JP3392337B2 - Mask for solder printing and method of manufacturing the same - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder printing mask for printing solder on a substrate on which a prefabricated component is mounted and a method for manufacturing the same.

[0002]

2. Description of the Related Art Recently, in order to achieve high-density mounting of electronic components, bare chips have been mounted on a substrate on which surface mounting components are mounted, using a chip-on-board mounting technique. In such a case, solder printing for surface-mounted components is performed before or after mounting the bare chip.

In general, since flux is scattered during solder reflow of surface-mounted components, if solder printing is performed before mounting a bare chip, the pads for connecting bare chips are contaminated, and the adhesiveness between the bare chip and the substrate (bonding adhesive strength or It is said that the bump adhesion strength) will decrease. 32 and 33 show a solder printing mask for performing solder printing after mounting a bare chip.

In the figure, a plate-shaped mask body 5 is arranged in close contact with a substrate 3 on which a bare chip 1 which is a preliminarily mounted component is mounted. An opening hole 5a is formed in the mask body 5 at a position corresponding to the bare chip 1.
A box-shaped protruding portion 7 protruding toward the side opposite to the substrate 3 is formed on a.

Printing holes 5b for solder printing are formed in the mask body 5 at positions corresponding to the pads 3a for soldering surface-mounted components formed on the substrate 3. In the solder printing mask described above, solder is printed on the substrate 3 as shown below. That is, first,
As shown in FIG. 32, the mask body 5 is placed in close contact with the substrate 3 at a predetermined position.

Next, as shown in FIG. 34, an elongated elastic squeegee 9 is arranged at one end 5c of the mask body 5 along the direction perpendicular to the printing direction P. On the mask body 5, cream solder 11 is placed on the side of the protruding portion 7 of the squeegee 9 along the longitudinal direction of the squeegee 9. Thereafter, as shown in FIG. 35, the squeegee 9 is moved in the printing direction P while being in contact with the mask body 5,
Along with this movement, the cream solder 11 moves on the mask body 5.

At this time, the cream solder 11 is filled 13 in the printing holes 5b on the mask body 5. Next, as shown in FIG. 36, the squeegee 9 is moved to the other end 5 d of the mask body 5, and the mask body 5 is separated from the substrate 3. Then, the cream solder 11 filled 13 in the printing hole 5b is spread on the substrate 3, and the solder printing is completed.

[0008]

However, in such a conventional solder printing mask, since the box-shaped protruding portion 7 is formed in the opening hole 5a of the mask body 5, as shown in FIG.
As shown in FIG. 7, when the squeegee 9 passes through the protruding portion 7, the squeegee 9 floats, which is a problem.

Therefore, as shown in FIG. 38, a non-contact area A where the squeegee 9 does not come into contact is formed on the mask body 5, and in this non-contact area A, the cream solder 11 cannot be filled 13 in the printing hole 5b. However, there is a problem that solder printing cannot be performed on the substrate 3. In addition, the non-contact area A
In addition, since the cream solder 11 cannot be printed, the component cannot be mounted in this area, and the mounting efficiency of the component cannot be improved.

The present invention has been made to solve the above-mentioned conventional problems, and a solder printing mask capable of reliably printing solder on a substrate on which a pre-mounted component such as a bare chip is mounted, and its manufacture. The purpose is to provide a method.

[0011]

According to another aspect of the present invention, there is provided a solder printing mask in which a printing hole for solder printing is formed in a plate-shaped mask main body which is arranged in close contact with the substrate, and the solder printing mask is formed on the substrate. A protruding part with a shape that covers the mounted parts to be mounted,
In a solder printing mask formed so as to project toward the side opposite to the substrate, a skirt that is inclined toward the substrate is formed around the protrusion, and the mask body is preliminarily attached.
While forming an opening hole at a position facing the part,
The protrusion is bonded around the opening hole of the mask body.
Of the resin film on the substrate side of the mask body.
The resin film at a position close to the opening hole on the surface.
It is characterized in that a concave portion to be joined is formed .

A solder printing mask according to a second aspect is provided on a substrate.
Solder printing on the plate-shaped mask body that is placed in close contact with the
Formed printing holes for and mounted on the board
The protruding part of the shape that covers the pre-attached parts
In the solder printing mask formed by protruding to
Around the protrusion, a skirt that inclines toward the substrate
Formed to face the prefabricated component of the mask body.
An opening hole in the
Formed by a resin film that is bonded around the opening of the main body.
At a position close to the opening hole of the mask body,
The mask body is formed by forming a recess to which the resin film is joined.
A plurality of the opening holes are formed in the
The opening holes are connected to each other .

[0013]

According to a third aspect of the present invention, there is provided a solder printing mask manufacturing method, wherein a plate-shaped mask main body closely attached to a substrate is provided.
Solder printing in which a printing hole for solder printing is formed, an opening hole is formed at a position facing a pre-mounted component mounted on the substrate, and a resin film is bonded to the mask body to cover the opening hole. In the method for manufacturing a mask for use in the method, a hole forming step of forming the printing hole and the opening hole in the mask body, a masking step of disposing a masking film between the mask body and the substrate, and the opening hole It is characterized by comprising a resin film forming step of forming a resin film on the masking film, and a separating step of separating the mask body having the resin film formed thereon from the masking film.

A method of manufacturing a solder printing mask according to a fourth aspect is the method of manufacturing a solder printing mask according to the third aspect , wherein in the hole forming step, a bonding portion of the mask body to which the resin film is bonded is formed. It is characterized in that a concave portion is formed.

(Operation) In the solder printing mask of claim 1, since the skirt that is inclined toward the substrate is formed around the protruding portion of the mask main body that is formed so as to cover the pre-attached component, the protruding portion is formed. A squeegee or the like, which has a gentle shape and moves on the protruding portion during solder printing, is prevented from rising from the mask body, and solder printing is reliably performed on the substrate.

Further , since the protruding portion is formed of the resin film bonded around the opening hole of the mask body, it is possible to match the protruding portion with the outer shape of the pre-mounted component.

For this reason, the protrusion has a flat shape similar to that of the pre-attached component, and the squeegee or the like can be moved more smoothly during solder printing. Further, since the concave portion to which the resin film is joined is formed at a position close to the opening hole of the mask body, the mask body and the resin film are brought into contact with each other over a wide area,
Bonded with high strength.

Further, since the recesses on the surface of the substrate side of the mask body that is located on the side opposite to the protruding direction of the resin film is formed, the bonding strength against peeling to the substrate of the resin film opposite side is high. In the solder printing mask according to claim 2 , since the recess is formed in a shape that connects the plurality of opening holes of the mask body to each other, the resin film bonded to each opening hole is integrated through the recess and is high. The mask body and the resin film are bonded to each other with strength.

In the method for manufacturing a solder printing mask according to claim 3 , a masking film is disposed between the mask body and the substrate in the masking step, and a resin is applied onto the masking film in the resin film forming step. Since the resin film can be formed by the above, the resin film having substantially the same outer shape as that of the pre-mounted component can be easily formed by a simple manufacturing process.

In the method for manufacturing a solder printing mask according to claim 4 , since the recess is formed in the hole forming step, the recess and the opening hole are formed in the same manufacturing step, and the manufacturing step is not complicated. The recess is easily formed.

[0022]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in detail below with reference to the drawings.

1 and 2 show a first embodiment of a solder printing mask of the present invention. In the figure, a plate-shaped mask body 25 made of, for example, stainless steel is arranged in close contact with the substrate 23 on which the bare chip 21 is mounted. An opening hole 25a is formed in the mask body 25 at a position corresponding to the bare chip 21.

The bare chip 21 is placed on the opening 25a.
A resin film 27 made of, for example, an epoxy resin is disposed so as to cover the covering portion 21a. Around the resin film 27, a skirt 27 that gently inclines toward the substrate 23.
a is formed, and the entire resin film 27 is formed smoothly along the covering portion 21 a of the bare chip 21.

The skirt 27a of the resin film 27 and the opening hole 25a of the mask body 25 are joined to each other. Further, in the mask body 25, a printing hole 25b for solder printing is formed at a position corresponding to the pad 23a for soldering of the surface mount component formed on the substrate 23.

In the solder printing mask described above, solder is printed on the substrate 23 as shown below. That is, first, as shown in FIG. 1, the mask body 25 is placed in close contact with the substrate 23 at a predetermined position. Next, as shown in FIG. 3, a long elastic squeegee 29 made of urethane resin or the like is arranged at one end 25c of the mask body 25 along the direction perpendicular to the printing direction P.

Further, on the mask body 25, the squeegee 2
The cream solder 31 is arranged on the resin film 27 side of 9 along the longitudinal direction of the squeegee 29. After this,
As shown in, the squeegee 29 is moved in the printing direction P while the tip of the squeegee 29 is in contact with the mask body 25, and the cream solder 31 moves on the mask body 25 with this movement.

With the movement of the squeegee 29, the cream solder 31 is filled 33 in the printing hole 25b on the mask body 25. At this time, as shown in FIG. 5, the squeegee 29 that has been moved onto the resin film 27 is deformed along the shape of the resin film 27, but the skirt portion 27 a that is gentle around the resin film 27.
Therefore, no gap is formed between the squeegee 29 and the resin film 27.

Therefore, the cream solder 31 is surely filled 33 in the printing holes 25b located on both sides of the resin film 27.
To be done. After this, as shown in FIG. 6, the squeegee 29 is moved to the other end 25 d of the mask body 25, and the mask body 25 is separated from the substrate 23. And the printing hole 25b
The cream solder 31 filled in 33 is spread on the substrate 23, and solder printing is completed.

In the solder printing mask configured as described above, the substrate 23 is provided around the resin film 27 of the mask main body 25 which is formed so as to cover the bare chip 21 which is the preliminarily attached component.
Since the skirt 27a that is inclined toward the
7 can be made into a gentle shape. Therefore, it is possible to prevent the squeegee 29 and the like that move on the resin film 27 during solder printing from floating from the mask body 25, and it is possible to reliably print solder on the substrate 23.

Further, since the projecting portion is formed by the resin film 27 bonded around the opening hole 25a of the mask main body 25, the shape of the resin film 27 is the bare chip 2 which is a pre-mounted component.
The outer shape of the first covering portion 21a can be easily adjusted. For this reason, the resin film 27 can be made flat to the same extent as the covering portion 21a of the bare chip 21, and the squeegee 29 and the like can be moved more smoothly during solder printing.

Further, a skirt 27a that is gently inclined is formed around the resin film 27, and the squeegee 29 and the resin film 27 are formed.
Since no gap is generated between the board and the board, the board can be generally used for other boards on which the bare chip 21 is not mounted. 7 and 8 show a second embodiment of the solder printing mask of the present invention.

In this embodiment, an annular recess 25e is formed around the opening hole 25a of the mask body 25. The resin film 27 is bonded to the mask body 25 so as to cover the recess 25e. In this embodiment as well, the same effect as in the above-described first embodiment can be obtained, but in this embodiment, the concave portion where the resin film 27 is bonded to a position close to the opening hole 25a of the mask body 25. Since 25e is formed, the mask body 25 and the resin film 27 can be brought into contact with each other over a wide area and can be joined with high strength.

FIG. 9 and FIG. 10 show a third embodiment (corresponding to claim 1 ) of the solder printing mask of the present invention. In this embodiment, the substrate 2 of the mask body 25
Recesses 25f extending outward from the four corners of the opening hole 25a are formed on the surface on the third side. Then, the resin film 27
Are arranged from the opening hole 25a to the concave portion 25f and are joined to the mask body 25.

In this embodiment as well, the same effects as those of the above-described first and second embodiments can be obtained, but in this embodiment, the mask main body 25 located on the side opposite to the protruding direction of the resin film 27. On the surface of the substrate 23 side of
Since f is formed, the bonding strength against peeling of the resin film 27 to the side opposite to the substrate 23 can be increased.

11 and 12 show a fourth embodiment (corresponding to claim 2 ) of the solder printing mask of the present invention. In this embodiment, a plurality of bare chips 21 are mounted on the substrate 23, and opening holes 25a are formed in the mask body 25 at positions corresponding to the bare chips 21. Further, the mask body 25 is provided with a groove-shaped recess 25g that connects the opening holes 25a to each other.

