JPS6197849U - - Google Patents
Info
- Publication number
- JPS6197849U JPS6197849U JP18484384U JP18484384U JPS6197849U JP S6197849 U JPS6197849 U JP S6197849U JP 18484384 U JP18484384 U JP 18484384U JP 18484384 U JP18484384 U JP 18484384U JP S6197849 U JPS6197849 U JP S6197849U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- case
- sealed
- internal casting
- casting resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 2
- 238000005266 casting Methods 0.000 claims 2
- 239000004593 Epoxy Substances 0.000 claims 1
- 229920001296 polysiloxane Polymers 0.000 claims 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図：本考案のパワートランジスタモジユー
ルの１例である樹脂封止パツケージの平面図。第
２図：従来のパワートランジスタモジユールの１
例である樹脂封止パツケージの側面図。第３図：
第２図における樹脂封止パツケージの平面図。
符号、１：底部、２，２′：ケース、３：デバ
イス出力端子、４：開口部、５：封止樹脂、６：
凹凸部。
FIG. 1: A plan view of a resin-sealed package that is an example of the power transistor module of the present invention. Figure 2: One of the conventional power transistor modules
FIG. 2 is a side view of an example resin-sealed package. Figure 3:
FIG. 3 is a plan view of the resin-sealed package in FIG. 2; Symbol, 1: Bottom, 2, 2': Case, 3: Device output terminal, 4: Opening, 5: Sealing resin, 6:
Uneven parts.
Claims (1)
体を覆うようにシリコン等の内部注型樹脂を注入
固化し、更にエポキシ等の封止樹脂にて、上記内
部注型樹脂を被覆した樹脂封止パツケージにおい
て、 前記ケースの内側壁周囲に縦方向の凹凸を複数
個形成し、該けたことを特徴とする樹脂封止パツ
ケージ。[Scope of Claim for Utility Model Registration] A body to be sealed is placed at the bottom of the case, an internal casting resin such as silicone is injected and solidified so as to cover the body, and then a sealing resin such as epoxy is applied. , a resin-sealed package coated with the above-mentioned internal casting resin, characterized in that a plurality of vertical unevennesses are formed around the inner wall of the case and are aligned.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18484384U JPS6197849U (en) | 1984-12-04 | 1984-12-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18484384U JPS6197849U (en) | 1984-12-04 | 1984-12-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6197849U true JPS6197849U (en) | 1986-06-23 |
Family
ID=30742327
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18484384U Pending JPS6197849U (en) | 1984-12-04 | 1984-12-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6197849U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015162649A (en) * | 2014-02-28 | 2015-09-07 | 三菱電機株式会社 | semiconductor device |
-
1984
- 1984-12-04 JP JP18484384U patent/JPS6197849U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015162649A (en) * | 2014-02-28 | 2015-09-07 | 三菱電機株式会社 | semiconductor device |
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