JPH01169036U - - Google Patents
Info
- Publication number
- JPH01169036U JPH01169036U JP6497588U JP6497588U JPH01169036U JP H01169036 U JPH01169036 U JP H01169036U JP 6497588 U JP6497588 U JP 6497588U JP 6497588 U JP6497588 U JP 6497588U JP H01169036 U JPH01169036 U JP H01169036U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- frame
- gel agent
- substrate
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 3
- 238000005192 partition Methods 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 claims 2
- 239000004020 conductor Substances 0.000 claims 1
- 239000011810 insulating material Substances 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は、この考案による半導体装置の一実施
例の要部断面図、第２図は従来例の要部断面図で
ある。
１……基板、３……半導体素子、５……枠体、
６……ゲル剤、７……樹脂、８……蓋体、５１…
…仕切り板。
FIG. 1 is a sectional view of a main part of an embodiment of a semiconductor device according to this invention, and FIG. 2 is a sectional view of a main part of a conventional example. 1...Substrate, 3...Semiconductor element, 5...Frame,
6... Gel, 7... Resin, 8... Lid, 51...
...Partition board.
Claims (1)
る枠体および蓋体とにより構成される容器内の前
記基板上に半導体素子を固着し、この半導体素子
を埋没するようにゲル剤を充填し、さらに、その
上に樹脂を注入して封止してなる半導体装置にお
いて、前記枠体に前記ゲル剤を分割する仕切り板
を設けたことを特徴とする半導体装置。 A semiconductor element is fixed onto the substrate in a container consisting of a substrate made of a thermally conductive material and a frame and a lid made of an insulating material, and a gel agent is filled so as to bury the semiconductor element. . A semiconductor device further characterized in that the frame is provided with a partition plate for dividing the gel agent in the semiconductor device formed by injecting a resin thereon and sealing the semiconductor device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6497588U JPH01169036U (en) | 1988-05-17 | 1988-05-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6497588U JPH01169036U (en) | 1988-05-17 | 1988-05-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01169036U true JPH01169036U (en) | 1989-11-29 |
Family
ID=31290423
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6497588U Pending JPH01169036U (en) | 1988-05-17 | 1988-05-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01169036U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008010261A1 (en) * | 2006-07-18 | 2008-01-24 | Panasonic Corporation | Substrate structure, and mobile terminal |
-
1988
- 1988-05-17 JP JP6497588U patent/JPH01169036U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008010261A1 (en) * | 2006-07-18 | 2008-01-24 | Panasonic Corporation | Substrate structure, and mobile terminal |
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