JP3579973B2 - Stepped dam frame and electronic component mounting substrate - Google Patents

Stepped dam frame and electronic component mounting substrate Download PDF

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Publication number
JP3579973B2
JP3579973B2 JP19427195A JP19427195A JP3579973B2 JP 3579973 B2 JP3579973 B2 JP 3579973B2 JP 19427195 A JP19427195 A JP 19427195A JP 19427195 A JP19427195 A JP 19427195A JP 3579973 B2 JP3579973 B2 JP 3579973B2
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Prior art keywords
resin
glass
electronic component
glass cloth
frame
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JPH0923042A (en
Inventor
隆司 田垣
仁 丸山
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Ibiden Co Ltd
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Ibiden Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]

Description

【０００１】
【発明の属する技術分野】
本発明は，ガラスファイバーのバリが発生しない段付きダム枠及び，該段付きダム枠を用いた電子部品搭載用基板に関する。
【０００２】
【従来の技術】
従来，電子部品搭載用基板には，絶縁用の樹脂基板が用いられている。図４に示すごとく，樹脂基板９は，ガラスファイバーの束９１０を格子状に織ったガラスクロス９１，及びガラスクロス９１に含浸させた樹脂９２よりなる。かかる樹脂基板９は，例えば，ザグリ加工により，凹状の段部９５を有する枠穴９６を形成して，電子部品搭載用基板のダム枠として用いられる。この枠穴９６の中には，電子部品搭載用基板に電子部品を搭載した後に，封止用樹脂が充填され，封止用キャップにより被覆される。また，枠穴９６の上方に設けた凹状の段部９５は，例えば，封止用キャップを位置決めし，嵌め込むための段部である。
【０００３】
【発明が解決しようとする課題】
しかしながら，上記樹脂基板に凹状の段部９５を形成した場合には，段部９５の底面９５０にガラスクロス９１が露出して，ガラスファイバーのバリ９９が発生することがあった。このバリ９９は，電子部品の搭載を妨げる場合がある。また，ボンディングワイヤーにより電子部品とボンディングパッドとを接続する際の接続不良をもたらすおそれがある。更に，封止用樹脂と封止用キャップとの接着強度の低下という問題を発生させる場合がある。
【０００４】
本発明はかかる従来の問題点に鑑み，ガラスファイバーのバリの発生がない段付きダム枠，及び該段付きダム枠を用いた電子部品搭載用基板を提供しようとするものである。
【０００５】
【課題を解決するための手段】
本発明は，ガラスファイバーの束を格子状に織ったガラスクロス，及び該ガラスクロスに含浸させた樹脂よりなる樹脂基板に，凹状の段部を有する枠穴を設けてなる段付きダム枠において，
上記段部の底面は，ガラスクロスの表面又は各ガラスクロスの間隙において，ガラスクロスの平面方向と平行に形成されて，ガラスファイバーの量が少なく、かつ樹脂の量が多い層である樹脂のリッチな樹脂リッチ層に形成されていることを特徴とする段付きダム枠にある。
【０００６】
上記樹脂基板は，ガラスクロスに樹脂を含浸したものである。具体的には，樹脂基板は，１枚のガラスクロス，又は２枚以上のガラスクロスの積層体に，樹脂を含浸したものである。
上記樹脂としては，例えば，エポキシ系樹脂，ポリイミド系樹脂，又はビスマレイミドトリアジン系樹脂を用いることができる。
【０００７】
上記樹脂基板には，凹状の段部を有する枠穴が設けられている。そして，段部の底面は，樹脂のリッチな樹脂リッチ層に形成されている。樹脂リッチ層は，ガラスファイバーの量が少なく，かつ樹脂の量が多い層である。かかる樹脂リッチ層は，例えば，ガラスクロスの表面，また各ガラスクロスの間隙に存在する。
【０００８】
段部の底面は，ガラスクロスの表面又は各ガラスクロスの間隙において，ガラスクロスの平面方向と平行に形成されている。これにより，段部の底面がガラスクロスと交差することはなく，段部の底面全体に樹脂リッチ層を露出させることができる。そのため，段部の底面にガラスファイバーのバリが発生することはない。
上記段部は，例えば，ザグリ加工により形成される。
【０００９】
次に，本発明の段付きダム枠の作用について説明する。
本発明の段付きダム枠においては，段部の底面が，樹脂のリッチな樹脂リッチ層に形成されている。そのため，段部の底面にガラスクロスが露出せず，ガラスファイバーのバリが発生することはない。それ故，ガラスファイバー等に起因する異物の発生が減少する。
【００１０】
上記段付きダム枠は，例えば，電子部品搭載用基板における電子部品を搭載する搭載部を囲む枠部材として使用することができる。かかる使用例としては，例えば，電子部品を搭載するための搭載部を有する絶縁基板と，上記搭載部の上方において凹状の段部を有する枠穴を形成した段付きダム枠とよりなる電子部品搭載用基板において，
上記段付きダム枠は，ガラスファイバーの束を格子状に織ったガラスクロス，及びガラスクロスに含浸させた樹脂よりなる樹脂基板であって，
上記段部の底面は，ガラスクロスの表面又は各ガラスクロスの間隙において，ガラスクロスの平面方向と平行に形成されて，ガラスファイバーの量が少なく、かつ樹脂の量が多い層である樹脂のリッチな樹脂リッチ層に形成されていることを特徴とする電子部品搭載用基板がある。
【００１１】
上記段部には，例えば，搭載部を封止用樹脂により封止した後に，封止用キャップが嵌め込まれる。
【００１２】
次に，本発明の電子部品搭載用基板の作用について説明する。
本発明の電子部品搭載用基板は，上記の段付きダム枠を用いているため，搭載部の上方にガラスファイバーのバリが発生することがなく，ガラスファイバー等に起因する異物の発生が減少する。そのため，バリ，異物が電子部品の搭載を妨げることはない。それ故，円滑に電子部品の搭載を行なうことができる。また，電子部品とボンディングパッドとをボンディングワイヤーにより確実に接続することができる。更に，段部の底面上の封止用樹脂と封止用キャップとの接着強度が向上する。
【００１３】
上記段付きダム枠は，上記搭載部を囲む枠部材として使用することができる他，例えば，プリント配線板の回路部材として使用することもできる。
【００１４】
【実施形態例】
本発明の実施形態例にかかる段付きダム枠及び電子部品搭載用基板について，図１〜図３を用いて説明する。
本例の段付きダム枠４は，図１に示すごとく，樹脂基板３に，凹状の段部５を有する枠穴４５を設けたものである。樹脂基板３は，図２（ｂ）に示すごとく，ガラスファイバーの束１０を格子状に織ったガラスクロス１と，ガラスクロス１に含浸させた樹脂２とよりなる。
段部５の底面５０は，樹脂２のリッチな樹脂リッチ層６に形成されている。
【００１５】
樹脂基板３は，図２に示すごとく，２枚以上のガラスクロス１を積層した積層体に樹脂２を含浸したものである。ガラスクロス１の表面，また各ガラスクロス１の間隙には，樹脂リッチ層６が存在している。
段部５の底面５０は，各ガラスクロス１の間隙において，ガラスクロス１の平面方向と平行に形成されている。
【００１６】
樹脂リッチ層６は，樹脂基板３の厚み方向に対して，等間隔に存在する。そのため，ソルダーレジスト膜３１の表面から一定の深さＡの位置にザグリ加工を施すことによって，段部５の底面５０を樹脂リッチ層６に形成することができる。本例において，段部５の底面５０の深さＡは，０．４０５ｍｍである。
樹脂基板３の上面は，ソルダーレジスト膜３１により被覆されている。
【００１７】
上記段付きダム枠４は，図３に示すごとく，電子部品搭載用基板７における搭載部７８を囲む枠部材として用いられる。即ち，電子部品搭載用基板７は，電子部品７９を搭載するための搭載部７８を有する２枚の絶縁基板７７と，搭載部７８の上方において凹状の段部５を有する枠穴４５を形成した段付きダム枠４とよりなる。
【００１８】
凹状の搭載部７８は，絶縁基板７７を貫通する搭載穴７８１と，その下方を被覆する放熱板７５とより構成されている。
絶縁基板７７の表面には，配線パターン７７１が形成されている。また，搭載穴７８１の壁面には，環状のめっき膜７８２が形成されている。
尚，２枚の絶縁基板７７の間，上方の絶縁基板７７と段付きダム枠４との間，下方の絶縁基板７７と放熱板７５との間は，それぞれ接着材７７９，７７８，７５１により接着されている。
【００１９】
搭載部７８の底面である放熱板７５の上には，電子部品７９がダイボンド材７８３により接着される。電子部品７９は，ボンディングワイヤー７９１により，配線パターン７７１の先端に形成したボンディングパッド７７２と電気的に接続される。その後，搭載部７８及び枠穴４５の中には，封止用樹脂が充填される。枠穴４５上方の段部５には，封止用キャップ８が嵌め込まれる。
【００２０】
次に，本例の作用効果について説明する。
本例の段付きダム枠４においては，図１に示すごとく，段部５の底面５０が，樹脂２のリッチな樹脂リッチ層６に形成されている。そのため，段部の底面５０にガラスクロスが露出せず，ガラスファイバーのバリが発生することはない。それ故，ガラスファイバー等に起因する異物の発生が減少する。
【００２１】
尚，ザグリ加工により段部５の底面５０に対して直角に切断された外周面５１には，ガラスクロス１１が露出する場合がある。しかし，段部５の外周面５１には，ガラスファイバーの束１０の切断面が露出するだけである。従って，段部の外周面５１においては，ガラスファイバーのバリは発生しない。
【００２２】
また，図３に示すごとく，電子部品搭載用基板７は，上記段付きダム枠４を用いているため，搭載部７８の上方にガラスファイバーのバリが発生することはない。そのため，バリ及び異物が電子部品７９の搭載を妨げることはない。それ故，円滑に電子部品の搭載を行なうことができる。また，電子部品７９とボンディングパッド７７２とをボンディングワイヤー７９１により確実に接続することができる。更に，段部５の底面５０上の封止用樹脂と封止用キャップ８との接着強度が向上する。
【００２３】
【発明の効果】
本発明によれば，ガラスファイバーのバリの発生がない段付きダム枠，及び該段付きダム枠を用いた電子部品搭載用基板を提供することができる。
【図面の簡単な説明】
【図１】実施形態例である段付きダム枠の断面図。
【図２】実施形態例における，樹脂基板の斜視図（ａ），及び斜面図（ａ）の要部拡大斜視図（ｂ）。
【図３】実施形態例である電子部品搭載用基板の断面図。
【図４】従来例の問題点を示す説明図。
【符号の説明】
１．．．ガラスクロス，
１０．．．ガラスファイバーの束，
２．．．樹脂，
３．．．樹脂基板，
４．．．段付きダム枠，
４５．．．枠穴，
５．．．段部，
５０．．．底面，
６．．．樹脂リッチ層，
７．．．電子部品搭載用基板，[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a stepped dam frame in which burrs of glass fiber do not occur, and an electronic component mounting substrate using the stepped dam frame.
[0002]
[Prior art]
Conventionally, a resin substrate for insulation has been used as a substrate for mounting electronic components. As shown in FIG. 4, the resin substrate 9 is made of a glass cloth 91 in which a bundle of glass fibers 910 is woven in a lattice, and a resin 92 impregnated in the glass cloth 91. This resin substrate 9 is used as a dam frame of an electronic component mounting substrate by forming a frame hole 96 having a concave step 95 by, for example, counterboring. After the electronic component is mounted on the electronic component mounting substrate, the frame hole 96 is filled with a sealing resin and covered with a sealing cap. The concave step 95 provided above the frame hole 96 is, for example, a step for positioning and fitting the sealing cap.
[0003]
[Problems to be solved by the invention]
However, when the concave step 95 is formed on the resin substrate, the glass cloth 91 is exposed on the bottom surface 950 of the step 95, and the glass fiber burr 99 may be generated. The burrs 99 may hinder the mounting of electronic components. In addition, there is a possibility that a connection failure may occur when the electronic component and the bonding pad are connected by the bonding wire. Further, there is a case where a problem that the adhesive strength between the sealing resin and the sealing cap is reduced is caused.
[0004]
SUMMARY OF THE INVENTION The present invention has been made in view of the above-described conventional problems, and has as its object to provide a stepped dam frame in which glass fiber burrs do not occur, and an electronic component mounting board using the stepped dam frame.
[0005]
[Means for Solving the Problems]
The present invention relates to a stepped dam frame comprising a glass cloth in which a bundle of glass fibers is woven in a lattice shape, and a resin substrate made of a resin impregnated in the glass cloth, provided with a frame hole having a concave step.
The bottom surface of the step portion is formed in parallel with the plane direction of the glass cloth at the surface of the glass cloth or at the gap between the glass cloths, so that the resin rich layer is a layer having a small amount of glass fiber and a large amount of resin. A step-shaped dam frame characterized by being formed in a resin-rich layer.
[0006]
The resin substrate is obtained by impregnating a glass cloth with a resin. Specifically, the resin substrate is obtained by impregnating one glass cloth or a laminate of two or more glass cloths with a resin.
As the resin, for example, an epoxy resin, a polyimide resin, or a bismaleimide triazine resin can be used.
[0007]
The resin substrate is provided with a frame hole having a concave step. The bottom surface of the step is formed in a resin-rich resin-rich layer. The resin-rich layer is a layer having a small amount of glass fiber and a large amount of resin. Such a resin-rich layer exists, for example, on the surface of the glass cloth and in the gap between the glass cloths.
[0008]
The bottom surface of the stepped portion, in the surface or gaps of the glass cloth glass cloth, that is parallel to the planar direction of the glass cloth. Thus, the bottom surface of the step does not cross the glass cloth, and the resin-rich layer can be exposed on the entire bottom surface of the step. Therefore, no burrs of the glass fiber are generated on the bottom surface of the step portion.
The step is formed, for example, by counterboring.
[0009]
Next, the operation of the stepped dam frame of the present invention will be described.
In the stepped dam frame of the present invention, the bottom surface of the step is formed in a resin-rich resin-rich layer. For this reason, the glass cloth is not exposed on the bottom surface of the step portion, and burrs of the glass fiber do not occur. Therefore, the generation of foreign matters due to glass fibers and the like is reduced.
[0010]
The stepped dam frame can be used, for example, as a frame member surrounding a mounting portion for mounting an electronic component on the electronic component mounting board. As an example of such a use, for example, an electronic component mounting comprising an insulating substrate having a mounting portion for mounting an electronic component and a stepped dam frame having a frame hole having a concave stepped portion above the mounting portion. Board for
The stepped dam frame is a resin substrate made of a glass cloth in which a bundle of glass fibers is woven in a lattice, and a resin impregnated in the glass cloth.
The bottom surface of the step portion is formed in parallel with the plane direction of the glass cloth at the surface of the glass cloth or at the gap between the glass cloths, so that the resin rich layer is a layer having a small amount of glass fiber and a large amount of resin. There is an electronic component mounting substrate characterized by being formed on a simple resin-rich layer.
[0011]
For example, a sealing cap is fitted into the step portion after the mounting portion is sealed with a sealing resin.
[0012]
Next, the operation of the electronic component mounting board of the present invention will be described.
Since the electronic component mounting board of the present invention uses the above-described stepped dam frame, no glass fiber burrs are generated above the mounting portion, and the generation of foreign matter due to the glass fiber or the like is reduced. . Therefore, burrs and foreign matter do not hinder the mounting of the electronic component. Therefore, the electronic components can be mounted smoothly. Further, the electronic component and the bonding pad can be reliably connected by the bonding wire. Further, the adhesive strength between the sealing resin and the sealing cap on the bottom surface of the step is improved.
[0013]
The stepped dam frame can be used not only as a frame member surrounding the mounting portion, but also as a circuit member of a printed wiring board, for example.
[0014]
Embodiment Example
A stepped dam frame and an electronic component mounting board according to an embodiment of the present invention will be described with reference to FIGS.
As shown in FIG. 1, the stepped dam frame 4 of this example is provided with a frame hole 45 having a concave step 5 in the resin substrate 3. As shown in FIG. 2B, the resin substrate 3 is composed of a glass cloth 1 in which a bundle of glass fibers 10 is woven in a lattice, and a resin 2 impregnated in the glass cloth 1.
The bottom surface 50 of the step 5 is formed in a resin-rich layer 6 of the resin 2.
[0015]
As shown in FIG. 2, the resin substrate 3 is obtained by impregnating the laminated body in which two or more glass cloths 1 are laminated with the resin 2. A resin-rich layer 6 exists on the surface of the glass cloth 1 and between the glass cloths 1.
The bottom surface 50 of the step 5 is formed in the gap between the glass cloths 1 in parallel with the plane direction of the glass cloths 1.
[0016]
The resin-rich layers 6 are present at regular intervals in the thickness direction of the resin substrate 3. Therefore, the bottom surface 50 of the step 5 can be formed on the resin-rich layer 6 by performing spot facing at a position at a certain depth A from the surface of the solder resist film 31. In this example, the depth A of the bottom surface 50 of the step 5 is 0.405 mm.
The upper surface of the resin substrate 3 is covered with a solder resist film 31.
[0017]
As shown in FIG. 3, the stepped dam frame 4 is used as a frame member that surrounds the mounting portion 78 of the electronic component mounting board 7. That is, the electronic component mounting board 7 has two insulating substrates 77 having a mounting portion 78 for mounting an electronic component 79 and a frame hole 45 having a concave step 5 above the mounting portion 78. It consists of a stepped dam frame 4.
[0018]
The concave mounting portion 78 includes a mounting hole 781 penetrating through the insulating substrate 77 and a radiator plate 75 covering the lower portion.
On the surface of the insulating substrate 77, a wiring pattern 771 is formed. An annular plating film 782 is formed on the wall surface of the mounting hole 781.
The two insulating substrates 77, the upper insulating substrate 77 and the stepped dam frame 4, and the lower insulating substrate 77 and the heat radiating plate 75 are bonded with adhesives 779, 778 and 751, respectively. Have been.
[0019]
An electronic component 79 is adhered to the bottom surface of the mounting portion 78 on the heat radiating plate 75 by a die bonding material 783. The electronic component 79 is electrically connected to a bonding pad 772 formed at the tip of the wiring pattern 771 by a bonding wire 791. After that, the mounting portion 78 and the frame hole 45 are filled with a sealing resin. A sealing cap 8 is fitted into the step 5 above the frame hole 45.
[0020]
Next, the operation and effect of this example will be described.
In the stepped dam frame 4 of this example, as shown in FIG. 1, the bottom surface 50 of the step portion 5 is formed on the resin-rich layer 6 of the resin 2. For this reason, the glass cloth is not exposed on the bottom surface 50 of the step portion, and burrs of the glass fiber do not occur. Therefore, the generation of foreign matters due to glass fibers and the like is reduced.
[0021]
The glass cloth 11 may be exposed on the outer peripheral surface 51 cut at right angles to the bottom surface 50 of the step portion 5 by counterbore processing. However, only the cut surface of the glass fiber bundle 10 is exposed on the outer peripheral surface 51 of the step portion 5. Therefore, no flash of the glass fiber occurs on the outer peripheral surface 51 of the step portion.
[0022]
Further, as shown in FIG. 3, since the electronic component mounting substrate 7 uses the above-described stepped dam frame 4, no glass fiber burrs are generated above the mounting portion 78. Therefore, burrs and foreign substances do not hinder the mounting of the electronic component 79. Therefore, the electronic components can be mounted smoothly. Further, the electronic component 79 and the bonding pad 772 can be reliably connected by the bonding wire 791. Further, the adhesive strength between the sealing resin on the bottom surface 50 of the step 5 and the sealing cap 8 is improved.
