JPH0426285B2 - - Google Patents
Info
- Publication number
- JPH0426285B2 JPH0426285B2 JP61246117A JP24611786A JPH0426285B2 JP H0426285 B2 JPH0426285 B2 JP H0426285B2 JP 61246117 A JP61246117 A JP 61246117A JP 24611786 A JP24611786 A JP 24611786A JP H0426285 B2 JPH0426285 B2 JP H0426285B2
- Authority
- JP
- Japan
- Prior art keywords
- laminate
- temperature
- strip
- shaped
- strips
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000010438 heat treatment Methods 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 15
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 12
- 238000010030 laminating Methods 0.000 claims description 3
- 229910000831 Steel Inorganic materials 0.000 description 17
- 239000010959 steel Substances 0.000 description 17
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 239000011888 foil Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Moulding By Coating Moulds (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61246117A JPS6398433A (ja) | 1986-10-15 | 1986-10-15 | 積層板の製法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61246117A JPS6398433A (ja) | 1986-10-15 | 1986-10-15 | 積層板の製法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6398433A JPS6398433A (ja) | 1988-04-28 |
| JPH0426285B2 true JPH0426285B2 (xx) | 1992-05-07 |
Family
ID=17143734
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61246117A Granted JPS6398433A (ja) | 1986-10-15 | 1986-10-15 | 積層板の製法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6398433A (xx) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH066298B2 (ja) * | 1989-01-07 | 1994-01-26 | 大同鋼板株式会社 | 断熱パネルの製造方法 |
-
1986
- 1986-10-15 JP JP61246117A patent/JPS6398433A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6398433A (ja) | 1988-04-28 |
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