JPH0275171A - Lead type module - Google Patents
Lead type moduleInfo
- Publication number
- JPH0275171A JPH0275171A JP63224921A JP22492188A JPH0275171A JP H0275171 A JPH0275171 A JP H0275171A JP 63224921 A JP63224921 A JP 63224921A JP 22492188 A JP22492188 A JP 22492188A JP H0275171 A JPH0275171 A JP H0275171A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- pad
- board
- section
- pads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 7
- 230000008878 coupling Effects 0.000 abstract 1
- 238000010168 coupling process Methods 0.000 abstract 1
- 238000005859 coupling reaction Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Multi-Conductor Connections (AREA)
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明はリード型モジュールに関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a lead type module.
従来、この種のリード型モジュールは第２図（ａ）。 Conventionally, this type of lead type module is shown in FIG. 2(a).
（ｂ）、（ｃ）に示すようにモジュール基板２３にＩＣ
２４を表面実装し、該基板２３の周縁にリード取付用パ
ッド２１を設けている。一方リード２２は第２図（ｄ）
に示すようにその先端が２叉状になっている。該リード
２２はその２叉状先端で基板２３のパッド２】を挟み付
け、リード２２とパッド２１とをハンダ付けしていた。As shown in (b) and (c), the IC is mounted on the module board 23.
24 is surface mounted, and lead attachment pads 21 are provided on the periphery of the substrate 23. On the other hand, the lead 22 is shown in FIG. 2(d).
As shown in the figure, its tip is bifurcated. The lead 22 had its forked tip sandwiching the pad 2 of the substrate 23, and the lead 22 and the pad 21 were soldered.
上述した従来のリート型モジュールは第２図（ａ）。 The conventional REET type module mentioned above is shown in FIG. 2(a).
（ｂ）、（ｃ）に示すようにハンダメツキ等を施したパ
ッド２１をリード２２で挟み込み、ハンダデイプ等で該
パッド２１と該リード２２をハンダ付けしているため、
リード２２の挟込部２２ａの面積が小さくなるほどリー
ド２２の引張り強度が弱くなり、リード２２がパッド２
１より脱落しやすいという欠点があった。As shown in (b) and (c), the pad 21 which has been soldered or otherwise plated is sandwiched between the leads 22, and the pad 21 and the lead 22 are soldered with solder dip or the like.
The smaller the area of the sandwiched portion 22a of the lead 22, the weaker the tensile strength of the lead 22 becomes.
It had the disadvantage that it was more likely to fall off than 1.
本発明の目的は前記課題を解決したリード型モジュール
を提供することにある。An object of the present invention is to provide a lead type module that solves the above problems.
上述した従来のリード型モジュールに対し、本発明はリ
ードとパッドとの結合度を増大させるという相違点を有
する。The present invention differs from the conventional lead-type module described above in that it increases the degree of bonding between leads and pads.
前記目的を達成するため、本発明は基板上にＩＣを表面
実装し、該基板の縁部にリード取付用パッドを設けてな
るリード型モジュールにおいて、前記リード取付用パッ
ドに凹部を形成し、該凹部に、リードに設けた楔部を嵌
合保持させたものである。To achieve the above object, the present invention provides a lead type module in which an IC is surface mounted on a substrate and a lead attachment pad is provided on the edge of the substrate, in which a recess is formed in the lead attachment pad, and a recess is formed in the lead attachment pad. A wedge portion provided on the lead is fitted and held in the recess.
以下、本発明の一実施例を図により説明する。 Hereinafter, one embodiment of the present invention will be described with reference to the drawings.
第１図（ａ）〜（，１）は本発明の一実施例を示す図で
ある。FIGS. 1(a) to 1(,1) are diagrams showing an embodiment of the present invention.
図において、モジュール基板１３にはＩＣ１４を表面実
装し、該基板１３の縁部にリード取付用パッド１１゜１
１を設けてあり、該パッド１１に凹部１１ａを設けであ
る。一方、リード１２の先端は２叉状に形成してあり、
２叉状挟込部１２ａの一片に楔部１２ｂを形成しである
。In the figure, an IC 14 is surface-mounted on a module board 13, and a lead attachment pad 11°1 is attached to the edge of the board 13.
