JPH0427507B2 - - Google Patents
Info
- Publication number
- JPH0427507B2 JPH0427507B2 JP56123421A JP12342181A JPH0427507B2 JP H0427507 B2 JPH0427507 B2 JP H0427507B2 JP 56123421 A JP56123421 A JP 56123421A JP 12342181 A JP12342181 A JP 12342181A JP H0427507 B2 JPH0427507 B2 JP H0427507B2
- Authority
- JP
- Japan
- Prior art keywords
- package
- insulating plate
- lead terminal
- spring pin
- floating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000012212 insulator Substances 0.000 claims description 14
- 239000004065 semiconductor Substances 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 7
- 239000011347 resin Substances 0.000 description 19
- 229920005989 resin Polymers 0.000 description 19
- 238000005259 measurement Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 2
- 210000000078 claw Anatomy 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Tests Of Electronic Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56123421A JPS5824871A (ja) | 1981-08-06 | 1981-08-06 | 半導体パッケ−ジ測定治具 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56123421A JPS5824871A (ja) | 1981-08-06 | 1981-08-06 | 半導体パッケ−ジ測定治具 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5824871A JPS5824871A (ja) | 1983-02-14 |
JPH0427507B2 true JPH0427507B2 (ru) | 1992-05-12 |
Family
ID=14860131
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56123421A Granted JPS5824871A (ja) | 1981-08-06 | 1981-08-06 | 半導体パッケ−ジ測定治具 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5824871A (ru) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6258780U (ru) * | 1985-09-30 | 1987-04-11 | ||
JPS6258779U (ru) * | 1985-09-30 | 1987-04-11 | ||
JPS6258778U (ru) * | 1985-09-30 | 1987-04-11 | ||
JPH0310273U (ru) * | 1989-06-15 | 1991-01-31 | ||
JPH05209933A (ja) * | 1992-01-29 | 1993-08-20 | Nec Corp | 被測定物位置出し機構付きコンタクタおよびそれを用いた自動選別装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54119667U (ru) * | 1978-02-10 | 1979-08-22 |
-
1981
- 1981-08-06 JP JP56123421A patent/JPS5824871A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5824871A (ja) | 1983-02-14 |
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