JPH0420243U - - Google Patents
Info
- Publication number
- JPH0420243U JPH0420243U JP6031290U JP6031290U JPH0420243U JP H0420243 U JPH0420243 U JP H0420243U JP 6031290 U JP6031290 U JP 6031290U JP 6031290 U JP6031290 U JP 6031290U JP H0420243 U JPH0420243 U JP H0420243U
- Authority
- JP
- Japan
- Prior art keywords
- sealing resin
- package
- case body
- semiconductor device
- injection hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007789 sealing Methods 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 4
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案実施例の構造を示す一部切欠側
面図、第２図は第１図における栓蓋の斜視図、第
３図は従来における半導体装置のパツケージ構造
を示す側面図、第４図は第３図におけるケース蓋
の平面図である。図において、
１……放熱用金属ベース板、２……パツケージ
、３……外部導出端子、４……封止樹脂、８……
ケース本体、８ａ……外部導出端子の引出穴、８
ｂ……封止樹脂注入穴、９……栓蓋、９ａ……脚
部。
FIG. 1 is a partially cutaway side view showing the structure of an embodiment of the present invention, FIG. 2 is a perspective view of the lid in FIG. 1, FIG. 3 is a side view showing the conventional package structure of a semiconductor device, and FIG. The figure is a plan view of the case lid in FIG. 3. In the figure, 1... Metal base plate for heat dissipation, 2... Package, 3... External lead-out terminal, 4... Sealing resin, 8...
Case body, 8a...Output hole for external lead-out terminal, 8
b... Sealing resin injection hole, 9... Cap lid, 9a... Leg portion.
Claims (1)
、外部導出端子の回路組立体を収容し、かつ内部
空間に封止樹脂を充填した半導体装置のパツケー
ジであつて、上面に外部導出端子の引出穴、およ
び封止樹脂注入穴を開口した底面開放の箱形ケー
ス本体と、該ケース本体の封止樹脂注入穴を封栓
する脚部付き栓蓋とから成り、かつ前記脚部は栓
蓋からケース本体の内方に突き出して封止樹脂の
層内に埋設されるものであることを特徴とする半
導体装置のパツケージ。 A package for a semiconductor device that houses a circuit assembly of a semiconductor chip and external lead-out terminals in combination with a metal base plate for heat dissipation, and has an internal space filled with sealing resin, and has a lead-out hole for the external lead-out terminals on the top surface; and a box-shaped case body with an open bottom and a sealing resin injection hole, and a stopper lid with legs for sealing the sealing resin injection hole of the case body, and the legs extend from the stopper lid to the case body. A package for a semiconductor device, characterized in that the package protrudes inward and is embedded within a layer of sealing resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6031290U JPH087638Y2 (en) | 1990-06-07 | 1990-06-07 | Semiconductor device package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6031290U JPH087638Y2 (en) | 1990-06-07 | 1990-06-07 | Semiconductor device package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0420243U true JPH0420243U (en) | 1992-02-20 |
| JPH087638Y2 JPH087638Y2 (en) | 1996-03-04 |
Family
ID=31587568
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6031290U Expired - Lifetime JPH087638Y2 (en) | 1990-06-07 | 1990-06-07 | Semiconductor device package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH087638Y2 (en) |
-
1990
- 1990-06-07 JP JP6031290U patent/JPH087638Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH087638Y2 (en) | 1996-03-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0420243U (en) | ||
| JPH0363943U (en) | ||
| JPH028048U (en) | ||
| JPH0363944U (en) | ||
| JPS60179098U (en) | Integrated circuit device storage container | |
| JPH0187558U (en) | ||
| JPH0310543U (en) | ||
| JPS62170641U (en) | ||
| JPH0247050U (en) | ||
| JPS6333628U (en) | ||
| JPS6165684U (en) | ||
| JPS6047342U (en) | solid state relay | |
| JPS60151137U (en) | Chippukiyariya | |
| JPH0482849U (en) | ||
| JPH0192145U (en) | ||
| JPS61106036U (en) | ||
| JPS62116551U (en) | ||
| JPH0375535U (en) | ||
| JPS6413730U (en) | ||
| JPS5827972U (en) | Resin-encapsulated electronic equipment | |
| JPH0434747U (en) | ||
| JPS6245848U (en) | ||
| JPS6047338U (en) | 3 phase solid state relay | |
| JPH02142541U (en) | ||
| JPH0275739U (en) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |