JPH01181553A - Side-brazed type ceramic board - Google Patents

Side-brazed type ceramic board

Info

Publication number
JPH01181553A
JPH01181553A JP407688A JP407688A JPH01181553A JP H01181553 A JPH01181553 A JP H01181553A JP 407688 A JP407688 A JP 407688A JP 407688 A JP407688 A JP 407688A JP H01181553 A JPH01181553 A JP H01181553A
Authority
JP
Japan
Prior art keywords
lead frame
ceramic substrate
metallized layer
type ceramic
ceramic board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP407688A
Other languages
Japanese (ja)
Inventor
Chihiro Ikeda
池田　千尋
Yoshiya Kudou
工藤　可哉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP407688A priority Critical patent/JPH01181553A/en
Publication of JPH01181553A publication Critical patent/JPH01181553A/en
Pending legal-status Critical Current

Links

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  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To improve the joint strength between a ceramic board and a lead frame by a method wherein the corner of the ceramic board is bevelled and the lead frame is bonded to a metallized layer which is formed on the side surface and the bevelled part of the substrate. CONSTITUTION:A metallized layer 4 is formed on a side surface 2 and a bevelled part 3 of a ceramic board 1. The metallized layer 4 is bonded to a lead frame 6 with bonding agent 5 made of solder material at the parts corresponding to the side surface 2 and the bevelled part 3. As the metallized layer 4 is provided not only on the side surface 2 but also on the bevelled part 3, the bonding agent 5 spread onto the bevelled part 3 during soldering or the like. Therefore, in order to peel the lead frame 6 from the board 1 by applying a force in the direction of the arrow A, a large force is required. With this constitution, the joint strength between the board and the lead frame can be improved.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明はＩＣパッケージ等に用いられるサイドブレー
ズ型セラミック基板、特にリードフレームの接合強度を
増大させたサイドブレーズ型セラミック基板に関するも
のである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a side blaze type ceramic substrate used for IC packages and the like, and particularly to a side blaze type ceramic substrate with increased bonding strength of a lead frame.

〔従来の技術〕[Conventional technology]

第２図は従来のサイドブレーズ型セラミック基板を示す
断面図である６図において、（１）はセラ・ミック基板
、（２）はその側面部、（３）はコーナ部を面取りして
形成した面取り部、（４）は側面部（２）に設けられた
メタライズ層、（５）はろう材からなる固着材で、リー
ドフレーム（６）を側面部（２）に接合している。Figure 2 is a cross-sectional view of a conventional side blaze type ceramic substrate. The lead frame (6) is joined to the side surface (2) by a chamfered portion, (4) a metallized layer provided on the side surface (2), and (5) a bonding material made of brazing material.

従来のサイドブレーズ型セラミック基板は上記のように
構成され、セラミック基板（１）の側面部（２）に設け
られたメタライズ層（４）とリードフレーム（６）とを
固着材（５）で接合している。A conventional side blaze type ceramic substrate is constructed as described above, in which the metallized layer (4) provided on the side surface (2) of the ceramic substrate (1) and the lead frame (6) are bonded using a bonding material (5). are doing.

〔発明が解決しようとする１１題〕 従来のサイドブレーズ型セラミック基板のろう付は部は
上記のように構成されているので、第２図における矢印
入方向の力に対し、セラミック基板（１）とリードフレ
ーム（６）との接合強度が小さいという欠点があった。[11 Problems to be Solved by the Invention] Since the conventional side blaze type ceramic substrate brazing part is constructed as described above, the ceramic substrate (1) There was a drawback that the bonding strength between the lead frame (6) and the lead frame (6) was low.

この発明は上記のような問題点を解消するためになされ
たもので、セラミック基板とリードフレームとの接合強
度を大きくしたサイドブレーズ型セラミック基板を得る
ことを目的とする。This invention was made to solve the above-mentioned problems, and an object of the present invention is to obtain a side blaze type ceramic substrate in which the bonding strength between the ceramic substrate and the lead frame is increased.

〔課題を解決するための手段〕[Means to solve the problem]

この発明に係わるサイドブレーズ型セラミック基板は、
コーナ部を面取りしたセラミック基板と、このセラミッ
ク基板の側面部および面取り部に設けられたメタライズ
層に固着材により接合されたリードフレームとを備えた
ものである。The side blaze type ceramic substrate according to the present invention includes:
This device includes a ceramic substrate with chamfered corners, and a lead frame bonded to a metallized layer provided on the side surfaces and chamfered portions of the ceramic substrate using a bonding material.

〔作　用〕[For production]

この発明におけるサイドブレーズ型セラミック基板は、
セラミック基板の側面部および面取り部にメタライズ層
を設けて、固着材によりリードフレームを接合している
ため２面取り部にも固着材が回りこみ、リードフレーム
をセラミック基板から引きはがすような力に対し１強度
を増大させる。The side blaze type ceramic substrate in this invention is
A metallized layer is provided on the sides and chamfered parts of the ceramic substrate, and the lead frame is bonded with an adhesive, so the adhesive wraps around the two chamfers, making it resistant to forces that would cause the lead frame to be peeled off from the ceramic substrate. 1 Increase intensity.

