JPS6213260A - Solder foiling device - Google Patents

Solder foiling device

Info

Publication number
JPS6213260A
JPS6213260A JP15167085A JP15167085A JPS6213260A JP S6213260 A JPS6213260 A JP S6213260A JP 15167085 A JP15167085 A JP 15167085A JP 15167085 A JP15167085 A JP 15167085A JP S6213260 A JPS6213260 A JP S6213260A
Authority
JP
Japan
Prior art keywords
solder foil
solder
press
foil
joined
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15167085A
Other languages
Japanese (ja)
Inventor
Ryuichiro Mori
隆一郎 森
Takao Tokunaga
徳永　孝雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP15167085A priority Critical patent/JPS6213260A/en
Publication of JPS6213260A publication Critical patent/JPS6213260A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To cause no generation of a solder foil by providing the solder foil pressure fitting implement having the plane part to press the solder foil to be press-fitted with its whole face. CONSTITUTION:A solder foil pressure fitting implement 7 provides the plane part 8 to press the whole face of the solder foil at the part press-fitting a solder foil 3. The whole face of the solder foil 3 sucked by the press-fitting implement 7 is pressed by the plane part 8 onto a lead frame 4. Accordingly no floating is caused on the solder foil 3 for the frame 4. Then after melting the solder foil 3 the frame 4 and the body 6 to be joined are joined by placing the body 6 to be joined (semiconductor element) on a melted solder layer 3a. In this case due to no hole being caused inside the solder layer 3a no defect part is caused as in the past.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は１例えば、半導体素子をリードフレームに半
田接合するために、半田箔をリードフレーム番こ圧接す
る如き半田箔を基材に圧接する装置に関するものである
。[Detailed Description of the Invention] [Industrial Application Field] This invention relates to 1. For example, in order to solder-bond a semiconductor element to a lead frame, a solder foil is pressure-bonded to a base material, such as a solder foil is pressure-bonded to a lead frame board. It is related to the device.

〔従来の技術〕[Conventional technology]

第３図は、従来の半田箔付装置の半田箔圧接部の外観斜
視図であり、半田箔圧接部（１）は円柱形状をなし、半
田箔吸着用孔［２）を備えている。FIG. 3 is an external perspective view of a solder foil pressure welding part of a conventional solder foil attaching device. The solder foil pressure welding part (1) has a cylindrical shape and is provided with a solder foil adsorption hole [2].

第４図は従来の半田箔付装置の使用法を示す断面図で、
まず、第４図Ａに示すように半田箔圧接部（１）で吸着
した半田箔（３）を基材であるリードフレーム（４）の
上に置き、その半田箔（３）の一部を押えてリードフレ
ーム（４）に圧接する。次いで、第４図Ｂに示すように
半田箔圧接部（１）は離脱させた後、半田箔（３）を昇
温溶融させ、半田層（３ｍ）を形成し、第４図Ｃに示す
ように、その上に被接合物である半〔発明か解決しよう
とする問題点〕 従来の半田箔付装置では、半田箔（３）の一部のみ従っ
て、半田箔（３）を溶融させて形成する半田層（３ａ）
内に第４図Ｂに示すような空孔（５）を生じ、半導体素
子（６）の接着した後にも、この空孔（５）は残り。Figure 4 is a cross-sectional view showing how to use a conventional solder foil attachment device.
First, as shown in Fig. 4A, the solder foil (3) adsorbed by the solder foil pressure welding part (1) is placed on the lead frame (4) which is the base material, and a part of the solder foil (3) is Press it and press it against the lead frame (4). Next, as shown in Fig. 4B, the solder foil pressure-welded part (1) is separated, and then the solder foil (3) is heated and melted to form a solder layer (3 m), as shown in Fig. 4C. [Problem to be solved by the invention] In the conventional solder foil application device, only a part of the solder foil (3) is melted and formed on the solder foil (3). solder layer (3a)
Holes (5) as shown in FIG. 4B are formed inside the substrate, and these holes (5) remain even after the semiconductor element (6) is bonded.

接合に欠陥部分を生じ、るという問題点がある。There is a problem in that defective parts are generated in the bonding.

この発明は以上のような問題点を解消するためになされ
たもので、半田箔の浮きを生じさせない半田箔付装置を
得ることを目的としている。This invention has been made to solve the above-mentioned problems, and aims to provide a solder foil applying device that does not cause solder foil to float.

〔問題点を解決するための手段〕[Means for solving problems]

この発明に係る半田箔付装置では半田箔をその全面にお
いて押える平板部を設けたものである。The solder foil applying device according to the present invention is provided with a flat plate portion that presses the solder foil on its entire surface.

〔作　用〕[For production]

この発明における半田箔付装置では圧接すべき半田箔を
全面で押える平板部を設けたので、半田箔を圧接したと
きに浮きを生じさせない。Since the solder foil applying device according to the present invention is provided with a flat plate portion that presses the solder foil to be welded with its entire surface, no floating occurs when the solder foil is welded under pressure.