In this embodiment as well, the same effect as in the above-described second embodiment can be obtained, but in this embodiment, the recess 25g is formed in the mask main body 25 so that the plurality of opening holes 25a are mutually formed. Since the connecting film is formed, the resin film 27 bonded to each opening 25a is formed in the recess 2
It can be integrated through 5 g, and the mask body 25 and the resin film 27 can be bonded with high strength.

13 to 17 show a first embodiment (corresponding to claim 3) of the method for manufacturing a solder printing mask of the present invention. In this manufacturing method, a hole forming step, a masking step, a resin film forming step, and a detaching step are sequentially performed. That is, first, in the hole forming step, as shown in FIG. 13, the resist 35 is selectively placed on both surfaces of the mask body 25 made of, for example, stainless steel or the like.

Then, the mask body 25 is etched 25h by a corrosive liquid such as ferric chloride to form opening holes 25a and printing holes 25b. Next, in the masking step, as shown in FIG. 14, a masking film 37 made of, for example, a vinyl chloride film or the like is arranged on the substrate 23 on which the bare chip 21 is mounted in advance so as to cover the covering portion 21a of the bare chip 21. .

At this time, the masking film 37 is arranged in close contact with the bare chip 21, and the shape of the masking film 37 is made gentle along the inclination of the covering portion 21a of the bare chip 21.

Then, the mask body 25 is placed on the substrate 23 in a state of being in close contact with the masking film 37. Next, in the resin film forming step, as shown in FIG. 15, the dispenser 3 is placed in the opening hole 25a of the mask body 25.
9 and the like, for example, resin film material 2 such as epoxy resin
7a is applied.

The applied resin film material 27a spreads in the opening hole 25a along the inclination of the masking film 37. Application of the resin film material 27a is performed as shown in FIG.
The process is repeated until the resin film material 27a spreads uniformly in the opening hole 25a and reaches around the opening hole 25a of the mask body 25.

After that, the mask body 25 is left at room temperature to cure the resin film material 27a so that the resin film 27 is cured.
Thus, the mask body 25 and the resin film 27 are reliably joined together. Next, in the detaching step, as shown in FIG. 17, the resin film 27 bonded to the mask body 25 is detached from the masking film 37 and the substrate 23 together with the mask body 25.

At this time, since the masking film 37 is interposed between the resin film 27 and the substrate 23, the mask body 25 and the resin film 27 are easily separated from the substrate 23 and the covering portion 21a of the bare chip 21. . Then, the manufacturing process of the solder printing mask is completed. In the solder printing mask manufacturing method described above, the masking film 37 is arranged between the mask body 25 and the substrate 23 in the masking step, and the resin film material 27a is applied onto the masking film 37 in the resin film forming step. Since the resin film 27 is formed by the above, a simple manufacturing process
The covering portion 21a of the bare chip 21 which is an easily attached component
It is possible to form the resin film 27 having substantially the same outer shape.

18 to 20 show a second embodiment (corresponding to claim 4) of the method for manufacturing a solder printing mask of the present invention. In this embodiment, in the hole forming step, first, as shown in FIG. 18, etching 25h for forming the recess 25e is performed. Next, FIG.
As shown in FIG. 9, etching 25h is performed on the opening hole 25a and the printing hole 25b in a state where the recess 25e is masked by the resist 35.

Thereafter, a masking step and a resin film forming step are performed in the same manner as in the first embodiment of the method for manufacturing a solder printing mask, and a resin film is formed as shown in FIG. Then, the detachment process is performed, and the solder printing mask is completed. Also in this embodiment, the same effect as that of the first embodiment of the method for manufacturing a solder printing mask described above can be obtained, but in this embodiment,
Since the recess 25e is formed in the hole forming step, the recess 25e and the opening hole 25a can be formed in the same manufacturing process, and the recess 2 can be easily formed without complicating the manufacturing process.
5e can be formed.

21 and 22 show a third embodiment (corresponding to claim 4) of the method for manufacturing a solder printing mask of the present invention. In this embodiment, in the hole forming step, first, as shown in FIG. 21, etching 25h for forming the recess 25f is performed. Next, as in the second embodiment of the method for manufacturing a solder printing mask, the opening 25a and the printing hole 25b are etched 25 with the recess 25f masked by the resist 35.
h is performed.