〔発明の実施例〕[Embodiments of the invention]

以下、この発明の一実施例を図について説明する。第１
図はこの発明の一実施例によるサイドブレーズ型セラミ
ック基板を示す断面図であり、図において、（１）〜（
６）は第２図と同一または相当部分を示す、メタライズ
層（４）はセラミック基板（１）の側面部（２）および
面取り部（３）に設けられ、この゛側面部（２）および
面取り部（３）に対応する部分で、ろう材からなる固着
材（５）によりメタライズ層（４）がリードフレーム（
６）に接合されている。An embodiment of the present invention will be described below with reference to the drawings. 1st
The figure is a sectional view showing a side blaze type ceramic substrate according to an embodiment of the present invention, and in the figure, (1) to (
6) shows the same or equivalent part as in FIG. At the part corresponding to part (3), the metallized layer (4) is attached to the lead frame (
6).

上記のように構成されたサイドブレーズ型セラミック基
板においては１面取り部（３）にもメタライズ層（４）
が設けられているため、固着材（５）がろう付は等の際
に面取り部（３）にまで回り込むことになる。従ってリ
ードフレーム（６）に第１図の矢印Ａ方向の力を加えた
場合１面取り部（３）内で。In the side blaze type ceramic substrate configured as above, the metallized layer (4) is also formed on the single chamfer (3).
Since this is provided, the fixing material (5) will wrap around the chamfered portion (3) during brazing, etc. Therefore, when a force is applied to the lead frame (6) in the direction of arrow A in FIG.

面取りした面の法線方向の分力成分が一様になるため、
リードフレーム（６）を基板（１）から引きはがすには
、第２図の場合と比較してより大きな力を必要とする。Since the force component in the normal direction of the chamfered surface is uniform,
In order to peel off the lead frame (6) from the substrate (1), a larger force is required compared to the case shown in FIG.

このため基板（１）とリードフレーム（６）との接合強
度が増す。Therefore, the bonding strength between the substrate (1) and the lead frame (6) increases.

なお、上記実施例では、メタライズ層（４）とリードフ
レーム（６）を接合するための固着材（５）にろう材を
用いたものを示したが、ろう材の代りに、導電性の樹脂
接着材やハンダ等を用いてもよい。In addition, in the above embodiment, a brazing material was used as the fixing material (5) for joining the metallized layer (4) and the lead frame (6), but instead of the brazing material, a conductive resin was used. Adhesives, solders, etc. may also be used.

〔発明の効果〕〔Effect of the invention〕

以上のように、この発明によれば、メタライズ層をセラ
ミック基板の側面部および面取り部に設けたので、リー
ドフレームをメタライズ層に固着材により接合した際に
、固着力が大きくなり、リードフレームがセラミック基
板からはがれにくくなるという効果がある。As described above, according to the present invention, since the metallized layer is provided on the side surface and the chamfered part of the ceramic substrate, when the lead frame is bonded to the metallized layer with the adhesive, the adhesion force is increased and the lead frame is This has the effect of making it difficult to peel off from the ceramic substrate.

【図面の簡単な説明】[Brief explanation of the drawing]

第１１はこの発明の一実施例によるサイドブレーズ型セ
ラミック基板を示す断面図、第２図は従来のサイドブレ
ーズ型セラミック基板を示す断面図である。 各図中、同一符号は同一または相当部分を示し、（１）
はセラミック基板、（２）は側面部、（３）は面取り部
、（４）はメタライズ層、（５）は固着材、（６）はリ
ードフレームである。　　　　　′11 is a sectional view showing a side blaze type ceramic substrate according to an embodiment of the present invention, and FIG. 2 is a sectional view showing a conventional side blaze type ceramic substrate. In each figure, the same reference numerals indicate the same or corresponding parts, (1)
(2) is a ceramic substrate, (2) is a side surface portion, (3) is a chamfered portion, (4) is a metallized layer, (5) is a bonding material, and (6) is a lead frame. ′

Claims (1)

【特許請求の範囲】[Claims] （１）コーナ部を面取りしたセラミック基板と、このセ
ラミック基板の側面部および面取り部に設けられたメタ
ライズ層に固着材により接合されたリードフレームとを
備えたことを特徴とするサイドブレーズ型セラミック基
板。(1) A side blaze type ceramic substrate characterized by comprising a ceramic substrate with chamfered corners and a lead frame bonded to a metallized layer provided on the side surfaces and chamfered portions of the ceramic substrate using a bonding material. .
JP407688A 1988-01-12 1988-01-12 Side-brazed type ceramic board Pending JPH01181553A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP407688A JPH01181553A (en) 1988-01-12 1988-01-12 Side-brazed type ceramic board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP407688A JPH01181553A (en) 1988-01-12 1988-01-12 Side-brazed type ceramic board

Publications (1)

Publication Number Publication Date
JPH01181553A true JPH01181553A (en) 1989-07-19

Family

ID=11574711

Family Applications (1)

Application Number Title Priority Date Filing Date
JP407688A Pending JPH01181553A (en) 1988-01-12 1988-01-12 Side-brazed type ceramic board

Country Status (1)

Country Link
JP (1) JPH01181553A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6400006B2 (en) 1998-07-28 2002-06-04 Infineon Technologies Ag Integrated component, composite element comprising an integrated component and a conductor structure, chip card, and method of producing the integrated component
WO2006077157A1 (en) * 2005-01-24 2006-07-27 Kiersch Composite Gmbh Arrangement for generating an electrical flow of current through carbon fibers

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6400006B2 (en) 1998-07-28 2002-06-04 Infineon Technologies Ag Integrated component, composite element comprising an integrated component and a conductor structure, chip card, and method of producing the integrated component
WO2006077157A1 (en) * 2005-01-24 2006-07-27 Kiersch Composite Gmbh Arrangement for generating an electrical flow of current through carbon fibers

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