JPS5827972U - Resin-encapsulated electronic equipment - Google Patents
Resin-encapsulated electronic equipmentInfo
- Publication number
- JPS5827972U JPS5827972U JP12138881U JP12138881U JPS5827972U JP S5827972 U JPS5827972 U JP S5827972U JP 12138881 U JP12138881 U JP 12138881U JP 12138881 U JP12138881 U JP 12138881U JP S5827972 U JPS5827972 U JP S5827972U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- electronic equipment
- opening
- encapsulated electronic
- case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Casings For Electric Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は、従来の樹脂封止型電子機器の縦断面図、第2
図は、上記機器の蓋体の平面図、第3図は、本考案に係
る蓋体の平面図、第4図は、第3図のA−A線に沿う断
面図、第5図は、上記蓋体における切欠部の詳細図、第
6図は、本考案に係る蓋体を用いて製作した樹脂封止型
電子機器の縦断面図、第7図は、上記電子機器をプリン
ト基板に塔載した状態の一部切欠断面図である。
11.28・・・プリント基板、15.16・・・外部
導出リード、17・・・・・・樹脂ケース、18・・・
・・・樹脂、20・・・・・・蓋体、21・・・開口部
、22・・・突起、23・・・切欠部、24・・・凹部
、25・・・開口部、26・・・樹脂封止型電子機器、
27・・・スルーホール。Figure 1 is a vertical cross-sectional view of a conventional resin-sealed electronic device;
3 is a plan view of the lid of the device, FIG. 4 is a sectional view taken along line A-A in FIG. 3, and FIG. 5 is a plan view of the lid of the device. A detailed view of the notch in the lid, FIG. 6 is a vertical cross-sectional view of a resin-sealed electronic device manufactured using the lid according to the present invention, and FIG. 7 is a detailed view of the notch in the lid, and FIG. It is a partially cutaway sectional view of the mounted state. 11.28... Printed circuit board, 15.16... External lead-out lead, 17... Resin case, 18...
... Resin, 20... Lid, 21... Opening, 22... Protrusion, 23... Notch, 24... Recess, 25... Opening, 26...・Resin-sealed electronic devices,
27...Through hole.
Claims (1)
出リードを立設して所定の電子回路を形成したものを樹
脂ケース内に収納し、樹脂封止してなる樹脂封止型電子
機器において、前記ケースの開口端に被せる蓋体の略中
夫に樹脂注入用の開口部を設け、この開口部の周縁に一
定の高さを有する突起を形成したことを特徴とする樹脂
封止型電子機器。A resin-sealed type in which electronic components are mounted on a board, external leads that serve as output terminals are placed upright, and a predetermined electronic circuit is formed, which is housed in a resin case and sealed with resin. A resin seal for electronic equipment, characterized in that an opening for resin injection is provided approximately at the center of a lid body that covers an open end of the case, and a protrusion having a constant height is formed around the periphery of the opening. Stop type electronic equipment.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12138881U JPS5827972U (en) | 1981-08-18 | 1981-08-18 | Resin-encapsulated electronic equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12138881U JPS5827972U (en) | 1981-08-18 | 1981-08-18 | Resin-encapsulated electronic equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5827972U true JPS5827972U (en) | 1983-02-23 |
Family
ID=29915324
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12138881U Pending JPS5827972U (en) | 1981-08-18 | 1981-08-18 | Resin-encapsulated electronic equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5827972U (en) |
-
1981
- 1981-08-18 JP JP12138881U patent/JPS5827972U/en active Pending
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