JPH04131294A - Ic card - Google Patents
Ic cardInfo
- Publication number
- JPH04131294A JPH04131294A JP2258449A JP25844990A JPH04131294A JP H04131294 A JPH04131294 A JP H04131294A JP 2258449 A JP2258449 A JP 2258449A JP 25844990 A JP25844990 A JP 25844990A JP H04131294 A JPH04131294 A JP H04131294A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- panel
- adhesive sheet
- parts
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims abstract description 40
- 230000001070 adhesive effect Effects 0.000 claims abstract description 40
- 230000002093 peripheral effect Effects 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、半導体装置を内蔵するフレームにパネルが
接着用シートを介して接着されたＩＣカードに係り、特
に接着用シートの形状に関するものである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to an IC card in which a panel is adhered to a frame containing a semiconductor device via an adhesive sheet, and particularly relates to the shape of the adhesive sheet. be.
第３図はＩＣカードの構造を示す断面図、第４図は従来
の接着シートのパネルへの貼付は状態を示す平面図、第
５図は第４図の状態のものをフレームに貼付けた時の接
着シートの状態を示している０図において、■はパネル
、２はこのパネル１の裏面に貼着された接着シート、３
はフレーム、４は基板、５はこの基板に実装された電子
部品、６はフレーム３とパネル１の接着時に接着シート
２より流れ出した接着剤を示している。Figure 3 is a cross-sectional view showing the structure of an IC card, Figure 4 is a plan view showing how the conventional adhesive sheet is attached to the panel, and Figure 5 is the state shown in Figure 4 when it is attached to the frame. In Figure 0, which shows the state of the adhesive sheet, ■ is the panel, 2 is the adhesive sheet attached to the back of panel 1, and 3 is the adhesive sheet attached to the back of panel 1.
4 is a frame, 4 is a substrate, 5 is an electronic component mounted on this substrate, and 6 is an adhesive that flows out from the adhesive sheet 2 when the frame 3 and the panel 1 are bonded together.
従来、接着シート２はパネル１に貼り付けられ、その後
、電子部品５を搭載した基板４を組み込んだフレーム３
に圧力を加えて接着させるが、この時、接着シート２の
端より接着剤が流れ出しその流れ分６によってパネル端
部まで接着される。Conventionally, an adhesive sheet 2 is pasted on a panel 1, and then a frame 3 incorporating a board 4 on which electronic components 5 are mounted is attached.
At this time, the adhesive flows out from the edge of the adhesive sheet 2, and the flow 6 bonds the panel to the edge.
しかしこの従来のＩＣカードでは、パネルの角まで接着
剤が流れず、また、接着剤の流れ分の管理が困難であり
、外部に接着剤がはみ出すという問題点があった。However, with this conventional IC card, the adhesive does not flow to the corners of the panel, and it is difficult to control the amount of adhesive flowing, causing the adhesive to protrude to the outside.
この発明は上記のような問題点を解消するためになされ
たもので、パネルとフレームが端まで均等に接着される
とともに、接着剤の外部へのはみ出しのないＩＣカード
を得ることを目的とする。This invention was made to solve the above-mentioned problems, and aims to obtain an IC card in which the panel and frame are evenly bonded to the edges, and the adhesive does not protrude to the outside. .
この発明に係るＩＣカードは、電子部品を搭載した電気
回路基板を内蔵したフレームを覆うパネルの固定に接着
シートを用いたＩＣカードにおいて、上記接着シートの
周辺形状を多数の凹凸に形成したものである。The IC card according to the present invention is an IC card that uses an adhesive sheet to fix a panel that covers a frame containing an electric circuit board on which electronic components are mounted, and in which the peripheral shape of the adhesive sheet is formed into many irregularities. be.
この発明における接着シートの周辺の凹凸は、凸部より
の流れ出し分を凹部に流すことにより流れ分を管理する
。In the present invention, the unevenness around the adhesive sheet is controlled by flowing the flow from the convex portions into the recesses.
以下、この発明の一実施例を図について説明する。第１
図、第２図において、１，２は従来例と同一部品を示し
ており、７は接着シートの周辺に形成された多数の凹凸
部である。An embodiment of the present invention will be described below with reference to the drawings. 1st
In the drawings and FIG. 2, numerals 1 and 2 indicate the same parts as in the conventional example, and numeral 7 indicates a large number of uneven portions formed around the adhesive sheet.
以上のように接着シート周辺に凹凸部７を設けることに
よって、凸部の接着剤が凹部に流れ、流れ分６の管理が
容易になる。By providing the uneven portions 7 around the adhesive sheet as described above, the adhesive in the convex portions flows into the concave portions, and the flow portion 6 can be easily managed.
以上のようにこの発明によれば、接着シート周辺を凹凸
の形状とすることで、接着剤の流れ分の管理が容易にな
り、余分な接着剤のはみ出しを防げ、また流れ分が安定
するため接着強度が安定する効果がある。As described above, according to the present invention, by forming the periphery of the adhesive sheet into an uneven shape, the flow of adhesive can be easily managed, excess adhesive can be prevented from spilling out, and the flow can be stabilized. This has the effect of stabilizing the adhesive strength.
第１図はこの発明の一実施例による、パネルに接着シー
トを貼り付けた状態を示す図、第２図はそのパネルをフ
レームに貼り付けた状態のはみ出し状態を示す図、第３
図はＩＣカードの構造を示す断面図、第４図は従来例に
よる、パネルに接着シートを貼り付けた状態を示す図、
第５図はそのパネルをフレームに貼り付けた状態の接着
剤のはみ出し状態を示す図である。
図中、１はパネル、２は接着シート、３はフレーム、４
は基板、５は電子部品、６は接着剤の流れ分、７は周辺
凹凸部である。
なお、図中同一符号は同−又は相当部分を示す。FIG. 1 is a diagram showing a state in which an adhesive sheet is pasted on a panel according to an embodiment of the present invention, FIG.
The figure is a cross-sectional view showing the structure of an IC card, and Figure 4 is a view showing a state in which an adhesive sheet is pasted on a panel according to a conventional example.
FIG. 5 is a diagram showing how the adhesive protrudes when the panel is attached to the frame. In the figure, 1 is a panel, 2 is an adhesive sheet, 3 is a frame, 4
5 is a substrate, 5 is an electronic component, 6 is a flow of adhesive, and 7 is a peripheral uneven portion. Note that the same reference numerals in the figures indicate the same or equivalent parts.
Claims (1)
板を覆うパネルがこのフレームの表面に接着用シートを
介して接着されるＩＣカードにおいて、上記接着用シー
トの周辺部に多数の凹凸を形成したことを特徴とするＩ
Ｃカード。In an IC card in which a board carrying electronic components is built into a frame and a panel covering the board is adhered to the surface of the frame via an adhesive sheet, a large number of irregularities are formed on the periphery of the adhesive sheet. I characterized by
C card.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2258449A JPH04131294A (en) | 1990-09-25 | 1990-09-25 | Ic card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2258449A JPH04131294A (en) | 1990-09-25 | 1990-09-25 | Ic card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04131294A true JPH04131294A (en) | 1992-05-01 |
Family
ID=17320367
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2258449A Pending JPH04131294A (en) | 1990-09-25 | 1990-09-25 | Ic card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04131294A (en) |
-
1990
- 1990-09-25 JP JP2258449A patent/JPH04131294A/en active Pending
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