JPS62160290A - Soldering mask - Google Patents
Soldering maskInfo
- Publication number
- JPS62160290A JPS62160290A JP247486A JP247486A JPS62160290A JP S62160290 A JPS62160290 A JP S62160290A JP 247486 A JP247486 A JP 247486A JP 247486 A JP247486 A JP 247486A JP S62160290 A JPS62160290 A JP S62160290A
- Authority
- JP
- Japan
- Prior art keywords
- mesh
- screen
- screen mesh
- parts
- insulating substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
- B41C1/00—Forme preparation
- B41C1/14—Forme preparation for stencil-printing or silk-screen printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Printing Plates And Materials Therefor (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、半田ペーストによる印刷に使用して好適な半
田マスクに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a solder mask suitable for use in printing with solder paste.
従来、この種の半田マスクは第５図、第６図および第７
図に示すように構成されている。これを同図に基づいて
概略説明すると、同図において、ｌはマスクフレーム２
に固定されたマスク本体、３は例えば繊維、金属細線等
からなるスクリーンメツシュ、４はこのスクリーンメッ
シュ３にマスク開口部５を除き貼り合わされた乳剤等の
合成樹脂である。なお、６はセラミック等の絶縁基板、
７はこの絶縁基板６上に固定されペアチップ（図示せず
）等を封止する封止部品である。Conventionally, this type of solder mask is shown in FIGS. 5, 6, and 7.
It is configured as shown in the figure. This will be briefly explained based on the figure. In the figure, l is the mask frame 2
3 is a screen mesh made of fibers, thin metal wires, etc.; 4 is a synthetic resin such as emulsion bonded to the screen mesh 3 except for the mask opening 5; In addition, 6 is an insulating substrate such as ceramic,
A sealing component 7 is fixed on the insulating substrate 6 and seals a pair of chips (not shown) and the like.
このように構成された半田マスクにおいては、印刷機（
図示せず）のスキージによって絶縁基板上６にスクリー
ンメツシュ３を押し付けることにより半田印刷が行われ
る。In the solder mask configured in this way, the printing machine (
Solder printing is performed by pressing the screen mesh 3 onto the insulating substrate 6 using a squeegee (not shown).
ところで、この種の半田マスクにおいては、マスク本体
１が絶縁基板６の所定部分に密着するに十分な柔軟性を
有しておらず、このため、第７図に示すように半田印刷
時すなわちスクリーンメツシュ３の押付時に封止部品７
付近の絶縁基板６とマスク本体１との間に間隙が形成さ
れてしまい、第８図に示すように絶縁基板６上の所定部
分に半田ペースト８が付着しない部分Ｐが生じるという
問題があった。By the way, in this type of solder mask, the mask body 1 does not have sufficient flexibility to tightly adhere to a predetermined portion of the insulating substrate 6, and therefore, as shown in FIG. Sealing part 7 when pressing mesh 3
A gap is formed between the insulating substrate 6 and the mask body 1 in the vicinity, resulting in a problem that, as shown in FIG. 8, there is a portion P where the solder paste 8 does not adhere to a predetermined portion on the insulating substrate 6. .
本発明はこのような事情に鑑みなされたもので、絶縁基
板上の半田印刷を確実に行うことができる半田マスクを
提供するものである。The present invention was made in view of the above circumstances, and it is an object of the present invention to provide a solder mask that can reliably perform solder printing on an insulating substrate.
本発明に係る半田マスクは、スクリーンメツシュを各々
が互いに異なる大小２つのメツシュサイズをもつスクリ
ーンメツシュで構成し、このうち小さいメツシュサイズ
をもつスクリーンメツシュはメツシュの押付状態におい
て封止部品を直接覆う位置に位置付けられているもので
ある。The solder mask according to the present invention includes screen meshes each having two different mesh sizes, the screen mesh having the smaller mesh size directly covering the sealing component when the mesh is pressed. It is located in a certain position.
本発明においては、小さいメソシュサイズをもつスクリ
ーンメッシュはメツシュの押付状態において封止部品を
直接覆う位置に位置付けられているから、マスク本体が
絶縁基板の所定部分に密着するに十分な柔軟性を有する
こととなり、封止部品付近の絶縁基板とマスク本体との
間に間隙がほとんど形成されない。In the present invention, since the screen mesh having a small mesh size is positioned in a position that directly covers the sealing component when the mesh is pressed, the mask body has sufficient flexibility to tightly adhere to a predetermined portion of the insulating substrate. Therefore, almost no gap is formed between the insulating substrate near the sealing component and the mask body.