After this, a masking step and a resin film forming step are carried out to form a resin film as shown in FIG. Here, the applied resin film 27 (resin film material 27
The resin film material 27a is uniformly spread on the masking film 37 in the opening 25a by the time (a) flows into the recess 25f, so that the resin film 27 is formed to have a predetermined film thickness.

Then, the detaching step is performed to complete the solder printing mask. Also in this embodiment, the same effect as that of the second embodiment of the method for manufacturing the solder printing mask described above can be obtained, but in this embodiment, the resin film material 27a is recessed in the recess 25f during the resin film forming step. Since the resin film material 27a is made to spread evenly on the masking film 37 of the opening hole 25a before it flows into, the film thickness of the resin film 27 and the variation in the film thickness are not easily influenced by the coating conditions, The resin film 27 can be formed with a predetermined quality.

23 to 26 show a fourth embodiment (corresponding to claim 4) of the method for manufacturing a solder printing mask of the present invention. In this embodiment, in the hole forming step, first, as shown in FIG.
Etching 25h is performed to form g. Next, while the recess 25g is masked by the resist 35, the opening hole 25a and the printing hole 25b are etched, and as shown in FIGS.
5 is completed.

Thereafter, a masking step and a resin film forming step are carried out in the same manner as in the method for manufacturing the solder printing mask described above, and a resin film is formed as shown in FIG. Then, the detachment process is performed, and the solder printing mask is completed. Also in this embodiment, the same effects as those of the second and third embodiments of the method for manufacturing the solder printing mask described above can be obtained.

Further, since the resin film 27 formed in the plurality of opening holes 25a is integrally formed by the recess 25g,
Even when a plurality of bare chips 21 are mounted on the substrate 23, the solder printing mask can be easily manufactured without complicating the manufacturing process.

27 to 29 show a fifth embodiment (corresponding to claim 4) of the method for manufacturing a solder printing mask of the present invention. In this embodiment, in the hole forming step, first, as shown in FIG.
Only the resist 35 on one surface side is selectively opened, and the recess 25e, the opening hole 25a, and the printing hole 25b are etched 25h from one surface side of the mask body 25.

Next, as shown in FIG. 28, only the recess 25e is masked by the resist 35. After this, as shown in FIG. 29, the opening hole 25a and the printing hole 25b are etched to complete the mask body 25. In this embodiment, the same effect as that of the method for manufacturing the solder printing mask described above can be obtained, but in this embodiment, the opening hole 25 is formed at the same time when the recess 25e is etched.
Since a and a part of the printing hole 25b are etched, the etching time of the opening hole 25a and the printing hole 25b performed after the recess 25e is completed can be greatly shortened.

30 and 31 show a sixth embodiment (corresponding to claim 4) of the method for manufacturing a solder printing mask of the present invention. In this embodiment, in the hole forming step, as shown in FIG. 30, the resists 35 on both sides of the mask body 25 are selectively opened, and the recesses 25e, the opening holes 25a and the printing holes 2 are formed from both sides of the mask body 25.
5b is etched 25h at the same time.

Then, as shown in FIG. 31, the recess 25e, the opening 25a and the printing hole 25b are simultaneously formed by one etching process. Also in this embodiment, the same effects as those of the method for manufacturing the solder printing mask described above can be obtained, but in this embodiment, the recess 2 is formed.
Since 5e, the opening hole 25a and the printing hole 25b are simultaneously formed by one etching process, the hole forming process can be greatly simplified as compared with the conventional case.

The first of the solder printing masks described above
In the above embodiment, an example in which the resin film 27 is formed of an epoxy resin has been described, but the present invention is not limited to this embodiment, and for example, a vinyl chloride film or the like may be attached. Further, in the first embodiment of the method for manufacturing a solder printing mask described above, an example in which the masking film 37 is formed of a vinyl chloride film has been described, but the present invention is not limited to this embodiment, and for example, It may be formed of a polyolefin film, a polyester film, or the like.

Further, in the above-described method for manufacturing a solder printing mask, the example in which the opening hole 25a and the printing hole 25b are opened by etching to form the mask main body 25 has been described, but the present invention is not limited to this embodiment. However, the mask main body 25 may be formed by depositing metal in a portion other than the opening holes 25a and the printing holes 25b by a method generally called an additive method.

