JPS61203560U - - Google Patents
Info
- Publication number
- JPS61203560U JPS61203560U JP8707085U JP8707085U JPS61203560U JP S61203560 U JPS61203560 U JP S61203560U JP 8707085 U JP8707085 U JP 8707085U JP 8707085 U JP8707085 U JP 8707085U JP S61203560 U JPS61203560 U JP S61203560U
- Authority
- JP
- Japan
- Prior art keywords
- radiator
- internal
- resin wall
- resin
- storage area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 14
- 229920005989 resin Polymers 0.000 claims description 14
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000005266 casting Methods 0.000 claims 3
- 238000000465 moulding Methods 0.000 claims 3
- 230000002093 peripheral effect Effects 0.000 claims 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図はこの考案に係る半導体用パツケージの
一実施例を示す断面図、第２図は従来例の第１図
相当図である。
９……半導体用パツケージ、１０……放熱器、
１１……内枠（内部モールド樹脂壁）、１２……
外枠（外部モールド樹脂壁）、１３……回路基板
、１４……内部注型樹脂収納部、１７……最終注
型樹脂収納部、１８……凹部。
FIG. 1 is a sectional view showing an embodiment of a semiconductor package according to this invention, and FIG. 2 is a view corresponding to FIG. 1 of a conventional example. 9...Semiconductor package, 10...Radiator,
11... Inner frame (internal molded resin wall), 12...
Outer frame (external molded resin wall), 13... circuit board, 14... internal cast resin storage section, 17... final cast resin storage section, 18... recessed portion.
Claims (1)
貼着された回路基板の周辺に立設され放熱器上面
中央部に凹状の内部注型樹脂収納部を形成する内
部モールド用樹脂壁と、放熱器上面の外周縁に前
記樹脂壁より高く立設され内部モールド用樹脂壁
との間及び内部注型樹脂収納部の上方に最終注型
樹脂収納部を形成する外部モールド用樹脂壁とか
らなり、この外部モールド用樹脂壁と内部モール
ド用樹脂壁との間の放熱器上面に、断面形状が上
狭下広の魚尾形に形成された最終注型樹脂係止用
の凹部を設けたことを特徴とする半導体用パツケ
ージ。 A plate-shaped radiator and an internal molding resin wall that is erected around the circuit board attached to the approximate center of the top surface of the radiator and forms a concave internal molded resin storage area in the center of the top surface of the radiator. and an external molding resin wall that is erected higher than the resin wall on the outer peripheral edge of the upper surface of the radiator and forms a final casting resin storage area between the internal molding resin wall and above the internal casting resin storage area. On the upper surface of the radiator between the resin wall for the external mold and the resin wall for the internal mold, a recessed part for locking the final casting resin, which has a fishtail cross-sectional shape with a narrow top and a wide bottom, is provided. A semiconductor package characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8707085U JPS61203560U (en) | 1985-06-10 | 1985-06-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8707085U JPS61203560U (en) | 1985-06-10 | 1985-06-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61203560U true JPS61203560U (en) | 1986-12-22 |
Family
ID=30638951
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8707085U Pending JPS61203560U (en) | 1985-06-10 | 1985-06-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61203560U (en) |
-
1985
- 1985-06-10 JP JP8707085U patent/JPS61203560U/ja active Pending