JPH0584721B2 - - Google Patents
Info
- Publication number
- JPH0584721B2 JPH0584721B2 JP62208554A JP20855487A JPH0584721B2 JP H0584721 B2 JPH0584721 B2 JP H0584721B2 JP 62208554 A JP62208554 A JP 62208554A JP 20855487 A JP20855487 A JP 20855487A JP H0584721 B2 JPH0584721 B2 JP H0584721B2
- Authority
- JP
- Japan
- Prior art keywords
- prepreg
- resin
- cut
- base material
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011347 resin Substances 0.000 claims description 16
- 229920005989 resin Polymers 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 12
- 238000005520 cutting process Methods 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 239000011521 glass Substances 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 8
- 239000000843 powder Substances 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- 238000005056 compaction Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000000465 moulding Methods 0.000 description 3
- 239000011190 CEM-3 Substances 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Reinforced Plastic Materials (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20855487A JPS6451926A (en) | 1987-08-22 | 1987-08-22 | Prepreg |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20855487A JPS6451926A (en) | 1987-08-22 | 1987-08-22 | Prepreg |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6451926A JPS6451926A (en) | 1989-02-28 |
JPH0584721B2 true JPH0584721B2 (xx) | 1993-12-03 |
Family
ID=16558105
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20855487A Granted JPS6451926A (en) | 1987-08-22 | 1987-08-22 | Prepreg |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6451926A (xx) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0477210A (ja) * | 1990-07-19 | 1992-03-11 | Matsushita Electric Works Ltd | プリント配線板用プリプレグ |
JPH0477211A (ja) * | 1990-07-19 | 1992-03-11 | Matsushita Electric Works Ltd | プリント配線板用プリプレグ |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5211340A (en) * | 1975-07-16 | 1977-01-28 | Nippon Denso Co Ltd | Ignition time control device |
JPS61211006A (ja) * | 1985-03-15 | 1986-09-19 | Hitachi Chem Co Ltd | プリプレグの製造方法 |
JPS63158216A (ja) * | 1986-12-22 | 1988-07-01 | Hitachi Chem Co Ltd | 積層板の製造法 |
-
1987
- 1987-08-22 JP JP20855487A patent/JPS6451926A/ja active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5211340A (en) * | 1975-07-16 | 1977-01-28 | Nippon Denso Co Ltd | Ignition time control device |
JPS61211006A (ja) * | 1985-03-15 | 1986-09-19 | Hitachi Chem Co Ltd | プリプレグの製造方法 |
JPS63158216A (ja) * | 1986-12-22 | 1988-07-01 | Hitachi Chem Co Ltd | 積層板の製造法 |
Also Published As
Publication number | Publication date |
---|---|
JPS6451926A (en) | 1989-02-28 |
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