JPS5895061U - hybrid integrated circuit - Google Patents
hybrid integrated circuitInfo
- Publication number
- JPS5895061U JPS5895061U JP19142881U JP19142881U JPS5895061U JP S5895061 U JPS5895061 U JP S5895061U JP 19142881 U JP19142881 U JP 19142881U JP 19142881 U JP19142881 U JP 19142881U JP S5895061 U JPS5895061 U JP S5895061U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- wiring pattern
- metal frame
- external lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の混成集積回路で、イは外装前の正面図で
、口は完成断面図で、第２図は本考案の混成集積回路の
一実施例で、イは外装前の正面図、口は外装後の正面図
である。
４：半導体チップ、６：コンデンサ、８：外装樹脂、９
：抵抗、１０：外部引出端子、１１：配線パターン、１
２：金属フレーム。Figure 1 shows a conventional hybrid integrated circuit, A is a front view before packaging, and the opening is a completed sectional view. Figure 2 is an embodiment of the hybrid integrated circuit of the present invention, A is a front view before packaging. , the mouth is a front view after being packaged. 4: Semiconductor chip, 6: Capacitor, 8: Exterior resin, 9
:Resistance, 10: External lead terminal, 11: Wiring pattern, 1
2: Metal frame.
Claims (1)
レーム上に半導体、コンデンサ、抵抗などを所定の位置
に塔載し、これに液状樹脂もしくは粉体樹脂を付着、硬
化して一体に形成してなる混成集積回路。Semiconductors, capacitors, resistors, etc. are mounted in predetermined positions on a metal frame with a wiring pattern that communicates with external lead terminals, and liquid or powder resin is applied to this and hardened to form an integrated structure. Hybrid integrated circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19142881U JPS5895061U (en) | 1981-12-21 | 1981-12-21 | hybrid integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19142881U JPS5895061U (en) | 1981-12-21 | 1981-12-21 | hybrid integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5895061U true JPS5895061U (en) | 1983-06-28 |
Family
ID=30104889
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19142881U Pending JPS5895061U (en) | 1981-12-21 | 1981-12-21 | hybrid integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5895061U (en) |
-
1981
- 1981-12-21 JP JP19142881U patent/JPS5895061U/en active Pending
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