[0059]

In the solder printing mask according to the first aspect of the present invention, since the skirt that is inclined toward the substrate is formed around the protruding portion of the mask body that is formed so as to cover the preliminarily attached component, the protruding portion is gentle. It can be shaped. Therefore, it is possible to prevent a squeegee or the like that moves on the protruding portion during solder printing from rising from the mask body, and it is possible to reliably print solder on the substrate.

[0060] Further, since the protruding portion is formed of a resin film joined to the periphery of the opening hole of the mask body, it is possible to align the projecting portion to the outer shape of the tipping part, easily. For this reason, the protrusion can be made flat to the same extent as the preliminarily attached component, and the squeegee or the like can be moved more smoothly during solder printing.

Further, since the concave portion to which the resin film is joined is formed at a position close to the opening hole of the mask body, the mask body and the resin film can be joined in a wide area, and the joining can be performed with high strength. You can In particular, since the concave portion is formed on the substrate-side surface of the mask body located on the side opposite to the protruding direction of the resin film, it is possible to increase the bonding strength against peeling of the resin film on the side opposite to the substrate.

In the solder printing mask of the second aspect , since the recess is formed in a shape that connects the plurality of openings formed in the mask body to each other, the resin film bonded to each opening is formed through the recess. It can be integrated, and the mask body and the resin film can be bonded with high strength. The method for manufacturing a solder printing mask according to claim 3 , wherein in the masking step, a masking film is arranged between the mask body and the substrate, and in the resin film forming step, resin is applied onto the masking film to form a resin film. Since it is possible to form the resin film, it is possible to easily form the resin film having substantially the same outer shape as that of the preliminarily mounted component by a simple manufacturing process.

In the method for manufacturing the solder printing mask according to the fourth aspect , since the recess is formed in the hole forming step, the recess and the opening hole can be formed in the same manufacturing step, which complicates the manufacturing step. Instead, the recess can be easily formed.

[Brief description of drawings]

FIG. 1 is a sectional view showing a first embodiment of a solder printing mask of the present invention.

FIG. 2 is a top view of FIG.

FIG. 3 is a top view showing a state in which cream solder is printed using the solder printing mask of the first embodiment.

FIG. 4 is a top view showing a state in which cream solder is printed using the solder printing mask of the first embodiment.

FIG. 5 is a cross-sectional view showing a state where the squeegee is deformed along the resin film.

FIG. 6 is a top view showing a state where printing of cream solder is completed.

FIG. 7 is a sectional view showing a second embodiment of a solder printing mask of the present invention.

8 is a top view of FIG. 7. FIG.

FIG. 9 is a sectional view showing a third embodiment of a solder printing mask of the present invention.

10 is a top view of FIG. 9. FIG.

FIG. 11 is a sectional view showing a fourth embodiment of a solder printing mask of the present invention.

12 is a top view of FIG. 11. FIG.

FIG. 13 is a cross-sectional view showing a hole forming step of the first embodiment of the method for manufacturing a solder printing mask of the present invention.

FIG. 14 is a cross-sectional view showing the masking step of the first embodiment of the method for manufacturing a solder printing mask of the present invention.

FIG. 15 is a cross-sectional view showing a resin film forming step of the first embodiment of the method for manufacturing a solder printing mask of the present invention.

FIG. 16 is a cross-sectional view showing a state in which a resin film material is filled in an opening hole.

FIG. 17 is a cross-sectional view showing the detaching step of the first embodiment of the method for manufacturing a solder printing mask of the present invention.

FIG. 18 is a cross-sectional view showing a state in which a recess is being etched in the hole forming step of the second embodiment of the method for manufacturing a solder printing mask of the present invention.

FIG. 19 is a cross-sectional view showing a hole forming step of the second embodiment of the method for manufacturing a solder printing mask of the present invention.

FIG. 20 is a cross-sectional view showing a state where the resin film forming step of the second embodiment of the method for manufacturing a solder printing mask of the present invention has been completed.

FIG. 21 is a cross-sectional view showing a state where a recess is being etched in the hole forming step of the third embodiment of the method for manufacturing a solder printing mask of the present invention.