第１図は第２図のＩ−Ｉ断面図、第２図は本発明に係る
半田マスクを示す平面図で、同図以下において第５図〜
第８図と同一の部材については同一の符号を付し、詳細
な説明は省略する。同図において、符号１１および１２
で示すものは各々が互いに異なる大小２つのメツシュサ
イズをもつスクリーンメツシュで、このうち小さいメツ
シュサイズをもつスクリーンメツシュ１２はメツシュの
押付状態において前記封止部品７を直接覆う位置に位置
付けられている。そして、前記マスク本体１はスクリー
ンメッシュ１２付近の合成樹脂４が取り除かれており、
これによりこの部分は他の部分より大きい柔軟性を有し
ている。なお、前記両スクリーンメツシュ１１．１２は
各々が互いに貼り合わせてなり、これら貼合部分は２１
１１程度とする。1 is a sectional view taken along the line II in FIG. 2, and FIG. 2 is a plan view showing a solder mask according to the present invention.
The same members as in FIG. 8 are designated by the same reference numerals, and detailed explanations will be omitted. In the same figure, reference numerals 11 and 12
What is shown by is a screen mesh having two different mesh sizes, each of which has a smaller mesh size, and the screen mesh 12 having the smaller mesh size is positioned at a position that directly covers the sealing component 7 when the mesh is pressed. The mask body 1 has the synthetic resin 4 removed near the screen mesh 12,
This gives this part greater flexibility than other parts. In addition, both the screen meshes 11 and 12 are pasted together, and these pasted portions are 21 and 12.
It should be about 11.
このように構成された半田マスクにおいては、小さいメ
ツシュサイズをもつスクリーンメツシュ１２がメツシュ
の押付状態において封止部品７を直接覆う位置に位置付
けられているから、第３図に示すようにマスク本体１が
絶縁基板６の所定部分に密着するに十分な柔軟性を有す
ることとなり、マスク本体１と絶縁基板６との間に間隙
がほとんど形成されることがなく、第４図に示すように
絶縁基板６上の所定部分に半田ペースト８を付着させる
ことができる。In the solder mask configured in this way, the screen mesh 12 having a small mesh size is positioned at a position that directly covers the sealing component 7 in the pressed state of the mesh, so that the mask body 1 as shown in FIG. has sufficient flexibility to tightly adhere to a predetermined portion of the insulating substrate 6, so that almost no gap is formed between the mask body 1 and the insulating substrate 6, and as shown in FIG. Solder paste 8 can be attached to a predetermined portion on 6.
以上説明したように本発明によれば、スクリーンメツシ
ュを各々が互いに異なる大小２つのメツシュサイズをも
つスクリーンメツシュで構成し、このうち小さいメソシ
ュサイズをもつスクリーンメツシュはメツシュの押付状
態において封止部品を直接覆う位置に位置付けられてい
るので、マスク本体が絶縁基板上の所定部分に密着する
に十分な柔軟性を有することとなり、マスク本体と絶縁
基板との間に間隙がほとんど形成されず、絶縁基板上の
半田印刷を確実に行うことができる。また、スクリーン
メツシュの柔軟性によって封止部品へのストレスを緩和
できるといった利点もある。As explained above, according to the present invention, the screen mesh is composed of screen meshes each having two different mesh sizes, large and small, and the screen mesh with the smaller mesh size is used as a sealing member when the mesh is pressed. Since the mask body is positioned in a position that directly covers the insulating substrate, the mask body has sufficient flexibility to adhere tightly to a predetermined part of the insulating substrate, and there is almost no gap between the mask body and the insulating substrate, and the insulation Solder printing on the board can be performed reliably. Another advantage is that the flexibility of the screen mesh can alleviate stress on the sealing components.
第１図は第２図の１−１断面図、第２図は本発明に係る
半田マスクを示す平面図、第３図はスクリーンメツシュ
の絶縁基板への押付状態を示す断面図、第４図は半田マ
スク使用による絶縁基板の印刷状態を示す平面図、第５
図は従来の半田マスクを示す平面図、第６図は第５図の
ＶＩ−Ｖｌ断面図、第７図はスクリーンメツシュの絶縁
基板への押付状態を示す断面図、第８図は従来の半田マ
スク使用による絶縁基板の印刷状態を示す平面図である
。
１・・・・マスク本体、４・・・・合成樹脂、６・・・
・絶縁基板、７・・・・封止部品、１１゜１２・・・・
スクリーンメッシュ。
代 理 人 大 岩 増 雄第１図
１１．１２： 又クソーシメヅシ５−
第３図
第４図
第５図
第６図
第７図1 is a 1-1 sectional view of FIG. 2, FIG. 2 is a plan view showing the solder mask according to the present invention, FIG. 3 is a sectional view showing the screen mesh pressed against the insulating substrate, and FIG. The figure is a plan view showing the state of printing on an insulating substrate using a solder mask.
