小さくし、爪状部５１の先端側ほど厚みが小さくなるようにするのが好ましい。 Also in this embodiment, the thickness b of the tip of the claw-like portion 51 is made smaller than the thickness a on the main body portion side of the suspension lead 50, and the thickness is made smaller toward the tip side of the claw-like portion 51. preferable.
　この実施の形態でも、パッケージ２Ｈのコーナー部３Ｃ’，３Ｄ’に補強片部８５及び拘束部６５を埋設して該コーナー部におけるパッケージ２Ｈの剛性を高くしているため、パッケージ２Ｈが変形して爪状部５１が抜けることが防止され、パッケージ２Ｈの保持が安定する。また、爪状部５１の刺し込み深さを過度に大きくすることがなくパッケージ２Ｈの保持力を高めることができることから、パッケージ２Ｈのコーナー部３Ｃ’，３Ｄ’の近傍に吊りリード５０の爪状部５１が配置される場合にはパッケージ２Ｈのコーナー部３Ｃ’，３Ｄ’の補強片部８５、拘束部６５を埋設する空間を確保できるため、コーナー部３Ｃ’，３Ｄ’における樹脂成形体３Ｈの強度及び剛性を高く確保しつつ、かつ、パッケージ２Ｈの保持力を高める吊りリードを構成することができる。 Also in this embodiment, since the reinforcing piece 85 and the restraining portion 65 are embedded in the corner portions 3C ′ and 3D ′ of the package 2H to increase the rigidity of the package 2H, the package 2H is deformed. The claw-like portion 51 is prevented from coming off and the holding of the package 2H is stabilized. Further, since the holding force of the package 2H can be increased without excessively increasing the insertion depth of the claw-like portion 51, the claw-like shape of the suspension lead 50 is provided in the vicinity of the corner portions 3C ′ and 3D ′ of the package 2H. When the portion 51 is disposed, a space for embedding the reinforcing piece 85 and the restraining portion 65 of the corner portions 3C ′ and 3D ′ of the package 2H can be secured, so that the resin molded body 3H of the corner portions 3C ′ and 3D ′ can be secured. It is possible to configure the suspension lead that ensures high strength and rigidity and increases the holding force of the package 2H.
　上記実施の形態は本発明の一例であり、本発明は図示以外の形態とされてもよい。樹脂成形体の樹脂としては、シリコーン樹脂が好適であるが、これに限定されない。リード電極の材料としては、銅合金が例示されるが、これに限定されない。 The above embodiment is an example of the present invention, and the present invention may be other than illustrated. The resin of the resin molded body is preferably a silicone resin, but is not limited thereto. The lead electrode material is exemplified by a copper alloy, but is not limited thereto.
　本発明を特定の態様を用いて詳細に説明したが、本発明の意図と範囲を離れることなく様々な変更が可能であることは当業者に明らかである。
　なお、本出願は、２０１２年８月２３日付で出願された日本特許出願（特願２０１２－１８４３０９）、２０１２年１１月１４日付で出願された日本特許出願（特願２０１２－２４９９３７）及び２０１３年４月１８日付で出願された日本特許出願（特願２０１３－０８７５４３）に基づいており、その全体が引用により援用される。 Although the present invention has been described in detail using specific embodiments, it will be apparent to those skilled in the art that various modifications can be made without departing from the spirit and scope of the invention.
The present application includes a Japanese patent application filed on August 23, 2012 (Japanese Patent Application 2012-184309), a Japanese patent application filed on November 14, 2012 (Japanese Patent Application 2012-249937), and 2013. This is based on a Japanese patent application (Japanese Patent Application No. 2013-087543) filed on April 18, and is incorporated by reference in its entirety.

Claims (17)

  1. 　一辺同士を対峙させて配置された第１及び第２のリード電極と、
    　該リード電極と一体となるように成形された樹脂成形体と
    を有し、該樹脂成形体は環形であり、該樹脂成形体の内側に発光素子配置用のカップ部が設けられている発光装置用パッケージにおいて、
    　該第２のリード電極に、前記一辺の長手方向両端側から延出し、第１のリード電極の側辺に沿って延在する第１の補強片部が設けられており、
    　前記補強片部の延在方向先端側に、前記第１のリード電極に向って張り出す第１の張出部が設けられている
    ことを特徴とする発光装置用パッケージ。     First and second lead electrodes arranged with the sides facing each other;
    A light-emitting device having a resin molded body formed integrally with the lead electrode, the resin molded body having a ring shape, and a cup portion for arranging a light-emitting element provided inside the resin molded body In the package for
    The second lead electrode is provided with a first reinforcing piece that extends from both longitudinal ends of the one side and extends along the side of the first lead electrode.