1 is provided, and the pad 11 is provided with a recess 11a. On the other hand, the tip of the lead 12 is formed into a bifurcated shape.
A wedge portion 12b is formed on one piece of the bifurcated sandwiching portion 12a.
リード１２の２叉状挟込部１２ａ、 １．２ａにて基板
１３のパッド１１を挟み込んで該リード１２の楔部１２
ｂをパッド１１の凹部１１ａに嵌合保持させ、リード１
２とパッド１１とをハンダ付けする。The pad 11 of the substrate 13 is sandwiched between the two-pronged sandwiching portions 12a and 1.2a of the lead 12 to form the wedge portion 12 of the lead 12.
b is fitted and held in the recess 11a of the pad 11, and the lead 1
2 and pad 11 are soldered.
従来の場合、リードの引張り強度はハンダの接着性及び
パッド１１とリード１２との接着性により決定されるが
、本発明によれば、ハンダ付けされるリート１２とパッ
ド１１とは相互に嵌合する凹部１１ａと楔部］２ｂとに
より結合しているため、リードの引張りに対してリード
抜けがなくなり、リードの引張り強度を増大できる。In the conventional case, the tensile strength of the lead is determined by the adhesion of the solder and the adhesion between the pad 11 and the lead 12, but according to the present invention, the lead 12 and the pad 11 to be soldered fit into each other. Since the recessed portion 11a and the wedge portion 2b are connected to each other, the lead does not come off when the lead is pulled, and the tensile strength of the lead can be increased.
以上説明したように本発明はハンダ付けされるパッドと
リードとを凹凸結合させるため、リードの抜けを防止し
てリードの引張強度を増大できるとともに、リート強度
を強くできるという効果を有する。As described above, the present invention has the effect of preventing the lead from coming off and increasing the tensile strength of the lead, as well as increasing the lead strength, since the pad to be soldered and the lead are joined in a concave-convex manner.
第１図（ａ）は本発明の一実施例を示す平面図、第１図
（ｂ）は第１図（ａ）の１部拡大図、第１図（ｃ）は同
側面図、第１図（（１）は本発明に係るリードを示す側
面図、第２図（ａ）は従来例を示す平面図、第２図（ｂ
）は第２図（ａ）の■部拡大図、第２図（ｃ）は同側面
図、第２図（ｄ）は従来例を示す側面図である。FIG. 1(a) is a plan view showing one embodiment of the present invention, FIG. 1(b) is a partially enlarged view of FIG. 1(a), FIG. 1(c) is a side view of the same, and FIG. ((1) is a side view showing the lead according to the present invention, FIG. 2(a) is a plan view showing the conventional example, FIG. 2(b)
2(c) is a side view of the same, and FIG. 2(d) is a side view showing a conventional example.
Claims (1)
ド取付用パッドを設けてなるリード型モジュールにおい
て、前記リード取付用パッドに凹部を形成し、該凹部に
、リードに設けた楔部を嵌合保持させたことを特徴とす
るリード型モジュール。(1) In a lead type module in which an IC is surface-mounted on a substrate and a lead attachment pad is provided on the edge of the substrate, a recess is formed in the lead attachment pad, and a lead is provided in the recess. A lead-type module characterized by a wedge portion that is fitted and held.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63224921A JPH0275171A (en) | 1988-09-08 | 1988-09-08 | Lead type module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63224921A JPH0275171A (en) | 1988-09-08 | 1988-09-08 | Lead type module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0275171A true JPH0275171A (en) | 1990-03-14 |
Family
ID=16821255
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63224921A Pending JPH0275171A (en) | 1988-09-08 | 1988-09-08 | Lead type module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0275171A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05226555A (en) * | 1992-02-17 | 1993-09-03 | Nec Corp | Hybrid integrated circuit device |
| JPH0567007U (en) * | 1992-02-19 | 1993-09-03 | 太陽誘電株式会社 | Hybrid integrated circuit device |
-
1988
- 1988-09-08 JP JP63224921A patent/JPH0275171A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05226555A (en) * | 1992-02-17 | 1993-09-03 | Nec Corp | Hybrid integrated circuit device |
| JPH0567007U (en) * | 1992-02-19 | 1993-09-03 | 太陽誘電株式会社 | Hybrid integrated circuit device |
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