JPS62170641U - - Google Patents
Info
- Publication number
- JPS62170641U JPS62170641U JP5912386U JP5912386U JPS62170641U JP S62170641 U JPS62170641 U JP S62170641U JP 5912386 U JP5912386 U JP 5912386U JP 5912386 U JP5912386 U JP 5912386U JP S62170641 U JPS62170641 U JP S62170641U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- case
- hook portion
- sealed package
- sealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 2
- 238000005266 casting Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図：本考案のパワートランジスタモジユー
ルの１例である樹脂封止パツケージの断面図。第
２図：従来のパワートランジスタモジユールの１
例である樹脂封止パツケージの断面図。
１：ケース、２：放熱基板、３：内部回路基板
、４：内部回路部品、６：内部注型樹脂、７：最
終封止樹脂、１０：フツク。
FIG. 1: A cross-sectional view of a resin-sealed package that is an example of the power transistor module of the present invention. Figure 2: One of the conventional power transistor modules
FIG. 2 is a cross-sectional view of an example resin-sealed package. 1: Case, 2: Heat dissipation board, 3: Internal circuit board, 4: Internal circuit components, 6: Internal casting resin, 7: Final sealing resin, 10: Hook.
Claims (1)
体を覆うように樹脂を前記ケース内に充填してな
る樹脂封止パツケージにおいて、前記ケースの側
壁に、内方に突出しかつ下方に屈曲するフツク部
を一体的に設け、該フツク部を前記封止樹脂で埋
設してなることを特徴とする樹脂封止パツケージ
。 In a resin-sealed package in which a body to be sealed is disposed at the bottom of the case, and a resin is filled in the case so as to cover the body, a side wall of the case is provided with a body protruding inwardly and downwardly. 1. A resin-sealed package characterized in that a bent hook portion is integrally provided and the hook portion is embedded in the sealing resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986059123U JPH0432758Y2 (en) | 1986-04-18 | 1986-04-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986059123U JPH0432758Y2 (en) | 1986-04-18 | 1986-04-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62170641U true JPS62170641U (en) | 1987-10-29 |
| JPH0432758Y2 JPH0432758Y2 (en) | 1992-08-06 |
Family
ID=30890321
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986059123U Expired JPH0432758Y2 (en) | 1986-04-18 | 1986-04-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0432758Y2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5558052U (en) * | 1978-10-16 | 1980-04-19 | ||
| JPS6074655A (en) * | 1983-09-30 | 1985-04-26 | Fuji Electric Co Ltd | Semiconductor device |
-
1986
- 1986-04-18 JP JP1986059123U patent/JPH0432758Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5558052U (en) * | 1978-10-16 | 1980-04-19 | ||
| JPS6074655A (en) * | 1983-09-30 | 1985-04-26 | Fuji Electric Co Ltd | Semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0432758Y2 (en) | 1992-08-06 |
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