    A package for a light-emitting device, wherein a first projecting portion that projects toward the first lead electrode is provided on a distal end side in the extending direction of the reinforcing piece portion.
  2. 　請求項１において、前記第１の補強片部の少なくとも延出方向先端側が前記樹脂成形体に埋設されていることを特徴とする発光装置用パッケージ。 2. The light emitting device package according to claim 1, wherein at least a front end side in the extending direction of the first reinforcing piece is embedded in the resin molded body.
  3. 　請求項１又は２において、前記カップ部は前記樹脂成形体の一方の面（以下、上面という。）から他方の面（以下、底面という。）に向って凹設されており、
    　前記第２のリード電極は、
    　長板部と、
    　該長板部の一方の長辺に連なり、樹脂成形体の外方に延出した第２端板部と
    を有しており、
    　前記第１のリード電極は、該長板部に対峙する主板部と、
    　該主板部の前記長板部と反対側に連なる中継板部と、該中継板部の該主板部と反対側に連なり、樹脂成形体の外方に延出した第１端板部とを有しており、該主板部は、その上面の少なくとも一部が前記カップ部に露呈しており、底面の少なくとも一部がパッケージの底面に露呈していることを特徴とする発光装置用パッケージ。     In Claim 1 or 2, the said cup part is dented toward the other side (henceforth a bottom face) from one side (henceforth an upper face) of the resin fabrication object,
    The second lead electrode is
    A long plate part,
    A second end plate connected to one long side of the long plate portion and extending outward of the resin molded body;
    The first lead electrode includes a main plate portion facing the long plate portion,
    A relay plate portion connected to the opposite side of the main plate portion to the long plate portion, and a first end plate portion connected to the opposite side of the relay plate portion to the main plate portion and extending outward of the resin molded body. The main plate portion is a package for a light emitting device, wherein at least a part of an upper surface thereof is exposed to the cup portion, and at least a part of a bottom surface is exposed to a bottom surface of the package.
  4. 　請求項３において、前記長板部の長手方向の中央部のパッケージ底面における該長手方向の露呈幅Ｗ２よりも前記第２端板部の先端部の幅Ｗ１が小さいことを特徴とする発光装置用パッケージ。 In claim 3, the light emitting, wherein the width W 1 of the distal end portion of the second end plate portion than the longitudinal direction of the exposed width W 2 is smaller at the bottom of the package in the longitudinal center portion of the long plate portion Equipment package.
  5. 　請求項３又は４において、前記長板部の長手方向の両端部から前記第１の補強片部と反対方向に第２の補強片部が延設されていることを特徴とする発光装置用パッケージ。 5. The light emitting device package according to claim 3, wherein a second reinforcing piece portion is extended from both longitudinal ends of the long plate portion in a direction opposite to the first reinforcing piece portion. .
  6. 　請求項２ないし５のいずれか１項において、前記第１の補強片部には、前記主板部と反対側の辺部から張り出す第２の張出部が設けられていることを特徴とする発光装置用パッケージ。 6. The method according to claim 2, wherein the first reinforcing piece is provided with a second projecting portion that projects from a side portion opposite to the main plate portion. Package for light emitting device.
  7. 　請求項２ないし６のいずれか１項において、前記第１のリード電極の前記中継板部の長手方向の中央部は前記パッケージの底面に露呈しており、該中継板部の長手方向の両端側は前記樹脂成形体中に埋設されており、この中継板部のパッケージ底面への露呈幅Ｗ４よりも前記第２端板部の先端側の幅Ｗ３が小さいことを特徴とする発光装置用パッケージ。 7. The longitudinal center portion of the relay plate portion of the first lead electrode is exposed on the bottom surface of the package according to claim 1, and both end sides in the longitudinal direction of the relay plate portion Is embedded in the resin molded body, and the width W 3 on the front end side of the second end plate portion is smaller than the exposed width W 4 of the relay plate portion on the package bottom surface. package.
  8. 　請求項２ないし７のいずれか１項において、前記第２のリード電極は、前記中継板部に連なり、該パッケージのコーナー部まで延出した延出板部を有しており、該延出板部が前記樹脂成形体に埋設されていることを特徴とする発光装置用パッケージ。 8. The second lead electrode according to claim 2, wherein the second lead electrode includes an extension plate portion that is continuous with the relay plate portion and extends to a corner portion of the package. A package for a light-emitting device, wherein a portion is embedded in the resin molded body.