[0023]
【The invention's effect】
According to the present invention, it is possible to provide a stepped dam frame in which burrs of glass fiber are not generated, and an electronic component mounting board using the stepped dam frame.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of a stepped dam frame according to an embodiment.
FIG. 2 is a perspective view (a) of a resin substrate and an enlarged perspective view (b) of a main part of an oblique view (a) in the embodiment.
FIG. 3 is a cross-sectional view of the electronic component mounting board according to the embodiment;
FIG. 4 is an explanatory diagram showing a problem of the conventional example.
[Explanation of symbols]
1. . . Glass cloth,
10. . . Glass fiber bundle,
2. . . resin,
3. . . Resin substrate,
4. . . Stepped dam frame,
45. . . Frame hole,
5. . . Step,
50. . . Bottom,
6. . . Resin rich layer,
7. . . Electronic component mounting board,

Claims (2)

ガラスファイバーの束を格子状に織ったガラスクロス，及び該ガラスクロスに含浸させた樹脂よりなる樹脂基板に，凹状の段部を有する枠穴を設けてなる段付きダム枠において，
上記段部の底面は，ガラスクロスの表面又は各ガラスクロスの間隙において，ガラスクロスの平面方向と平行に形成されて，ガラスファイバーの量が少なく、かつ樹脂の量が多い層である樹脂のリッチな樹脂リッチ層に形成されていることを特徴とする段付きダム枠。In a stepped dam frame in which a frame hole having a concave step portion is provided in a glass cloth in which a bundle of glass fibers is woven in a lattice shape and a resin substrate made of a resin impregnated in the glass cloth,
The bottom surface of the step portion is formed in parallel with the plane direction of the glass cloth at the surface of the glass cloth or at the gap between the glass cloths, so that the resin rich layer is a layer having a small amount of glass fiber and a large amount of resin. A stepped dam frame characterized by being formed in a simple resin-rich layer. 電子部品を搭載するための搭載部を有する絶縁基板と，上記搭載部の上方において凹状の段部を有する枠穴を形成した段付きダム枠とよりなる電子部品搭載用基板において，
上記段付きダム枠は，ガラスファイバーの束を格子状に織ったガラスクロス，及びガラスクロスに含浸させた樹脂よりなる樹脂基板であって，
上記段部の底面は，ガラスクロスの表面又は各ガラスクロスの間隙において，ガラスクロスの平面方向と平行に形成されて，ガラスファイバーの量が少なく、かつ樹脂の量が多い層である樹脂のリッチな樹脂リッチ層に形成されていることを特徴とする電子部品搭載用基板。An electronic component mounting board comprising: an insulating substrate having a mounting portion for mounting electronic components; and a stepped dam frame having a frame hole having a concave step portion above the mounting portion.
The stepped dam frame is a resin substrate made of a glass cloth in which a bundle of glass fibers is woven in a lattice, and a resin impregnated in the glass cloth.
The bottom surface of the step portion is formed in parallel with the plane direction of the glass cloth at the surface of the glass cloth or at the gap between the glass cloths, so that the resin rich layer is a layer having a small amount of glass fiber and a large amount of resin. An electronic component mounting substrate characterized by being formed on a simple resin-rich layer.
JP19427195A 1995-07-05 1995-07-05 Stepped dam frame and electronic component mounting substrate Expired - Lifetime JP3579973B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19427195A JP3579973B2 (en) 1995-07-05 1995-07-05 Stepped dam frame and electronic component mounting substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19427195A JP3579973B2 (en) 1995-07-05 1995-07-05 Stepped dam frame and electronic component mounting substrate

Publications (2)

Publication Number Publication Date
JPH0923042A JPH0923042A (en) 1997-01-21
JP3579973B2 true JP3579973B2 (en) 2004-10-20

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Country Link
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