JPH0423356Y2 - - Google Patents
Info
- Publication number
- JPH0423356Y2 JPH0423356Y2 JP1986191424U JP19142486U JPH0423356Y2 JP H0423356 Y2 JPH0423356 Y2 JP H0423356Y2 JP 1986191424 U JP1986191424 U JP 1986191424U JP 19142486 U JP19142486 U JP 19142486U JP H0423356 Y2 JPH0423356 Y2 JP H0423356Y2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- thin plates
- flow path
- liquid
- thin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986191424U JPH0423356Y2 (cs) | 1986-12-12 | 1986-12-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986191424U JPH0423356Y2 (cs) | 1986-12-12 | 1986-12-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6397292U JPS6397292U (cs) | 1988-06-23 |
| JPH0423356Y2 true JPH0423356Y2 (cs) | 1992-05-29 |
Family
ID=31145557
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986191424U Expired JPH0423356Y2 (cs) | 1986-12-12 | 1986-12-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0423356Y2 (cs) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3891908B2 (ja) * | 1995-07-19 | 2007-03-14 | 株式会社トクヤマ | 窒化アルミニウム接合構造体の製造方法 |
| JP3891621B2 (ja) * | 1996-12-19 | 2007-03-14 | 株式会社トクヤマ | 窒化アルミニウム部材 |
| JP2007180353A (ja) * | 2005-12-28 | 2007-07-12 | Usui Kokusai Sangyo Kaisha Ltd | ヒートシンク |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS572685U (cs) * | 1980-06-06 | 1982-01-08 | ||
| JPS5744700U (cs) * | 1980-08-27 | 1982-03-11 | ||
| FR2544917B1 (fr) * | 1983-04-21 | 1986-09-26 | Metalimphy | Support allege pour composants electroniques |
-
1986
- 1986-12-12 JP JP1986191424U patent/JPH0423356Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6397292U (cs) | 1988-06-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5801996B2 (ja) | 両面冷却式電力用被覆層付き電力モジュール | |
| US4794981A (en) | Cooling system | |
| US8472193B2 (en) | Semiconductor device | |
| KR101384426B1 (ko) | 파워 모듈용 베이스 | |
| KR101477578B1 (ko) | 열 싱크에 열적으로 커플링된 인쇄회로기판을 구비한전자식 회로 장치 | |
| JP5414349B2 (ja) | 電子装置 | |
| US20070045801A1 (en) | Circuit board | |
| JP2008282969A (ja) | 冷却器及び電子機器 | |
| JP2536120B2 (ja) | 電子部品の冷却構造 | |
| JPH0423356Y2 (cs) | ||
| JP3726767B2 (ja) | 半導体モジュール | |
| JPH10308486A (ja) | 沸騰冷却装置及びその製造方法 | |
| JP4493026B2 (ja) | 冷却装置付き回路基板の製造方法 | |
| JP5227681B2 (ja) | 半導体装置 | |
| JPH07111378A (ja) | 両面実装基板の実装構造 | |
| CN206685368U (zh) | Igbt散热模组和车辆 | |
| EP1726197B1 (en) | An element for carrying electronic components | |
| JP7650032B2 (ja) | 熱媒体加熱装置 | |
| JPS5839044A (ja) | 半導体装置用集積パツケ−ジ・薄膜熱交換器 | |
| JPH03209859A (ja) | 半導体冷却装置 | |
| JPH07321423A (ja) | 回路基板 | |
| JP3403138B2 (ja) | 配線板及びその熱シート並びにその熱基板 | |
| JPH0461504B2 (cs) | ||
| JPH0617313Y2 (ja) | 液冷形半導体パッケージ | |
| JPH0461506B2 (cs) |