  9. 　請求項８において、前記延出板部に、前記樹脂成形体を拘束するための凸部、凹部又は開口よりなる拘束部が設けられていることを特徴とする発光装置用パッケージ。 9. The light emitting device package according to claim 8, wherein the extending plate portion is provided with a constraining portion including a convex portion, a concave portion or an opening for constraining the resin molded body.
  10. 　請求項２ないし９のいずれか１項において、前記主板部の前記補強片部側の辺部から該補強片部に向かって張り出す第３の張出部が設けられていることを特徴とする発光装置用パッケージ。 The third projecting portion according to any one of claims 2 to 9, wherein a third projecting portion is provided to project from a side portion on the reinforcing piece portion side of the main plate portion toward the reinforcing piece portion. Package for light emitting device.
  11. 　請求項１０において、前記補強片部の前記主板部側の辺部には、該第３の張出部に対峙して、主板部から遠ざかるように後退した後退部が設けられていることを特徴とする発光装置用パッケージ。 In Claim 10, The side part by the side of the above-mentioned main plate part of the above-mentioned reinforcement piece part is provided with the retreating part which retreated so that it may distance from the main plate part facing the 3rd overhanging part. A package for a light emitting device.
  12. 　請求項１又は２において、前記第１のリード電極は、前記補強片部に対峙する側辺部のうち前記樹脂成形体と重なる箇所の一部に、第１の凹欠部が設けられていることを特徴とする発光装置用パッケージ。 3. The first lead electrode according to claim 1, wherein the first lead electrode is provided with a first recessed portion in a part of the side portion facing the reinforcing piece portion that overlaps the resin molded body. A package for a light-emitting device.
  13. 　請求項１，２，１２のいずれか１項において、前記第２のリード電極は、前記一辺と反対側の辺部の辺長方向の両端側に、前記補強片部と反対方向に延出する第２の補強片部が設けられていることを特徴とする発光装置用パッケージ。 13. The second lead electrode according to claim 1, wherein the second lead electrode extends in a direction opposite to the reinforcing piece portion on both ends in the side length direction of the side opposite to the one side. A package for a light emitting device, wherein a second reinforcing piece is provided.
  14. 　請求項１，２，１２，１３のいずれか１項において、前記第２のリード電極は、前記一辺と反対側の辺部の長手方向の中央部が外方に延出した延出部となっており、この延出部の側辺部のうち前記樹脂成形体と重なる箇所の一部に第２の凹欠部が設けられていることを特徴とする発光装置用パッケージ。 14. The second lead electrode according to claim 1, wherein the second lead electrode is an extended portion in which a central portion in a longitudinal direction of a side portion opposite to the one side extends outward. A package for a light emitting device, wherein a second recessed portion is provided in a part of the side portion of the extending portion that overlaps the resin molded body.
  15. 　請求項１ないし１４のいずれか１項において、前記樹脂成形体に吊りリードの先端部が刺し込まれており、該吊りリードの該先端部は、先端側ほど樹脂成形体の底面から離反するように屈曲していることを特徴とする発光装置用パッケージ。 15. The tip of a suspension lead is inserted into the resin molded body according to any one of claims 1 to 14, and the tip of the suspension lead is separated from the bottom surface of the resin molded body toward the distal end side. A package for a light emitting device, wherein the package is bent.
  16. 　請求項１５において、該吊りリードは、先端側ほど厚みが小さいことを特徴とする発光装置用パッケージ。 16. The light emitting device package according to claim 15, wherein the thickness of the suspension lead is smaller toward the tip side.
  17. 　請求項１ないし１６のいずれか１項に記載の発光装置用パッケージと、該パッケージに実装された発光素子とを有する発光装置。 A light emitting device comprising the light emitting device package according to any one of claims 1 to 16 and a light emitting element mounted on the package.
PCT/JP2013/071110 2012-08-23 2013-08-05 Package for light-emitting device, and light-emitting device WO2014030530A1 (en)

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JP2012184309A JP2014041966A (en) 2012-08-23 2012-08-23 Package for light emitting device and light emitting device
JP2012-184309 2012-08-23
JP2012-249937 2012-11-14
JP2012249937 2012-11-14
JP2013087543A JP2014116575A (en) 2012-11-14 2013-04-18 Package for light emitting device and light emitting device
JP2013-087543 2013-04-18

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