FIG. 22 is a cross-sectional view showing a state where the resin film forming step of the third embodiment of the method for manufacturing a solder printing mask of the present invention is completed.

FIG. 23 is a cross-sectional view showing a state in which a recess is being etched in the hole forming step of the fourth embodiment of the method for manufacturing a solder printing mask of the present invention.

FIG. 24 is a cross-sectional view showing a state where the hole forming step of the fourth embodiment of the method for manufacturing a solder printing mask of the present invention has been completed.

FIG. 25 is a top view of FIG. 24.

FIG. 26 is a cross-sectional view showing a state where the resin film forming step of the fourth embodiment of the method for manufacturing a solder printing mask of the present invention has been completed.

FIG. 27 is a cross-sectional view showing a state in which one side of the mask body is being etched in the hole forming step of the fifth embodiment of the method for manufacturing a solder printing mask of the present invention.

FIG. 28 is a cross-sectional view showing a state where etching of one surface of the mask body is completed.

FIG. 29 is a cross-sectional view showing a state in which an opening hole and a printing hole are formed in the hole forming step of the fifth embodiment of the method for manufacturing a solder printing mask of the present invention.

FIG. 30 is a sectional view showing a hole forming step of the sixth embodiment of the method for manufacturing the solder printing mask of the present invention.

FIG. 31 is a cross-sectional view showing a state where the hole forming step of the sixth embodiment of the method for manufacturing a solder printing mask of the present invention is completed.

FIG. 32 is a sectional view showing a conventional solder printing mask.

FIG. 33 is a top view of FIG. 32.

FIG. 34 is a top view showing a state in which cream solder is printed.

FIG. 35 is a top view showing a state where cream solder is printed.

FIG. 36 is a top view showing a state where printing of cream solder has been completed.

FIG. 37 is a cross-sectional view showing a deformed squeegee.

FIG. 38 is a top view showing a non-contact area.

[Explanation of symbols]

21 Bare chip (preliminary component) 23 board 25 mask body 25a open hole 25b printing hole 25e, 25f, 25g recess 27 Resin film (protruding part) 27a Hem

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Claims (4)

(57) [Claims] 1. A printing hole for solder printing is formed in a plate-shaped mask body closely arranged on a substrate, and
In a solder printing mask formed by projecting a projection part having a shape to cover a pre-mounted component mounted on the board, the skirt tilting toward the board around the projection part. Forming a portion and opening the mask body at a position facing the prefabricated component.
A hole is formed and the protrusion is formed on the mask body.
It is formed of a resin film bonded around the opening hole, and is formed in the opening hole in the surface of the mask body on the substrate side.
A solder printing mask, characterized in that a recess to which the resin film is bonded is formed at a position close to each other . 2. A plate-shaped mass closely arranged on a substrate.
In addition to forming printing holes for solder printing on the main body,
A protrusion having a shape that covers the pre-mounted component mounted on the board
Is a solder mark formed by projecting to the opposite side from the substrate.
In the printing mask, a skirt that slopes toward the substrate is provided around the protrusion.
And opening the mask body at a position facing the prefabricated component.
A hole is formed and the protrusion is formed on the mask body.
It is formed of a resin film bonded around the opening hole, and the resin is formed at a position near the opening hole of the mask body.
Forming a recess to which the oil film is joined and forming a plurality of the opening holes in the mask body,
Further, the solder printing mask is characterized in that the recesses connect the opening holes to each other . 3. A printing hole for solder printing is formed in a plate-shaped mask body closely arranged on a substrate, and
In a method of manufacturing a solder printing mask, which comprises forming an opening hole at a position facing a pre-mounted component mounted on the substrate, and bonding a resin film to the mask main body so as to cover the opening hole, A hole forming step of forming the printing hole and the opening hole, a masking step of disposing a masking film between the mask body and the substrate, and forming a resin film on the masking film of the opening hole. A method for manufacturing a solder printing mask, comprising: a resin film forming step; and a detaching step of detaching the mask body on which the resin film is formed from the masking film. 4. The method for manufacturing a solder printing mask according to claim 3 , wherein in the hole forming step, a recess is formed in a joint portion of the mask main body to which the resin film is joined. Solder printing mask manufacturing method.