The figure is a plan view showing a conventional solder mask, FIG. 6 is a sectional view taken along the VI-Vl line in FIG. FIG. 3 is a plan view showing a printed state of an insulating substrate using a solder mask. 1...Mask body, 4...Synthetic resin, 6...
・Insulating substrate, 7...Sealing parts, 11゜12...
screen mesh. Agent Masuo Oiwa Figure 1 11.12: Mata Kuso Shimezushi 5- Figure 3 Figure 4 Figure 5 Figure 6 Figure 7
Claims (1)
押し付けて半田印刷するための半田マスクにおいて、前
記スクリーンメッシュを各々が互いに異なる大小２つの
メッシュサイズをもつスクリーンメッシュで構成し、こ
のうち小さいメッシュサイズをもつスクリーンメッシュ
はメッシュの押付状態において前記封止部品を直接覆う
位置に位置付けられていることを特徴とする半田マスク
。In a solder mask for printing solder by pressing a screen mesh onto an insulating substrate having a sealing component, the screen mesh is composed of screen meshes each having two different mesh sizes, the smaller of which is the smaller mesh size. A solder mask characterized in that the screen mesh is positioned at a position directly covering the sealing component when the mesh is pressed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP247486A JPS62160290A (en) | 1986-01-09 | 1986-01-09 | Soldering mask |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP247486A JPS62160290A (en) | 1986-01-09 | 1986-01-09 | Soldering mask |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62160290A true JPS62160290A (en) | 1987-07-16 |
Family
ID=11530325
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP247486A Pending JPS62160290A (en) | 1986-01-09 | 1986-01-09 | Soldering mask |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62160290A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03104298A (en) * | 1989-09-19 | 1991-05-01 | Toyo Commun Equip Co Ltd | Coating of cream solder or the like |
| US5704286A (en) * | 1996-08-02 | 1998-01-06 | Kabushik Kaisha Toshiba | Screen printing apparatus |
| US6354200B1 (en) * | 1998-11-06 | 2002-03-12 | Ngk Insulators, Ltd. | Mask for screen printing, the method for producing same and circuit board produced by screen printing with such mask |
| WO2002080636A1 (en) * | 2001-03-30 | 2002-10-10 | Advanced Micro Devices, Inc. | Method of modulating surface mount technology solder volume to optimize reliability and fine pitch yield |
-
1986
- 1986-01-09 JP JP247486A patent/JPS62160290A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03104298A (en) * | 1989-09-19 | 1991-05-01 | Toyo Commun Equip Co Ltd | Coating of cream solder or the like |
| US5704286A (en) * | 1996-08-02 | 1998-01-06 | Kabushik Kaisha Toshiba | Screen printing apparatus |
| US6354200B1 (en) * | 1998-11-06 | 2002-03-12 | Ngk Insulators, Ltd. | Mask for screen printing, the method for producing same and circuit board produced by screen printing with such mask |
| US6794582B2 (en) | 1998-11-06 | 2004-09-21 | Ngk Insulators, Ltd. | Mask for screen printing, the method for producing same and circuit board produced by screen printing with such mask |
| WO2002080636A1 (en) * | 2001-03-30 | 2002-10-10 | Advanced Micro Devices, Inc. | Method of modulating surface mount technology solder volume to optimize reliability and fine pitch yield |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS62160290A (en) | Soldering mask | |
| JPH02155209A (en) | Chip part for surface mounting | |
| JPH0455334B2 (en) | ||
| JPH0233959A (en) | Lead frame for semiconductor device | |
| JPH04336490A (en) | Method for forming reflow solder | |
| JPS63250163A (en) | Semiconductor integrated circuit device | |
| JPH04147660A (en) | Package of electronic component and mounting structure thereof | |
| JPH01270325A (en) | Mask for potting seal | |
| JPH0498780A (en) | Ic socket | |
| JPH01181553A (en) | Side-brazed type ceramic board | |
| JPS59218797A (en) | Printed wiring circuit device | |
| JPS6350109A (en) | Filter circuit device for surface wave | |
| JPS5940787Y2 (en) | Solder electrode structure for connecting electronic components | |
| JP2530783Y2 (en) | Chip component mounting structure | |
| JPH0472651A (en) | Ic package | |
| KR0128532B1 (en) | Pcb of a voltage control oscilator | |
| JPH0419798Y2 (en) | ||
| JPS61251198A (en) | Mounting of flat package | |
| JPH09246715A (en) | Electronic part mounting method | |
| JPH02226709A (en) | J-lead-type surface mounting ic with chip capacitor | |
| JPH04299890A (en) | Packaging method for electronic parts | |
| JPS6367213A (en) | Method of taping chip part | |
| JPH03212989A (en) | Flexible board with double-sided pattern and its connecting body | |
| JPH01149402A (en) | Chip module | |
| JPH03218090A (en) | Electronic circuit device |