JPS6413730U - - Google Patents
Info
- Publication number
- JPS6413730U JPS6413730U JP10922787U JP10922787U JPS6413730U JP S6413730 U JPS6413730 U JP S6413730U JP 10922787 U JP10922787 U JP 10922787U JP 10922787 U JP10922787 U JP 10922787U JP S6413730 U JPS6413730 U JP S6413730U
- Authority
- JP
- Japan
- Prior art keywords
- container
- resin
- semiconductor chip
- sealed
- powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 229910010272 inorganic material Inorganic materials 0.000 claims 1
- 239000011147 inorganic material Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の一実施例を示す断面図、第２
図は従来例を示す断面図である。
１……半導体チツプ、２……下部電極端子、３
……上部電極端子、４……容器底板、５……絶縁
基板、６……容器、７……樹脂、８……微粉末。
Fig. 1 is a sectional view showing one embodiment of the present invention;
The figure is a sectional view showing a conventional example. 1... Semiconductor chip, 2... Lower electrode terminal, 3
... Upper electrode terminal, 4 ... Bottom plate of container, 5 ... Insulating substrate, 6 ... Container, 7 ... Resin, 8 ... Fine powder.
Claims (1)
体チツプに接続された電極端子が容器上部へ引き
出され、容器内に注入された樹脂で封止されるも
のにおいて、前記半導体チツプ近傍に半導体チツ
プと同程度の熱膨張係数を有する無機材料の微粉
末を充填し、その上に樹脂を注入し含浸・硬化さ
せて封止したことを特徴とする樹脂封止型半導体
装置。 A semiconductor chip is supported on the bottom plate of the container, electrode terminals connected to the semiconductor chip are pulled out to the top of the container, and the container is sealed with a resin injected into the container. 1. A resin-sealed semiconductor device, characterized in that it is filled with fine powder of an inorganic material having a coefficient of thermal expansion of about 100 to 100%, and then a resin is injected onto the powder, impregnated and cured to seal it.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10922787U JPS6413730U (en) | 1987-07-16 | 1987-07-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10922787U JPS6413730U (en) | 1987-07-16 | 1987-07-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6413730U true JPS6413730U (en) | 1989-01-24 |
Family
ID=31345276
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10922787U Pending JPS6413730U (en) | 1987-07-16 | 1987-07-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6413730U (en) |
-
1987
- 1987-07-16 JP JP10922787U patent/JPS6413730U/ja active Pending
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