JPH0423836B2 - - Google Patents

Info

Publication number
JPH0423836B2
JPH0423836B2 JP59126787A JP12678784A JPH0423836B2 JP H0423836 B2 JPH0423836 B2 JP H0423836B2 JP 59126787 A JP59126787 A JP 59126787A JP 12678784 A JP12678784 A JP 12678784A JP H0423836 B2 JPH0423836 B2 JP H0423836B2
Authority
JP
Japan
Prior art keywords
lead
layer
film carrier
opening
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59126787A
Other languages
English (en)
Japanese (ja)
Other versions
JPS616848A (ja
Inventor
Manabu Bonshihara
Kazufumi Terachi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP12678784A priority Critical patent/JPS616848A/ja
Publication of JPS616848A publication Critical patent/JPS616848A/ja
Publication of JPH0423836B2 publication Critical patent/JPH0423836B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Wire Bonding (AREA)
JP12678784A 1984-06-20 1984-06-20 配線基板 Granted JPS616848A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12678784A JPS616848A (ja) 1984-06-20 1984-06-20 配線基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12678784A JPS616848A (ja) 1984-06-20 1984-06-20 配線基板

Publications (2)

Publication Number Publication Date
JPS616848A JPS616848A (ja) 1986-01-13
JPH0423836B2 true JPH0423836B2 (fr) 1992-04-23

Family

ID=14943924

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12678784A Granted JPS616848A (ja) 1984-06-20 1984-06-20 配線基板

Country Status (1)

Country Link
JP (1) JPS616848A (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004093183A1 (fr) * 1995-03-17 2004-10-28 Atsushi Hino Support de film et dispositif a semi-conducteur l'utilisant
JP4383461B2 (ja) 2007-03-14 2009-12-16 長野計器株式会社 センサ及びセンサの製造方法
JP5236377B2 (ja) 2008-07-16 2013-07-17 シャープ株式会社 半導体装置および表示装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5420350B2 (fr) * 1975-04-18 1979-07-21

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5420350U (fr) * 1977-07-13 1979-02-09

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5420350B2 (fr) * 1975-04-18 1979-07-21

Also Published As

Publication number Publication date
JPS616848A (ja) 1986-01-13

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