〔発明の実施例〕[Embodiments of the invention]

第１図はこの発明の実施例を示す外観斜視図で第２図は
１本発明の一実施例の使用方法を示す断面図で、ます、
第２図Ａに示すように、半田箔圧接具（７）で吸着した
半田箔（３）をリードフレーム（４）の上に平板部（８
）で、その全面に押えるので、リードフレーム（４）　
Ｉｃ対して、半田箔（３）は浮きを生じない。次に、第
２図Ｂに示すように半田箔（３）を溶融させても、上記
のように半田箔（３）の浮き上がりが無いので、半田層
（３ａ）中に空孔は生じない。従って、第２図Ｃに示す
ように、半導体素子（６）を接合後も上記のように半田
層（３ａ）中に空孔が生じていないので、従来のような
欠陥部分は生じない。Fig. 1 is an external perspective view showing an embodiment of the present invention, and Fig. 2 is a sectional view showing how to use the embodiment of the present invention.
As shown in Figure 2A, the solder foil (3) adsorbed by the solder foil pressure welding tool (7) is placed on the flat plate part (8) on the lead frame (4).
) to press the entire surface of the lead frame (4).
In contrast to Ic, the solder foil (3) does not float. Next, even if the solder foil (3) is melted as shown in FIG. 2B, since the solder foil (3) does not rise as described above, no voids are generated in the solder layer (3a). Therefore, as shown in FIG. 2C, even after the semiconductor element (6) is bonded, no voids are generated in the solder layer (3a) as described above, so that no defective portion is generated as in the conventional case.

〔発明の効果〕〔Effect of the invention〕

以上のように、この全明番こよれは、半田箔圧接具に平
板部を設け、半田箔を全面圧接するように構成したので
、空孔という欠陥の無い半田接合部を得られる効果かあ
る。As mentioned above, this Zen-Aiban Koyore has the effect of obtaining a solder joint without defects such as holes because the solder foil pressure welding tool is provided with a flat plate part and the solder foil is pressure-welded over the entire surface. .

【図面の簡単な説明】[Brief explanation of drawings]

第１図はこの発明の一実施例を示す斜視図、第２図Ａ−
Ｃはこの実施例の使用方法を示す断面図、第３図は従来
装置の半田圧接部を示す斜視図、第４図Ａ−Ｃはこの従
来装置の使用方法を示す断面図である。 図において、（３）は半田箔、（４）は基材（リードフ
レーム）　、　（６）は被接合物（半導体素子）　、（
７）は半田箔圧接具、（８）は平板部である。 なお１図中同一符号は同一、または相当部分を示す。Fig. 1 is a perspective view showing one embodiment of the present invention, Fig. 2A-
C is a cross-sectional view showing how to use this embodiment, FIG. 3 is a perspective view showing the solder pressure welding part of the conventional device, and FIGS. 4A-C are cross-sectional views showing how to use this conventional device. In the figure, (3) is the solder foil, (4) is the base material (lead frame), (6) is the object to be bonded (semiconductor element), (
7) is a solder foil pressure welding tool, and (8) is a flat plate part. Note that the same reference numerals in Figure 1 indicate the same or equivalent parts.

Claims (1)

【特許請求の範囲】[Claims] （１）被接合物を基材上の半田接合するために、予め上
記基材上に半田箔をその全面において押え圧接する平板
部を有する半田箔圧接具を備えたことを特徴とする半田
箔付装置。(1) A solder foil characterized by being equipped with a solder foil pressure welding tool having a flat plate portion that presses and presses the solder foil on the entire surface of the base material in advance in order to solder join the objects to be welded on the base material. attached device.
JP15167085A 1985-07-10 1985-07-10 Solder foiling device Pending JPS6213260A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15167085A JPS6213260A (en) 1985-07-10 1985-07-10 Solder foiling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15167085A JPS6213260A (en) 1985-07-10 1985-07-10 Solder foiling device

Publications (1)

Publication Number Publication Date
JPS6213260A true JPS6213260A (en) 1987-01-22

Family

ID=15523670

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15167085A Pending JPS6213260A (en) 1985-07-10 1985-07-10 Solder foiling device

Country Status (1)

Country Link
JP (1) JPS6213260A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01235339A (en) * 1988-02-22 1989-09-20 E I Du Pont De Nemours & Co Pick-up tool for die-bonding adhesive

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5198651A (en) * 1975-02-26 1976-08-31 Fukugobanno seizohoho
JPS5513831A (en) * 1978-07-14 1980-01-31 Fujitsu Ltd Pattern checking method
JPS5811098A (en) * 1981-07-15 1983-01-21 Toshiba Corp Controller for flow rate of aeration air in sewage treating plant

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5198651A (en) * 1975-02-26 1976-08-31 Fukugobanno seizohoho
JPS5513831A (en) * 1978-07-14 1980-01-31 Fujitsu Ltd Pattern checking method
JPS5811098A (en) * 1981-07-15 1983-01-21 Toshiba Corp Controller for flow rate of aeration air in sewage treating plant

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01235339A (en) * 1988-02-22 1989-09-20 E I Du Pont De Nemours & Co Pick-up tool for die-bonding adhesive

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