JPS62180954U - - Google Patents
Info
- Publication number
- JPS62180954U JPS62180954U JP6933086U JP6933086U JPS62180954U JP S62180954 U JPS62180954 U JP S62180954U JP 6933086 U JP6933086 U JP 6933086U JP 6933086 U JP6933086 U JP 6933086U JP S62180954 U JPS62180954 U JP S62180954U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- internal
- injected
- step portion
- molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 10
- 238000005266 casting Methods 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案に係る電力半導体装置の一実施
例の側面断面図、第２図は従来の電力半導体装置
の側面断面図である。
１：内部回路部品、２：電力回路基板、３：外
枠（モールド用樹脂枠）、４：内部注型樹極、５
：封止樹脂、９：段部、１０：スリツト。
FIG. 1 is a side sectional view of an embodiment of a power semiconductor device according to the present invention, and FIG. 2 is a side sectional view of a conventional power semiconductor device. 1: Internal circuit components, 2: Power circuit board, 3: Outer frame (resin frame for molding), 4: Internal casting pole, 5
: Sealing resin, 9: Step part, 10: Slit.
Claims (1)
力回路基板上面の外周縁に配置されるモールド用
樹脂枠と、該モールド用樹脂枠内に注入される樹
脂よりなる電力半導体装置において、 前記モールド用樹脂枠の内側周面の下部に、内
方に突出されかつ一部にスリツトを形成した段部
を設け、前記内部回路部品を覆つて前記段部以下
の高さに内部注型樹脂を注入し、該内部注型樹脂
上に前記段部のスリツト内に充填しつつ封止樹脂
を注入固化してなることを特徴とする電力半導体
装置。[Claim for Utility Model Registration] Consisting of a power circuit board on which internal circuit components are mounted, a molding resin frame placed on the outer periphery of the upper surface of the power circuit board, and a resin injected into the molding resin frame. In the power semiconductor device, a step portion protruding inward and partially formed with a slit is provided at the lower part of the inner peripheral surface of the resin frame for molding, and a step portion having a height equal to or less than the step portion is provided to cover the internal circuit component. A power semiconductor device characterized in that an internal casting resin is injected into the internal casting resin, and a sealing resin is injected and solidified while filling the slit of the stepped portion onto the internal casting resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6933086U JPS62180954U (en) | 1986-05-07 | 1986-05-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6933086U JPS62180954U (en) | 1986-05-07 | 1986-05-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62180954U true JPS62180954U (en) | 1987-11-17 |
Family
ID=30909966
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6933086U Pending JPS62180954U (en) | 1986-05-07 | 1986-05-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62180954U (en) |
-
1986
- 1986-05-07 JP JP6933086U patent/JPS62180954U/ja active Pending