JPS59155742U

JPS59155742U - Hybrid IC

Info

Publication number: JPS59155742U
Application number: JP4879383U
Authority: JP
Inventors: 成田　万紀
Original assignee: 日本電気ホームエレクトロニクス株式会社
Priority date: 1983-03-31
Filing date: 1983-03-31
Publication date: 1984-10-19

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of the drawing]

第１図は従来のケース封入型ハイブリッドＩＣの斜視図
である。第２図乃至第５図は第１図に示すハイブリッド
ＩＣの封入工程を示す図で、第２図はハイブリッドＩＣ
本体の側面図、第３図はハイブリッドＩＣ本体をケース
に収納した状態を示す断面図、第４図はポツティング樹
脂の注入工程を示す断面図、第５図はポツティング樹脂
により封入された状態を示す断面図である。第６図は従
来のハイブリッドＩＣの欠点を説明する断面図である。第７図乃至第１１図は本考案の実施例を示す図で、第７
図はハイブリッドＩＣ本体をケースに収納した状態を示
す断面図、第８図はケース開口部に被せる蓋体を示す斜
視図、第９図は第７図に示すようにハイブリッドＩＣ本
体を内蔵したケースに、第８図に示す蓋体を被せた状態
を示す断面図、第１０図は第９図に示すものを加熱して
、密封構造としたケース封入型ハイブリッドＩＣを示す
斜視図、第１１図は本考案の他の実施例に用いられる蓋
体の断面図である。３・・・ハイブリッドＩＣ本体、４・・・外部導出リー
ド、５・・・ケース、５ａ・・・ケース開口部、８・・
・透孔、９．９′・・・蓋体。第４図第５図　　　　　　　　第６図FIG. 1 is a perspective view of a conventional case-enclosed hybrid IC. Figures 2 to 5 are diagrams showing the encapsulation process of the hybrid IC shown in Figure 1;
A side view of the main body, Fig. 3 is a sectional view showing the hybrid IC main body housed in the case, Fig. 4 is a sectional view showing the potting resin injection process, and Fig. 5 shows the state sealed with the potting resin. FIG. FIG. 6 is a cross-sectional view illustrating the drawbacks of a conventional hybrid IC. 7 to 11 are diagrams showing embodiments of the present invention, and FIG.
The figure is a cross-sectional view showing the hybrid IC body housed in the case, Figure 8 is a perspective view showing the lid that covers the case opening, and Figure 9 is a case with the hybrid IC body built in as shown in Figure 7. FIG. 10 is a sectional view showing the case covered with the lid shown in FIG. 8, FIG. 10 is a perspective view showing the case-sealed hybrid IC shown in FIG. FIG. 2 is a sectional view of a lid used in another embodiment of the present invention. 3...Hybrid IC main body, 4...External lead-out lead, 5...Case, 5a...Case opening, 8...
・Through hole, 9.9′...Lid body. Figure 4 Figure 5 Figure 6

Claims

[Scope of utility model registration request]

With the external lead-out leads protruding from the case opening, the hybrid IC main body is housed in the case, a lid body having a through hole through which the external lead-out leads are inserted is fitted into the case opening, and the lid body is inserted into the case opening. A hybrid IC0 characterized in that the hybrid IC body is hermetically sealed by melting and sealing the external leads.