JPH0262739U - - Google Patents
Info
- Publication number
- JPH0262739U JPH0262739U JP14217088U JP14217088U JPH0262739U JP H0262739 U JPH0262739 U JP H0262739U JP 14217088 U JP14217088 U JP 14217088U JP 14217088 U JP14217088 U JP 14217088U JP H0262739 U JPH0262739 U JP H0262739U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- fixed
- region
- sealed
- mesa
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 238000007789 sealing Methods 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 239000011810 insulating material Substances 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図はこの考案による半導体装置の一実施例
を示す概念的断面図、第２図は従来の半導体装置
の一例を示す概念的断面図、第３図はこの考案に
係わる中壁が設けられた側壁の一例を示すもので
、第３図ａは側面図、第３図ｂは平面図、第４図
は、この考案に係わる半導体装置の一例の等価回
路図である。
１…銅板、２…側壁、３…パワートランジスタ
チツプ、４…ダイオードチツプ、５…ゲル、６…
エポキシ樹脂、７…中壁。
FIG. 1 is a conceptual sectional view showing an example of a semiconductor device according to this invention, FIG. 2 is a conceptual sectional view showing an example of a conventional semiconductor device, and FIG. 3 is a conceptual sectional view showing an example of a conventional semiconductor device. 3A is a side view, FIG. 3B is a plan view, and FIG. 4 is an equivalent circuit diagram of an example of a semiconductor device according to this invention. DESCRIPTION OF SYMBOLS 1...Copper plate, 2...Side wall, 3...Power transistor chip, 4...Diode chip, 5...Gel, 6...
Epoxy resin, 7... Middle wall.
Claims (1)
る容器内の前記金属基板上にプレーナ形半導体チ
ツプとメサ形半導体チツプとが固着され樹脂封止
されてなる半導体装置において、容器内のプレー
ナ形半導体チツプが固着された領域とメサ形半導
体チツプが固着された領域とが中壁により仕切ら
れており、プレーナ形半導体チツプが固着された
領域はプレーナ形半導体チツプを覆うゲルの上か
ら封止樹脂で封止されており、メサ形半導体チツ
プが固着された領域は封止樹脂単独で封止されて
いることを特徴とする半導体素子。 In a semiconductor device in which a planar semiconductor chip and a mesa semiconductor chip are fixed and resin-sealed on the metal substrate in a container constituted by a metal substrate and a side wall made of an insulating material, the planar semiconductor chip in the container is The region to which the chip is fixed and the region to which the mesa semiconductor chip is fixed are separated by an inner wall, and the region to which the planar semiconductor chip is fixed is covered with a sealing resin from above the gel covering the planar semiconductor chip. What is claimed is: 1. A semiconductor element characterized in that it is sealed, and a region to which a mesa-shaped semiconductor chip is fixed is sealed with a sealing resin alone.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14217088U JPH0617318Y2 (en) | 1988-10-31 | 1988-10-31 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14217088U JPH0617318Y2 (en) | 1988-10-31 | 1988-10-31 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0262739U true JPH0262739U (en) | 1990-05-10 |
| JPH0617318Y2 JPH0617318Y2 (en) | 1994-05-02 |
Family
ID=31407892
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14217088U Expired - Lifetime JPH0617318Y2 (en) | 1988-10-31 | 1988-10-31 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0617318Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001345417A (en) * | 2000-06-01 | 2001-12-14 | Aisin Aw Co Ltd | Electronic component unit |
-
1988
- 1988-10-31 JP JP14217088U patent/JPH0617318Y2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001345417A (en) * | 2000-06-01 | 2001-12-14 | Aisin Aw Co Ltd | Electronic component unit |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0617318Y2 (en) | 1994-05-02 |