JPS5827971U - Resin-encapsulated electronic equipment - Google Patents

Resin-encapsulated electronic equipment

Info

Publication number
JPS5827971U
JPS5827971U JP12138781U JP12138781U JPS5827971U JP S5827971 U JPS5827971 U JP S5827971U JP 12138781 U JP12138781 U JP 12138781U JP 12138781 U JP12138781 U JP 12138781U JP S5827971 U JPS5827971 U JP S5827971U
Authority
JP
Japan
Prior art keywords
resin
electronic equipment
encapsulated electronic
sealed
case
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12138781U
Other languages
Japanese (ja)
Other versions
JPS6133660Y2 (en
Inventor
鈴木　整司
Original Assignee
日本インタ−ナショナル整流器株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本インタ−ナショナル整流器株式会社 filed Critical 日本インタ−ナショナル整流器株式会社
Priority to JP12138781U priority Critical patent/JPS5827971U/en
Publication of JPS5827971U publication Critical patent/JPS5827971U/en
Application granted granted Critical
Publication of JPS6133660Y2 publication Critical patent/JPS6133660Y2/ja
Granted legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は、従来の一般的な樹脂封止型電子機器の縦断面
図、第２図は、第１図の平面図、第３図は、従来の蓋体
を示し、同図Ａはその正面図、同図Ｂは、その平面図、
第４図は、本考案に係る蓋体の平面図、第５図は、上記
蓋体に設けた切欠部の部分拡大図、第６図は、本考案の
樹脂封止型電子機器の縦断面図である。 １１・・・・・・プリント基板、１２・・・・・・半導
体素子、１５．１６・・・外部導出リード、１７・・・
樹脂ケース、１８・・・樹脂、１９・・・蓋体、２０・
・・切欠部、２１・・・凹部、２２・・・開口部、２，
３・・・開口、２４・・・リブ。Fig. 1 is a vertical cross-sectional view of a conventional general resin-sealed electronic device, Fig. 2 is a plan view of Fig. 1, Fig. 3 shows a conventional lid body, and Fig. A shows its lid. The front view, Figure B is the plan view,
FIG. 4 is a plan view of the lid according to the present invention, FIG. 5 is a partially enlarged view of a notch provided in the lid, and FIG. 6 is a longitudinal cross-section of the resin-sealed electronic device of the present invention. It is a diagram. 11... Printed circuit board, 12... Semiconductor element, 15.16... External lead, 17...
Resin case, 18... Resin, 19... Lid body, 20.
... Notch, 21... Recess, 22... Opening, 2,
3...opening, 24...rib.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板上に電子部品を塔載し、人、出力端子となる外部導
出リードを立設して所定の電子回路を形成したものを樹
脂ケース内に収納し、樹脂ケース内に収納し、樹脂封止
してなる樹脂封止型電子機器において、前記ケースの開
口端に被せる蓋体の隅角部に前記導出リードを嵌め込む
切欠部を設けたことを特徴とする樹脂封止型電子機器。Electronic components are mounted on a board, external leads that serve as output terminals are placed upright, and a predetermined electronic circuit is formed.The circuit is then housed in a resin case, and then sealed with resin. 1. A resin-sealed electronic device characterized in that a notch into which the lead-out lead is inserted is provided in a corner of a lid that covers the open end of the case.
JP12138781U 1981-08-18 1981-08-18 Resin-encapsulated electronic equipment Granted JPS5827971U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12138781U JPS5827971U (en) 1981-08-18 1981-08-18 Resin-encapsulated electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12138781U JPS5827971U (en) 1981-08-18 1981-08-18 Resin-encapsulated electronic equipment

Publications (2)

Publication Number Publication Date
JPS5827971U true JPS5827971U (en) 1983-02-23
JPS6133660Y2 JPS6133660Y2 (en) 1986-10-01

Family

ID=29915323

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12138781U Granted JPS5827971U (en) 1981-08-18 1981-08-18 Resin-encapsulated electronic equipment

Country Status (1)

Country Link
JP (1) JPS5827971U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010062511A (en) * 2008-08-07 2010-03-18 Calsonic Kansei Corp Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010062511A (en) * 2008-08-07 2010-03-18 Calsonic Kansei Corp Semiconductor device

Also Published As

Publication number Publication date
JPS6133660Y2 (en) 1986-10-01

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